Shopping cart

Subtotal: $67.62

1 item

Checkout

You saved $0.00

Price

Qty.

Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies Product image

$67.62 $65.00

Update Remove

9780070366480 / 0070366489

U.S. Edition

Brand New

By John H. Lau, Yi-Hsin Pao

McGraw-Hill Professional Publishing - Lau, John H.

Ships from Marketplace Seller: Alibris Marketplace

Marketplace items are not eligible for free shipping.

Empty cart Save cart

Subtotal: $67.62

1 item

Checkout

Rewards members receive:

+68 +68