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Pulsed and Pulsed Bias Sputtering Principles and Applications

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ISBN-10: 140207543X

ISBN-13: 9781402075438

Edition: 2003

Authors: Edward V. Barnat, Toh-Ming Lu

List price: $263.00
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Pulsed and pulsed bias sputter deposition are advanced thin deposition techniques that allow one to produce high quality metal and insulating films. In the pulsed sputtering case, the technique allows one to deposit insulating films while minimizing adverse effects associated with charge accumulation on the target in the reactive deposition mode. In the pulsed bias sputtering case, one can deposit metal films on an insulating substrate while controlling the degree of charging on the substrate. One of the important aspects of these techniques is to be able to control the film properties such as density, orientation, texture, and morphology during deposition. This book provides basic…    
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Book details

List price: $263.00
Copyright year: 2003
Publisher: Springer
Publication date: 9/30/2003
Binding: Hardcover
Pages: 157
Size: 6.25" wide x 9.25" long x 0.50" tall
Weight: 0.946
Language: English

Overview of Sputtering for Technological Applications
Plasma-Surface Interactions
Charging of Insulating Surfaces
Overview of the Monograph
Basic Plasma Phenomenon
The Plasma State
Basic Plasma Structure
Plasma Sources Used for Sputter Deposition
Direct Current (DC) Sources
Alternating Current (AC) Sources
Response of a Plasma to an Applied Bias
General Considerations and Approximations
Quasi-Static Approximation of the Sheath
Breakdown of the Quasi-Static Approximation
Transient Nature of the Sheath
Sinusoidal Waveform
Quasi-Static Regime
Transient Sheath Regime
Pulsed Waveform
Definition of the Pulse
Quasi-Static Response of the System to an Applied Pulse
Approximated Predictions of Energy Spectra
Higher Frequency Response of the System to the Pulsed Waveform
Comparison Between Sinusoidal and Pulsed Waveforms
Application of a Pulsed Waveform to a Target: Pulsed Reactive Sputtering
Application of a Pulse for ARC Suppression (Predictions)
Application of a Pulse to Reactive Sputtering (Practice)
Application of a Pulsed Waveform to a Substrate: Pulsed Bias Sputtering
Considerations for Pulsed Biasing of the Substrate
Observed Flux of Charge to a Pulsed Substrate
Application of a Pulsed Bias to Film Growth
Conclusions and Future Directions
Future Directions