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Microelectronic Packaging

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ISBN-10: 041531190X

ISBN-13: 9780415311908

Edition: 2005

Authors: Tetsuya Osaka, M. Datta, J. Walter Schultze

List price: $280.00
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Description:

Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, then discusses chip metallization topics. It explores key aspects of chip-package interconnect technologies, and analyzes packages, boards, and connectors. It concludes with…    
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Book details

List price: $280.00
Copyright year: 2005
Publisher: CRC Press LLC
Publication date: 12/20/2004
Binding: Hardcover
Pages: 568
Size: 6.25" wide x 9.25" long x 1.25" tall
Weight: 1.980
Language: English

Introduction
Chip metallization
Chip-package interconnect
Packages and PC boards
Processing tools