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Microelectronics Packaging Handbook Technology

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ISBN-10: 0412084511

ISBN-13: 9780412084515

Edition: 2nd 1997

Authors: Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein

List price: $245.00
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This set explains the latest in microelectronic design methods, modelling tools, simulation techniques and manufacturing procedures. It discusses state-of-the-art packages that meet the needs of increasingly dense and fast microcircuitry.
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Book details

List price: $245.00
Edition: 2nd
Copyright year: 1997
Publisher: Springer
Publication date: 1/31/1997
Binding: Hardcover
Pages: 664
Size: 6.75" wide x 9.50" long x 1.50" tall
Weight: 2.332
Language: English