Skip to content

Area Array Package Design

Spend $50 to get a free movie!

ISBN-10: 0071737731

ISBN-13: 9780071737739

Edition: N/A

Authors: Ken Gilleo

List price: $49.95
Blue ribbon 30 day, 100% satisfaction guarantee!
Out of stock
what's this?
Rush Rewards U
Members Receive:
Carrot Coin icon
XP icon
You have reached 400 XP and carrot coins. That is the daily max!

Description:

This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.
Customers also bought

Book details

List price: $49.95
Publisher: McGraw-Hill Companies, The
Binding: Paperback
Pages: 220
Size: 7.50" wide x 9.25" long x 0.46" tall
Weight: 0.858
Language: English