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Area Array Package Design

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ISBN-10: 0071737731

ISBN-13: 9780071737739

Edition: N/A

Authors: Ken Gilleo

List price: $49.95
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This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.
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Book details

List price: $49.95
Publisher: McGraw-Hill Companies, The
Binding: Paperback
Pages: 220
Size: 7.50" wide x 9.25" long x 0.46" tall
Weight: 0.858
Language: English