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| Preface | |
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| Basics of Printed Circuit Boards | |
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| Connectivity in Electronic Equipment | |
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| Advantages of Printed Circuit Boards | |
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| Evolution of Printed Circuit Boards | |
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| Components of a Printed Circuit Board | |
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| Classification of Printed Circuit Boards | |
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| Single-sided Printed Circuit Boards | |
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| Double-sided Printed Circuit Boards | |
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| Multi-layer Boards | |
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| Rigid and Flexible Printed Circuit Boards | |
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| Manufacturing of Basic Printed Circuit Boards | |
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| Single-sided Boards | |
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| Double-sided Plated Through-holes | |
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| Multi-layer Boards | |
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| Flexible Boards | |
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| Challenges in Modern PCB Design and Manufacture | |
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| Major Market Drivers for the PCB Industry | |
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| PCBs with Embedded Components | |
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| Standards on Printed Circuit Boards | |
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| Useful Standards | |
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| Electronic Components | |
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| Basics of Electronic Components | |
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| Active vs Passive Components | |
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| Discrete vs Integrated Circuits | |
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| Component Leads | |
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| Polarity in Components | |
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| Component Symbols | |
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| Resistors | |
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| Types of Resistors | |
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| Packages | |
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| Characteristics | |
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| Variable Resistors or Potentiometers | |
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| Light-dependent Resistors (LDRs) | |
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| Thermistors | |
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| Capacitors | |
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| Types of Capacitors | |
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| Packages | |
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| Performance of Capacitors | |
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| Variable Capacitors | |
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| Inductors | |
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| Diodes | |
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| Special Types of Diodes | |
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| Zener Diode | |
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| Varactor Diode | |
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| Varistor | |
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| Light Emitting Diodes (LED) | |
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| Photodiode | |
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| Tunnel Diode (TD) | |
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| Transistors | |
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| Bipolar Transistors | |
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| Power Transistors | |
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| Darlington Transistors | |
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| Field-effect Transistors | |
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| Insulated Gate Bipolar Transistor (IGBT) | |
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| Transistor Type Numbers | |
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| Thyristors | |
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| Integrated Circuits (ICs) | |
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| Linear Integrated Circuits | |
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| Operational Amplifiers (OP-AMP) | |
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| Three-terminal Voltage Regulator | |
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| Digital Integrated Circuits | |
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| Logic Circuits | |
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| Microprocessors | |
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| Semiconductor Memories | |
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| Random Access Memory | |
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| Read Only Memory | |
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| Microcontrollers | |
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| Surface Mount Devices | |
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| Surface Mount Devices | |
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| Surface Mounting Semiconductor Packages | |
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| Packaging of Passive Components as SMDs | |
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| Heat Sinks | |
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| Transformer | |
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| Relays | |
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| Connectors | |
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| Useful Standards | |
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| Layout Planning and Design | |
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| Reading Drawings and Diagrams | |
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| Block Diagram | |
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| Schematic Diagram | |
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| General PCB Design Considerations | |
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| Important Design Elements | |
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| Important Performance Parameters | |
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| Mechanical Design Considerations | |
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| Types of Boards | |
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| Board Mounting Techniques | |
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| Board Guiding and Retaining | |
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| Input/Output Terminations | |
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| Board Extraction | |
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| Testing and Servicing | |
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| Mechanical Stress | |
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| Board Thickness | |
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| Important Specifications and Standards | |
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| Electrical Design Considerations | |
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| Conductor Dimensions | |
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| Resistance | |
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| Capacitance Considerations | |
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| Inductance of PCB Conductors | |
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| High Electrical Stresses | |
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| Conductor Patterns | |
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| Component Placement Rules | |
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| Conductor Width and Thickness | |
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| Conductor Spacing | |
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| Conductor Shapes | |
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| Conductor Routing and Locations | |
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| Supply and Ground Conductors | |
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| Fabrication and Assembly Considerations | |
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| Environmental Factors | |
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| Thermal Considerations | |
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| Contamination | |
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| Shock and Vibration | |
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| Cooling Requirements and Packaging Density | |
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| Heat Sinks | |
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| Packaging Density | |
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| Package Style and Physical Attributes | |
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| Layout Design | |
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| Grid Systems | |
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| Layout Scale | |
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| Layout Sketch/Design | |
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| Layout Considerations | |
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| Materials and Aids | |
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| Land Requirements | |
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| Manual Layout Procedure | |
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| Layout Methodology | |
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| Layout Design Checklist | |
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| General Considerations | |
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| Electrical Considerations | |
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| Mechanical Considerations | |
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| Documentation | |
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| Documentation File | |
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| Useful Standards | |
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| Design Considerations for Special Circuits | |
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| Design Rules for Analog Circuits | |
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| Component Placement | |
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| Signal Conductors | |
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| Supply and Ground Conductors | |
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| General Rules for Design of Analog PCBs | |
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| Design Rules for Digital Circuits | |
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| Transmission Lines | |
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| Problems in Design of PCBs for Digital Circuits | |
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| Design Rules for High Frequency Circuits | |
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| Design Rules for Fast Pulse Circuits | |
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| Controlled Impedance Considerations | |
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| Design Rules for PCBs for Microwave Circuits | |
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| Basic Definitions | |
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| Strip Line and Microstrip Line | |
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| Transmission Lines as Passive Components | |
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| General Design Considerations for Microwave Circuits | |
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| Design Rules for Power Electronic Circuits | |
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| Separating Power Circuits in High and Low Power Parts | |
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| Base Material Thickness | |
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| Copper Foil Thickness | |
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| Conductor Width | |
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| Resistive Drop of Voltage | |
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| Thermal Considerations | |
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| High-density Interconnection Structures | |
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| Drivers for HDI | |
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| Advantages of HDI | |
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| Designing for HDI | |
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| Electromagnetic Interference/Compatibility (EMI/EMC) | |
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| Useful Standards | |
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| Artwork Generation | |
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| What is Artwork? | |
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| Basic Approach to Manual Artwork | |
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| Ink Drawing on White Card Board Sheets | |
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| Black Taping on Transparent Base Foil | |
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| Red and Blue Tape on Transparent Polyester Base Foil | |
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| General Design Guidelines for Artwork Preparation | |
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| Conductor Orientation | |
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| Conductor Routing | |
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| Conductor Spacing | |
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| Hole Diameter and Solder Pad Diameter | |
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| The Square Land/Pad | |
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| Artwork Generation Guidelines | |
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| No Conductor Zone | |
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| Pad Centre Holes | |
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| Conductor and Solder Pad Joints | |
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| Film Master Preparation | |
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| Photographic Film | |
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| Exposure through Camera | |
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| Dark Room | |
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| Film Development | |
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| Automated Artwork Generation | |
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| Computer- Aided Design (CAD) | |
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| System Requirements | |
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| Basic CAD Operation | |
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| Layout Procedure | |
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| Library Manager | |
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| Component Placement | |
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| Conductor Routing | |
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| Checking | |
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| Design Automation | |
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| How to Judge CAD Systems? | |
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| Manual Versus Automation in PCB Design | |
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| Photoplotter | |
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| Vector Photoplotter | |
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| Raster (Laser) Plotters | |
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| Talking to Photoplotters | |
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| Computer-Aided Manufacturing (CAM) | |
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| Data Transfer Mechanisms | |
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| PCB Design Checklist | |
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| Useful Relevant Standards | |
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| Copper Clad Laminates | |
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| Anatomy of Laminates | |
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| Fillers (Reinforcements) | |
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| Resins | |
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| Copper Foil | |
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| Manufacture of Laminates | |
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| Materials | |
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| Process | |
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| Properties of Laminates | |
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| Electrical Properties | |
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| Dielectric Strength | |
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| Dielectric Constant | |
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| Dissipation Factor | |
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| Insulation Resistance | |
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| Surface Resistivity | |
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| Volume Resistivity | |
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| Dielectric Breakdown | |
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| Types of Laminates | |
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| Phenolic Laminates | |
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| Epoxy Laminates | |
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| Glass Cloth Laminates | |
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| Prepreg Material [B-Stage] | |
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| PTFE (Polytetrafluoroethylene) Laminates | |
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| Polyester Laminates (Mylar Lamination) | |
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| Silicone Laminates | |
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| Melamine Laminates | |
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| Polyamide Laminates | |
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| Teflon Laminates | |
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| Mixed Dielectric Laminates | |
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| Evaluation of Laminates | |
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| Laminate Testing | |
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| Surface and Appearance | |
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| Water Absorption | |
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| Punchability and Machinability | |
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| Peel Strength | |
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| Bond Strength | |
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| Solder Resistance | |
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| Warp and Twist | |
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| Flexural Strength | |
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| Flammability | |
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| Glass Transition Temperature | |
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| Dimensional Stability | |
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| Copper Adhesion | |
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| Useful Standards | |
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| Image Transfer Techniques | |
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| What is Image Transfer? | |
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| Laminate Surface Preparation | |
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| Manual Cleaning Process | |
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| Mechanical Cleaning | |
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| Test for Cleanliness | |
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| Screen Printing | |
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| Screen Frame | |
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| Screen Cloth | |
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| Screen Preparation | |
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| Squeegees | |
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| Pattern Transferring Techniques | |
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| Screen Stencil Method | |
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| Indirect Method [Transfer Type Screen Method] | |
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| Knife-cut or Hand-cut Film Process | |
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| Photographic Techniques | |
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| Printing Inks | |
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| Ultraviolet Curing Inks | |
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| Printing Process | |
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| Manual Screen Printing Process | |
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| Automatic or Semi-automatic Screen Printing Process | |
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| Photo Printing | |
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| Liquid Photo-resist (Wet Film Resist) | |
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| Dry Film Photo-resists | |
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| Laser Direct Imaging (LDI) | |
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| Benefits of LDI | |
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| Legend Printing | |
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| Useful Standards | |
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| Plating Processes | |
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| Need for Plating | |
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| Electroplating | |
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| The Basic Electroplating Process | |
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| Faraday's Laws of Electrolysis | |
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| Water Quality | |
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| pH of a Solution | |
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| Buffer | |
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| Anodes | |
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| Anode Bags | |
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| Pre-treatment for Electroplating | |
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| Plating Techniques | |
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| Immersion Plating | |
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| Electroless Plating | |
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| Electroplating | |
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| General Problems in Plating | |
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| General Plating Defects | |
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| Voids | |
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| Blow Holes | |
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| Outgassing | |
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| Special Plating Techniques | |
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| Through-hole Plating | |
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| Reel-to-Reel Selective Plating | |
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| Brush Plating | |
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| Finger Plating | |
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| Conductor Metal Paste Coating | |
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| Reduction Silver Spraying | |
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| Metal Distribution and Plating Thickness | |
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| Analysis of Solution (Wet Chemical Analysis) | |
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| Physical Tests for Solutions | |
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| Testing of Electrodeposits | |
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| Considerations for Shop Floor | |
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| Plating Shop Layout | |
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| Equipment | |
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| Additive Processing | |
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| Fully Additive Process | |
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| Semi Additive Process | |
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| Partially Additive Process | |
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| Solder Mask | |
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| Solder Resist Classification | |
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| Liquid Film Solder Mask | |
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| Dry Film Solder Masking | |
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| Resolution | |
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| Encapsulation | |
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| Surface Topography Resist Thickness | |
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| Placement Assistance | |
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| Reliability of Solder Mask | |
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| Soldering and Cleaning | |
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| Tenting of Vias | |
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| Solder Mask over Bare Copper [SMOBC] | |
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| Conformal Coatings | |
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| Materials for Conformal Coatings | |
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| Methods of Applying Conformal Coatings | |
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| Standards for Coatings | |
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| Useful Standards | |
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| Etching Techniques | |
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| Etching Solutions and Chemistry | |
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| Ferric Chloride | |
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| Hydrogen Peroxide - Sulphuric Acid | |
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| Chromic-Sulphuric Acid | |
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| Cupric Chloride | |
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| Ammonium Persulphate | |
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| Alkaline Ammoniacal/Ammonium Chloride | |
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| Etching Arrangements | |
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| Simple Batch Production Etching | |
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| Continuous Feed Etching | |
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| Open Loop Regeneration | |
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| Closed Loop Regeneration | |
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| Etching Parameters | |
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| Equipment and Techniques | |
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| Immersion Etching | |
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| Bubble Etching | |
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| Splash Etching | |
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| Spray Etching | |
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| Etching Equipment Selection | |
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| Optimizing Etchant Economy | |
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| Problems in Etching | |
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| Under-etching or Under-cut | |
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| Overhang | |
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| Facilities for Etching Area | |
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| Electrochemical Etching | |
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| Mechanical Etching | |
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| Mechanical Operations | |
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| Need for Mechanical Operations | |
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| Cutting Methods | |
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| Shearing | |
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| Sawing | |
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| Blanking of PCBs | |
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| Milling | |
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| Routing of PCBs | |
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| Hole Punching | |
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| Drilling | |
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| Drill Bit Geometry and its Importance | |
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| Types of Drill Bits | |
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| Drill Bit Inspection | |
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| Drill Bit Sizes | |
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| Tool Life and Re-grinding (Re-pointing) | |
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| Requirements in Drilling | |
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| Drill Speed, Feed and Withdrawal Rates | |
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| Function of Clean Holes | |
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| Drill Entry and Exit (Back-up) Materials | |
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| Use of Drill Bush/Collar | |
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| Drilling and Types of Laminates | |
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| Drilling Problems | |
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| Drilling Machines | |
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| Microvias | |
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| Photo-formed Vias | |
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| Plasma Etching | |
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| Laser-formed Vias | |
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| Use of UV Laser for Drilling PCB | |
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| Hybrid Laser Drilling Process | |
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| Useful Standards | |
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| Multi-layer Boards | |
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| What are Multi-layers? | |
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| Interconnection Techniques | |
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| Conventional Plated Through-hole | |
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| Buried Via | |
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| Blind Vias | |
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| Materials for Multi-layer Boards | |
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| Resin System | |
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| Reinforcement Materials | |
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| Prepreg | |
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| Copper Foil | |
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| Design Features of Multi-layer Boards | |
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| Mechanical Design Considerations | |
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| Electrical Design Considerations | |
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| Fabrication Process for Multi-layer Boards | |
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| General Process | |
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| Lamination | |
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| Post-lamination Process | |
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| Multi-layer Drilling | |
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| Schematic Key for Multi-layer Built-ups | |
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| Useful Standards | |
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| Flexible Printed Circuit Boards | |
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| What are Flexible Printed Circuit Boards? | |
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| Construction of Flexible Printed Circuit Boards | |
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| Films - Types and Their Characteristics | |
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| Foils | |
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| Adhesives | |
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| Design Considerations in Flexible Circuits | |
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| Difference in Design Considerations of Rigid and Flexible Circuits | |
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| Step-by-step Approach to Designing of a Flex Circuit | |
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| Designing for Flexibility and Reliability | |
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| Manufacture of Flexible Circuits | |
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| Rigid Flex Printed Circuit Boards | |
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| Terminations | |
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| Advantages of Flexible Circuits | |
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| Special Applications of Flexible Circuits | |
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| Useful Standards | |
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| Soldering, Assembly and Re-working Techniques | |
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| What is Soldering? | |
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| Theory of Soldering | |
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| The Wetting Action | |
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| Surface Tension | |
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| Creation of an Inter-metallic Compound | |
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| The Wetting Angle | |
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| Soldering Variables | |
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| Temperature and Time Taken for Soldering | |
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| Tarnish-free Surface | |
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| Application of Right Flux and Proper Solder | |
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| Soldering Material | |
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| Solder | |
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| Flux | |
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| Soldering and Brazing | |
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| Solders for Hard Soldering/Brazing | |
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| Soldering Tools | |
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| Soldering Iron | |
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| Other Hand Soldering Tools | |
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| Cutters | |
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| Pliers | |
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| Strippers | |
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| Bending Tools | |
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| Heat Sinks | |
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| General Cleaning Tools | |
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| Hand Soldering | |
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| Hand Soldering Requirements | |
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| Steps in Hand Soldering | |
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| Soldering Leadless Capacitors | |
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| PCB Assembly Process | |
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| Leaded Through-hole Assembly | |
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| Surface Mount Assembly | |
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| Combinations of Mixed Technologies | |
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| Solder Pastes for SMDS | |
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| Requirements of Solder Pastes | |
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| Composition of Solder Pastes | |
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| Solder Paste Application | |
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| Handling of Solder Paste | |
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| Stencil Printing of Solder Paste | |
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| Screen Printing of Solder Paste | |
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| Pre-forms of Solder | |
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| No-clean Solder Paste | |
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| Adhesive for Mixed Technology Assembly | |
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| Requirements of Adhesive | |
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| Application of Adhesive | |
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| Mass Soldering | |
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| Dip Soldering | |
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| Drag Soldering | |
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| Wave Soldering | |
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| Reflow Soldering | |
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| Vapour Phase System | |
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| Post-soldering Cleaning | |
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| Types of Contamination | |
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| Solvents and Cleaning Methods | |
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| Quality Control of Solder Joints | |
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| Good Quality Solder Joints | |
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| Common Soldering Faults | |
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| Solder Joint Defects and their Common Causes | |
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| Health and Safety Aspects | |
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| Electrostatic Discharge Control | |
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| Fundamentals of ESD | |
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| Electrostatic Voltages Generated by Various Operations | |
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| Sensitivity of Various Components to ESD Voltages | |
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| Electrostatic Protection | |
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| Anti-static Workstation | |
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| A Proper Assembly Environment | |
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| Component Handling | |
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| Special Considerations for Handling MOS Devices | |
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| Education/Certificate for ESD Control | |
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| Re-work and Repair of Printed Circuit Boards | |
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| Approaching Components for Tests | |
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| De-soldering Techniques | |
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| Replacement of Components | |
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| Repairing Surface Mounted PCBs | |
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| Cut all Leads | |
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| Heating Methods | |
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| Removal and Replacement of Surface Mount Devices | |
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| Re-work Stations | |
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| Useful Standards | |
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| Quality, Reliability and Acceptability Aspects | |
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| What is Quality Assurance? | |
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| Classification of Defects | |
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| Defectives | |
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| Acceptability Quality Level (AQL) | |
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| Quality Control Programme | |
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| Statistical Process Control and Sampling Plan | |
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| Testing for Quality Control | |
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| Characteristics for Testing for Quality Assurance | |
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| Designing a QA Programme | |
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| Incoming QA | |
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| Traceability | |
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| Quality Control Methods | |
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| Micro-sectioning | |
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| Testing of Printed Circuit Boards | |
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| Automatic Board Testing | |
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| Bare Board Testing (BBT) | |
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| Testing of Assembled Boards | |
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| Reliability Testing | |
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| Reliability of Printed Circuit Boards | |
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| Acceptability of PCBs | |
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| Acceptance Criteria | |
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| Inspection of Assembled PCBs | |
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| Inspection Techniques | |
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| Acceptability Criteria | |
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| Useful Standards | |
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| Environmental Concerns in PCB Industry | |
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| Pollution Control in PCB Industry | |
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| Polluting Agents | |
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| Recycling of Water | |
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| Recovery Techniques | |
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| Filtration | |
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| Water Use Reduction Technique | |
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| Ion Exchange System | |
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| Reverse Osmosis | |
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| Evaporative Recovery | |
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| Precipitation of Heavy Metals | |
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| Electrolytic Recovery | |
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| Air Pollution | |
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| Dust | |
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| Fumes | |
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| Clean Environment in Assembly Rooms | |
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| Recycling of Printed Circuit Boards | |
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| Present Approach to PCB Scrap Disposal | |
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| Characteristics of PCB Scrap | |
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| Dis-assembly of Equipment | |
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| Technologies of Recycling of PCBs | |
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| Environmental Standards | |
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| Safety Precautions for the Personnel | |
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| Toxic Chemicals in PCB Fabrication | |
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| Lead-free Soldering | |
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| Substitutes for Tin/Lead Solders | |
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| Useful Standards | |
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| Glossary | |
| |
| |
| References | |
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| Index | |