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Electronic Packaging: Design, Materials, Process, and Reliability

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ISBN-10: 0070371350

ISBN-13: 9780070371354

Edition: 1998

Authors: John H. Lau, Wataru Nakayama, John Prince, C. P. Wong

List price: $69.00
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Intended to be an electronic packaging resource, this text features writing from four leaders in the the four intertwined disciplines of packaging. Recent technological advances are discussed, including BGA, Flip Chip and CSP.
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Book details

List price: $69.00
Copyright year: 1998
Publisher: McGraw-Hill Professional Publishing
Binding: Hardcover
Pages: 496
Size: 6.50" wide x 9.50" long x 1.75" tall
Weight: 1.892
Language: English

John Lau graduated with a first class honours in womenswear design at London College of Fashion and has a masters in enterprise. John has worked in various roles within the fashion industry and has experience as a fashion stylist and writer for the international magazines Loaded and the Chinese edition of Vogue. He has helped new brands develop their creative and business direction both in the UK, Hong Kong and China, and continues to have an active role in fashion as a consultant for retail, branding, production and distribution.John is currently a Senior Lecturer in International Fashion Business at Manchester Metropolitan University, teaching on the Fashion Buying and Clothing Design and…    

Introduction
Basic Electrical Effects in Electronic Packagingand Interconnects
Thermal Design, Analysis, and Measurementof Electronic Packaging
Mechanical Design, Analysis, Measurement,and Reliability of Electronic Packaging
Polymers forElectronic Packaging: Materials, Processes, and Reliability
Index