| |
| |
Foreword | |
| |
| |
Preface | |
| |
| |
| |
Introduction to the System-on-Package (SOP) Technology | |
| |
| |
| |
Introduction | |
| |
| |
| |
Electronic System Trend to Digital Convergence | |
| |
| |
| |
Building Blocks of an Electronic System | |
| |
| |
| |
System Technologies Evolution | |
| |
| |
| |
Five Major System Technologies | |
| |
| |
| |
System-on-Board (SOB) Technology with Discrete Components | |
| |
| |
| |
System-on-Chip (SOC) with Two or More System Functions on a Single Chip | |
| |
| |
| |
Multichip Module (MCM): Package-Enabled Integration of Two or More Chips Interconnected Horizontally | |
| |
| |
| |
Stacked ICs and Packages (SIP): Package-Enabled IC Integration with Two or More Chip Stacking (Moore's Law in the Third Dimension) | |
| |
| |
| |
System-on-Package Technology (Module with the Best of IC and System Integration) | |
| |
| |
| |
Miniaturization Trend | |
| |
| |
| |
Comparison of the Five System Technologies | |
| |
| |
| |
Status of SOP around the Globe | |
| |
| |
| |
Opto SOP | |
| |
| |
| |
RF SOP | |
| |
| |
| |
Embedded Passives SOP | |
| |
| |
| |
MEMS SOP | |
| |
| |
| |
SOP Technology Implementations | |
| |
| |
| |
SOP Technologies | |
| |
| |
| |
Summary | |
| |
| |
Acknowledgment | |
| |
| |
References | |
| |
| |
| |
Introduction to System-on-Chip (SOC) | |
| |
| |
| |
Introduction | |
| |
| |
| |
Key Customer Requirements | |
| |
| |
| |
SOC Architecture | |
| |
| |
| |
SOC Design Challenge | |
| |
| |
| |
SOC Design Phase 1-SOC Definition and Challenges | |
| |
| |
| |
SOC Design Phase II-SOC Create Process and Challenges | |
| |
| |
| |
Summary | |
| |
| |
References | |
| |
| |
| |
Stacked ICs and Packages (SIP) | |
| |
| |
| |
SIP Definition | |
| |
| |
| |
Definition | |
| |
| |
| |
Applications | |
| |
| |
| |
CEO Figure and SIP Categories | |
| |
| |
| |
SIP Challenges | |
| |
| |
| |
Materials and Process Challenges | |
| |
| |
| |
Mechanical Challenges | |
| |
| |
| |
Electrical Challenges | |
| |
| |
| |
Thermal Challenges | |
| |
| |
| |
Non-TSV SIP | |
| |
| |
| |
Historical Evolution of Non-TSV SIP | |
| |
| |
| |
Chip Stacking | |
| |
| |
| |
Package Stacking | |
| |
| |
| |
Chip Stacking versus Package Stacking | |
| |
| |
| |
TSV SIP | |
| |
| |
| |
Introduction | |
| |
| |
| |
Historical Evolution of 3D TSV Technology | |
| |
| |
| |
Basic TSV Technologies | |
| |
| |
| |
Different 3D Integration Technologies using TSV | |
| |
| |
| |
Si Carrier Technology | |
| |
| |
| |
Future Trends | |
| |
| |
Acknowledgments | |
| |
| |
References | |
| |
| |
| |
Mixed-Signal (SOP) Design | |
| |
| |
| |
Introduction | |
| |
| |
| |
Mixed-Signal Devices and Systems | |
| |
| |
| |
Importance of Integration in Mobile Applications | |
| |
| |
| |
Mixed-Signal Architecture | |
| |
| |
| |
Mixed-Signal Design Challenges | |
| |
| |
| |
Fabrication Technologies | |
| |
| |
| |
Design of Embedded Passives in RF Front End | |
| |
| |
| |
Embedded Inductors | |
| |
| |
| |
Embedded Capacitors | |
| |
| |
| |
Embedded Filters | |
| |
| |
| |
Embedded Baluns | |
| |
| |
| |
Filter-Balun Networks | |
| |
| |
| |
Tunable Filters | |
| |
| |
| |
Chip-Package Codesign | |
| |
| |
| |
Low Noise Amplifier Design | |
| |
| |
| |
Concurrent Oscillator Design | |
| |
| |
| |
Design of WLAN Front-End Module | |
| |
| |
| |
Design Tools | |
| |
| |
| |
Synthesis of Embedded RF Circuits | |
| |
| |
| |
Modeling of Signal and Power Delivery Networks | |
| |
| |
| |
Rational Functions, Network Synthesis, and Transient Simulation | |
| |
| |
| |
Design for Manufacturing | |
| |
| |
| |
Coupling | |
| |
| |
| |
Analog-to-Analog Coupling | |
| |
| |
| |
Digital-to-Analog Coupling | |
| |
| |
| |
Decoupling | |
| |
| |
| |
Need for Decoupling in Digital Applications | |
| |
| |
| |
Issues with SMD Capacitors | |
| |
| |
| |
Embedded Decoupling | |
| |
| |
| |
Characterization of Embedded Capacitors | |
| |
| |
| |
Electromagnetic Bandgap (EBG) Structures | |
| |
| |
| |
Analysis and Design of EBG Structures | |
| |
| |
| |
Application of EBGs in Power Supply Noise Suppression | |
| |
| |
| |
Radiation Analysis of EBGs | |
| |
| |
| |
Summary | |
| |
| |
Acknowledgments | |
| |
| |
References | |
| |
| |
| |
Radio Frequency System-on-Package (RF SOP) | |
| |
| |
| |
Introduction | |
| |
| |
| |
RF SOP Concept | |
| |
| |
| |
Historical Evolution of RF Packaging Technologies | |
| |
| |
| |
RF SOP Technologies | |
| |
| |
| |
Modeling and Optimization | |
| |
| |
| |
RF Substrate Materials Technologies | |
| |
| |
| |
Antennas | |
| |
| |
| |
Inductors | |
| |
| |
| |
RF Capacitors | |
| |
| |
| |
Resistors | |
| |
| |
| |
Filters | |
| |
| |
| |
Baluns | |
| |
| |
| |
Combiners | |
| |
| |
| |
RF MEMS Switches | |
| |
| |
| |
RFIDs | |
| |
| |
| |
Integrated RF Modules | |
| |
| |
| |
WLAN | |
| |
| |
| |
Intelligent Network Communicator (INC) | |
| |
| |
| |
Future Trends | |
| |
| |
Acknowledgments | |
| |
| |
References | |
| |
| |
| |
Integrated Chip-to-Chip Optoelectronic SOP | |
| |
| |
| |
Introduction | |
| |
| |
| |
Applications of Optoelectronic SOP | |
| |
| |
| |
High-Speed Digital Systems and High-Performance Computing | |
| |
| |
| |
RF-Optical Communication Systems | |
| |
| |
| |
Integration Challenges in Thin-Film Optoelectronic SOP | |
| |
| |
| |
Optical Alignment | |
| |
| |
| |
Key Physical and Optical Properties of Thin-Film Optical Waveguide Materials | |
| |
| |
| |
Advantages of Optoelectronic SOP | |
| |
| |
| |
Comparison of High-Speed Electrical and Optical Wiring Performance | |
| |
| |
| |
Wiring Density | |
| |
| |
| |
Power Dissipation | |
| |
| |
| |
Reliability | |
| |
| |
| |
Evolution of Optoelectronic SOP Technology | |
| |
| |
| |
Board-to-Board Optical Wiring | |
| |
| |
| |
Chip-to-Chip Optical Interconnects | |
| |
| |
| |
Optoelectronic SOP Thin-Film Components | |
| |
| |
| |
Passive Thin-Film Lightwave Circuits | |
| |
| |
| |
Active Optoelectronic SOP Thin-Film Components | |
| |
| |
| |
Opportunities for 3D Lightwave Circuits | |
| |
| |
| |
SOP Integration: Interface Optical Coupling | |
| |
| |
| |
On-Chip Optical Circuits | |
| |
| |
| |
Future Trends in Optoelectronic SOP | |
| |
| |
| |
Summary | |
| |
| |
References | |
| |
| |
Table 6.1 References | |
| |
| |
| |
SOP Substrate with Multilayer Wiring and Thin-Film Embedded Components | |
| |
| |
| |
Introduction | |
| |
| |
| |
Historical Evolution of Substrate Integration Technologies | |
| |
| |
| |
SOP Substrate | |
| |
| |
| |
Drivers and Challenges | |
| |
| |
| |
Ultrathin-Film Wiring with Embedded Low-K Dielectrics, Cores, and Conductors | |
| |
| |
| |
Embedded Passives | |
| |
| |
| |
Embedded Actives | |
| |
| |
| |
Miniaturized Thermal Materials and Structures | |
| |
| |
| |
Future SOP Substrate Integration | |
| |
| |
Acknowledgments | |
| |
| |
References | |
| |
| |
| |
Mixed-Signal (SOP) Reliability | |
| |
| |
| |
System-Level Reliability Considerations | |
| |
| |
| |
Failure Mechanisms | |
| |
| |
| |
Design-for-Reliability | |
| |
| |
| |
Reliability Verification | |
| |
| |
| |
Reliability of Multifunction SOP Substrate | |
| |
| |
| |
Materials and Process Reliability | |
| |
| |
| |
Digital Function Reliability and Verification | |
| |
| |
| |
RF Function Reliability and Verification | |
| |
| |
| |
Optical Function Reliability and Verification | |
| |
| |
| |
Multifunction System Reliability | |
| |
| |
| |
Substrate-to-IC Interconnection Reliability | |
| |
| |
| |
Factors Affecting the Substrate-to-IC Interconnection Reliability | |
| |
| |
| |
100-�m Flip-Chip Assembly Reliability | |
| |
| |
| |
Reliability against Die Cracking | |
| |
| |
| |
Solder Joint Reliability | |
| |
| |
| |
Interfacial Adhesion and Effect of Moisture on Underfill Reliability | |
| |
| |
| |
Future Trends and Directions | |
| |
| |
| |
Extending Solder | |
| |
| |
| |
Complaint Interconnects | |
| |
| |
| |
Alternative to Solder and Nano Interconnects | |
| |
| |
| |
Summary | |
| |
| |
References | |
| |
| |
| |
MEMS Packaging | |
| |
| |
| |
Introduction | |
| |
| |
| |
Challenges in MEMS Packaging | |
| |
| |
| |
Chip-Scale versus Wafer-Scale Packaging | |
| |
| |
| |
Wafer Bonding Techniques | |
| |
| |
| |
Direct Bonding | |
| |
| |
| |
Bonding Using Intermediate Layers | |
| |
| |
| |
Sacrificial Film-Based Sealing Techniques | |
| |
| |
| |
Etching the Sacrificial Material | |
| |
| |
| |
Decomposition of Sacrificial Polymers | |
| |
| |
| |
Low-Loss Polymer Encapsulation Techniques | |
| |
| |
| |
Techniques Utilizing Getters | |
| |
| |
| |
Nonevaporable Getters | |
| |
| |
| |
Thin-Film Getters | |
| |
| |
| |
Improving MEMS Reliability through Getters | |
| |
| |
| |
Interconnections | |
| |
| |
| |
Assembly | |
| |
| |
| |
Summary and Future Trends | |
| |
| |
References | |
| |
| |
| |
Wafer-Level SOP | |
| |
| |
| |
Introduction | |
| |
| |
| |
Definition | |
| |
| |
| |
Wafer-Level Packaging-Historical Evolution | |
| |
| |
| |
Buildup Wiring and Redistribution | |
| |
| |
| |
IC-Package Pitch Gap | |
| |
| |
| |
Redistribution Layers on Si to Close the Pitch Gap | |
| |
| |
| |
Wafer-Level Thin-Film Embedded Components | |
| |
| |
| |
Embedded Thin-Film Components in the ReDistribution Layer (RDL) | |
| |
| |
| |
Wafer-Level Packaging and Interconnections (WLPI) | |
| |
| |
| |
Classes of Wafer-Level Packaging and Interconnections (WLPI) | |
| |
| |
| |
Rigid Interconnections | |
| |
| |
| |
WLSOP Assembly | |
| |
| |
| |
WLSOP | |
| |
| |
| |
Wafer-Level Probing and Burn-In | |
| |
| |
| |
Summary | |
| |
| |
Acknowledgments | |
| |
| |
References | |
| |
| |
| |
Thermal SOP | |
| |
| |
| |
Fundamentals of Thermal SOP | |
| |
| |
| |
Thermal Implications of SOP | |
| |
| |
| |
System-Level Thermal Constraints in SOP-Based Portables | |
| |
| |
| |
Thermal Sources in SOP Modules | |
| |
| |
| |
Digital SOP | |
| |
| |
| |
RF SOP | |
| |
| |
| |
Optoelectronic SOP | |
| |
| |
| |
MEMS SOP | |
| |
| |
| |
Fundamental Heat Transfer Modes | |
| |
| |
| |
Conduction | |
| |
| |
| |
Convection | |
| |
| |
| |
Radiation | |
| |
| |
| |
Fundamentals of Thermal Characterization | |
| |
| |
| |
Numerical Methods for Thermal Characterization | |
| |
| |
| |
Experimental Methods for Thermal Characterization | |
| |
| |
| |
Thermal Management Technologies | |
| |
| |
| |
Thermal Design Methodologies | |
| |
| |
| |
Power Minimization Methodologies | |
| |
| |
| |
Parallel Processing | |
| |
| |
| |
Dynamic Voltage and Frequency Scaling (DVFS) | |
| |
| |
| |
Application-Specific Processors (ASP) | |
| |
| |
| |
Cache Power Minimization | |
| |
| |
| |
Power Harnessing | |
| |
| |
| |
Summary | |
| |
| |
Acknowledgments | |
| |
| |
References | |
| |
| |
| |
Electrical Test of SOP Modules and Systems | |
| |
| |
| |
SOP Electrical Test Challenges | |
| |
| |
| |
Objectives of the HVM Test Process and Challenges for SOPs | |
| |
| |
| |
HVM Test Flow for SOPs | |
| |
| |
| |
Known Good Embedded Substrate Test | |
| |
| |
| |
Substrate Interconnect Tests | |
| |
| |
| |
Testing Embedded Passives | |
| |
| |
| |
Known Good Embedded Module Test of Digital Subsystems | |
| |
| |
| |
Boundary Scan-IEEE 1149.1 | |
| |
| |
| |
Multi-gigahertz Digital Test: Recent Developments | |
| |
| |
| |
KGEM Test of Mixed-Signal and RF Subsystems | |
| |
| |
| |
Test Strategies | |
| |
| |
| |
Fault Models and Test Quality | |
| |
| |
| |
Direct Measurement of Specifications Using Dedicated Circuitry | |
| |
| |
| |
Alternate Testing Methods for Mixed-Signal and RF Circuits | |
| |
| |
| |
Summary | |
| |
| |
Acknowledgments | |
| |
| |
References | |
| |
| |
| |
Biosensor SOP | |
| |
| |
| |
Introduction to Biosensor SOP | |
| |
| |
| |
SOP: A Highly Miniaturized Electronic System Technology | |
| |
| |
| |
Biosensor SOP for Miniaturized Biomedical Implants and Sensor Systems | |
| |
| |
| |
Building Blocks of Biosensor SOP | |
| |
| |
| |
Biosensing | |
| |
| |
| |
Microchannels for Biofluid Transport | |
| |
| |
| |
Biosensing Element (Probe) Design and Preparation | |
| |
| |
| |
Probe-Target Molecular Hybridization | |
| |
| |
| |
Signal Conversion | |
| |
| |
| |
Nanomaterials and Nanostructures for Signal Conversion Components | |
| |
| |
| |
Surface Modification and Biofunctionalization of Signal Conversion Component | |
| |
| |
| |
Signal Conversion Methods | |
| |
| |
| |
Signal Detection and Electronic Processing | |
| |
| |
| |
Low-Power Application-Specific Integrated Circuits (ASICs) and Mixed-Signal Design for Biosensor SOP | |
| |
| |
| |
Bio- SOP Substrate Integration Technologies | |
| |
| |
| |
Summary and Future Trends | |
| |
| |
| |
Nano Bio-SOP Integration Challenges | |
| |
| |
References | |
| |
| |
Index | |