| |
| |
Preface | |
| |
| |
Electronic Packaging Defined | |
| |
| |
Contributors | |
| |
| |
| |
Fundamental Technologies | |
| |
| |
| |
Materials for Electronic Packaging | |
| |
| |
Polymers for Electronic Packaging | |
| |
| |
| |
Introduction | |
| |
| |
| |
Future Electronic Packaging System Needs | |
| |
| |
| |
Recent Advancements in Polymeric Materials for Electronic Packaging | |
| |
| |
| |
Polymeric Materials For Microelectronics | |
| |
| |
| |
Conclusions and Future Developments | |
| |
| |
Bibliography | |
| |
| |
Flip Chip Technology: Materials and Processes for the Next Generation of High-Performance Electronics | |
| |
| |
| |
Basics | |
| |
| |
| |
Under-Bump Metallization | |
| |
| |
| |
Bumping Materials | |
| |
| |
| |
Bumping Processes | |
| |
| |
| |
Joining Materials and Agents | |
| |
| |
| |
The Assembly Process | |
| |
| |
| |
Encapsulation/Underfill | |
| |
| |
| |
Substrates for Flip Chips | |
| |
| |
| |
Features and Benefits | |
| |
| |
| |
Limitations and Issues | |
| |
| |
| |
Performance and Reliability | |
| |
| |
| |
Applications | |
| |
| |
| |
Summary and Conclusions | |
| |
| |
References | |
| |
| |
Ceramic Materials | |
| |
| |
| |
Introduction | |
| |
| |
| |
Classes of Materials Covered | |
| |
| |
| |
Summary--Ceramics | |
| |
| |
References | |
| |
| |
| |
Thermal Management | |
| |
| |
| |
Introduction | |
| |
| |
| |
Why Thermal Management? | |
| |
| |
| |
Heat Flow Theory | |
| |
| |
| |
The Thermal Design | |
| |
| |
| |
Heat Sinks | |
| |
| |
| |
Circuit Card Assembly Cooling | |
| |
| |
| |
High heat-load cooling | |
| |
| |
| |
Special cooling devices | |
| |
| |
| |
Computer-Based Thermal Analysis | |
| |
| |
| |
Thermal Measurements | |
| |
| |
References | |
| |
| |
| |
Thermal and Mechanical Stress Behavior in Electronic Packaging | |
| |
| |
| |
Introduction | |
| |
| |
| |
Stress Generation and Fatigue | |
| |
| |
| |
Stress Environments | |
| |
| |
| |
Material Mechanical Properties | |
| |
| |
| |
Soft Solder Fatigue | |
| |
| |
| |
Mechanical and Thermomechanical Models | |
| |
| |
| |
Modified Coffin-Manson Equations | |
| |
| |
| |
Miner's Rule | |
| |
| |
| |
FEM Package Representation | |
| |
| |
| |
Thermal Analysis Using FEM | |
| |
| |
| |
Total Inelastic Strain Energy | |
| |
| |
| |
Crack Growth Theory | |
| |
| |
| |
Temperature Dependence of Properties | |
| |
| |
| |
Packaging Fatigue | |
| |
| |
| |
Die Cracking and Delamination | |
| |
| |
| |
Flip Chips | |
| |
| |
| |
Ball Grid Arrays | |
| |
| |
| |
Chip on Board | |
| |
| |
| |
Level-Two Packaging--Pin-in-Hole | |
| |
| |
| |
Leadless and Leaded Quad Packages | |
| |
| |
| |
FEM Stress Analysis of Temperature-Cycled LCCC Solder Joints | |
| |
| |
| |
Leaded Chip Carriers (Quad Flat Packages) | |
| |
| |
| |
Summary | |
| |
| |
References | |
| |
| |
| |
Connector and Interconnection Technology | |
| |
| |
| |
Connector Overview | |
| |
| |
| |
The Contact Interface | |
| |
| |
| |
The Contact Finish | |
| |
| |
| |
Contact Springs | |
| |
| |
| |
Connector Housings | |
| |
| |
| |
Separable Connections | |
| |
| |
| |
Permanent Connections | |
| |
| |
| |
Connector Applications | |
| |
| |
| |
Connector Types | |
| |
| |
| |
Connector Testing | |
| |
| |
References | |
| |
| |
| |
Wiring and Cabling | |
| |
| |
| |
Introduction | |
| |
| |
| |
Cabling Types | |
| |
| |
| |
Basic Construction | |
| |
| |
| |
Connector Characteristics | |
| |
| |
| |
Electromagnetic Interference and Shielding | |
| |
| |
References | |
| |
| |
| |
Solder Technologies for Electronic Packaging and Assembly | |
| |
| |
| |
Introduction | |
| |
| |
| |
Solder Materials | |
| |
| |
| |
Solder Paste | |
| |
| |
| |
Soldering Methodology | |
| |
| |
| |
Solderability | |
| |
| |
| |
Cleaning | |
| |
| |
| |
Fine-Pitch Application | |
| |
| |
| |
Soldering-Related Issues | |
| |
| |
| |
Solder-Joint Appearance and Microstructure | |
| |
| |
| |
Solder-Joint Integrity | |
| |
| |
| |
Lead-Free Solders | |
| |
| |
References | |
| |
| |
| |
Interconnection Technologies | |
| |
| |
| |
Packaging and Interconnection of Integrated Circuits | |
| |
| |
| |
Introduction | |
| |
| |
| |
Conventional Package Technologies | |
| |
| |
| |
Advanced Package Technologies | |
| |
| |
| |
Comparison of Technologies | |
| |
| |
| |
Package Families | |
| |
| |
| |
Package Design Considerations | |
| |
| |
| |
Package IC Assembly Processes | |
| |
| |
| |
Outsourcing--Subcontract Assembly | |
| |
| |
| |
Package to Second-Level Interconnection | |
| |
| |
| |
Summary and Future Trends | |
| |
| |
References | |
| |
| |
| |
Surface Mount Technologies | |
| |
| |
| |
Introduction | |
| |
| |
| |
The Challenges of SMT | |
| |
| |
| |
Engineering Skills | |
| |
| |
| |
Electronics Packaging Families | |
| |
| |
| |
SMT Design for Manufacture | |
| |
| |
| |
Materials Impact on Process | |
| |
| |
| |
Process Guidelines for SMT Manufacturing | |
| |
| |
| |
Inspection and Quality Assurance | |
| |
| |
| |
Reliability | |
| |
| |
References | |
| |
| |
| |
The Hybrid Microelectronics and Multichip Module Technologies | |
| |
| |
| |
Introduction | |
| |
| |
| |
Ceramic Substrates for Microelectronic Applications | |
| |
| |
| |
Composite Materials | |
| |
| |
| |
Thick Film Technology | |
| |
| |
| |
Cermet Thick Film Conductor Materials | |
| |
| |
| |
Thick Film Resistor Materials | |
| |
| |
| |
Thick Film Dielectric Materials | |
| |
| |
| |
Overglaze Materials | |
| |
| |
| |
Conclusions | |
| |
| |
| |
Thin Film Technology | |
| |
| |
| |
Thin Film Materials | |
| |
| |
| |
Comparison of Thick and Thin Film | |
| |
| |
| |
Copper Metallization Technologies | |
| |
| |
| |
Summary of Substrate Metallization Technologies | |
| |
| |
| |
Resistor Trimming | |
| |
| |
| |
Assembly of Hybrid Circuits | |
| |
| |
| |
Packaging | |
| |
| |
| |
Design of Hybrid Circuits | |
| |
| |
| |
Multichip Modules | |
| |
| |
References | |
| |
| |
| |
Chip Scale Packaging and Direct Chip Attach Technologies | |
| |
| |
| |
Introduction | |
| |
| |
| |
Background and History | |
| |
| |
| |
Electronic Interconnection Regime | |
| |
| |
| |
Early Minimalist IC Packaging Solution | |
| |
| |
| |
Current Interconnection Trends | |
| |
| |
| |
Important Shared Issues | |
| |
| |
| |
Markets for CSP and DCA | |
| |
| |
| |
Direct Chip Attach Technologies | |
| |
| |
| |
Chip scale Packages | |
| |
| |
| |
Testing CSPs and Direct Attach Assemblies | |
| |
| |
| |
Summary | |
| |
| |
References | |
| |
| |
| |
Rigid and Flexible Printed Wiring Boards and Microvia Technology | |
| |
| |
| |
Introduction | |
| |
| |
| |
Printed Circuit Board System Types | |
| |
| |
| |
Printed Circuit Board Materials | |
| |
| |
| |
Design Considerations | |
| |
| |
| |
Manufacturing Considerations | |
| |
| |
| |
Microvias | |
| |
| |
| |
Industry Standards | |
| |
| |
Suggested Reading | |
| |
| |
Acknowledgment | |
| |
| |
| |
System Packaging Technologies | |
| |
| |
| |
Packaging of High-Speed and Microwave Electronic Systems | |
| |
| |
| |
Introduction | |
| |
| |
| |
Types of Circuit Media for Modern Microwave Packaging | |
| |
| |
| |
Limitations of Microwave Integrated Circuits | |
| |
| |
| |
Technology of Microwave Integrated Circuits | |
| |
| |
| |
Planar Waveguides | |
| |
| |
| |
Lumped-Element Circuits for Microwave Packages | |
| |
| |
| |
High-Speed Digital Packaging | |
| |
| |
| |
Electrical Design Inputs | |
| |
| |
| |
Netlist Analysis | |
| |
| |
| |
Design Restrictions | |
| |
| |
| |
PWB Layout Considerations | |
| |
| |
| |
Preferred Redesign Options | |
| |
| |
| |
CAD Interface | |
| |
| |
References | |
| |
| |
| |
Packaging of High-Voltage Systems | |
| |
| |
| |
Introduction | |
| |
| |
| |
Properties of Insulating Materials | |
| |
| |
| |
Field Stress and Configurations | |
| |
| |
| |
Aerospace Design Considerations | |
| |
| |
| |
Design and Manufacturing Guidelines | |
| |
| |
| |
Tests | |
| |
| |
| |
Problems and Suggested Solutions | |
| |
| |
| |
Conclusions | |
| |
| |
References | |
| |
| |
| |
Electrical Characterization and Modeling of IC Packaging | |
| |
| |
| |
Introduction | |
| |
| |
| |
Package Electrical Analysis | |
| |
| |
| |
Package Modeling | |
| |
| |
| |
Package Modeling Program | |
| |
| |
| |
Verification Method for Modeling Programs | |
| |
| |
| |
Summary | |
| |
| |
References | |
| |
| |
| |
Electronic Packaging Terms and Abbreviations | |
| |
| |
Index | |
| |
| |
About the Editor | |