Preface | p. xi |
Electronic Packaging Defined | p. xiii |
Contributors | p. xiv |
Fundamental Technologies | |
Materials for Electronic Packaging | |
Polymers for Electronic Packaging | |
Introduction | p. 1.1 |
Future Electronic Packaging System Needs | p. 1.2 |
Recent Advancements in Polymeric Materials for Electronic Packaging | p. 1.2 |
Polymeric Materials For Microelectronics | p. 1.3 |
Conclusions and Future Developments | p. 1.15 |
Bibliography | p. 1.15 |
Flip Chip Technology: Materials and Processes for the Next Generation of High-Performance Electronics | |
Basics | p. 1.22 |
Under-Bump Metallization | p. 1.24 |
Bumping Materials | p. 1.27 |
Bumping Processes | p. 1.30 |
Joining Materials and Agents | p. 1.34 |
The Assembly Process | p. 1.38 |
Encapsulation/Underfill | p. 1.41 |
Substrates for Flip Chips | p. 1.46 |
Features and Benefits | p. 1.48 |
Limitations and Issues | p. 1.49 |
Performance and Reliability | p. 1.51 |
Applications | p. 1.51 |
Summary and Conclusions | p. 1.53 |
References | p. 1.54 |
Ceramic Materials | |
Introduction | p. 1.58 |
Classes of Materials Covered | p. 1.65 |
Summary--Ceramics | p. 1.93 |
References | p. 1.93 |
Thermal Management | |
Introduction | p. 2.1 |
Why Thermal Management? | p. 2.2 |
Heat Flow Theory | p. 2.5 |
The Thermal Design | p. 2.35 |
Heat Sinks | p. 2.36 |
Circuit Card Assembly Cooling | p. 2.50 |
High heat-load cooling | p. 2.57 |
Special cooling devices | p. 2.66 |
Computer-Based Thermal Analysis | p. 2.75 |
Thermal Measurements | p. 2.79 |
References | p. 2.90 |
Thermal and Mechanical Stress Behavior in Electronic Packaging | |
Introduction | p. 3.1 |
Stress Generation and Fatigue | p. 3.2 |
Stress Environments | p. 3.5 |
Material Mechanical Properties | p. 3.8 |
Soft Solder Fatigue | p. 3.12 |
Mechanical and Thermomechanical Models | p. 3.13 |
Modified Coffin-Manson Equations | p. 3.18 |
Miner's Rule | p. 3.20 |
FEM Package Representation | p. 3.22 |
Thermal Analysis Using FEM | p. 3.24 |
Total Inelastic Strain Energy | p. 3.25 |
Crack Growth Theory | p. 3.25 |
Temperature Dependence of Properties | p. 3.27 |
Packaging Fatigue | p. 3.28 |
Die Cracking and Delamination | p. 3.28 |
Flip Chips | p. 3.31 |
Ball Grid Arrays | p. 3.36 |
Chip on Board | p. 3.37 |
Level-Two Packaging--Pin-in-Hole | p. 3.39 |
Leadless and Leaded Quad Packages | p. 3.40 |
FEM Stress Analysis of Temperature-Cycled LCCC Solder Joints | p. 3.42 |
Leaded Chip Carriers (Quad Flat Packages) | p. 3.45 |
Summary | p. 3.46 |
References | p. 3.47 |
Connector and Interconnection Technology | |
Connector Overview | p. 4.1 |
The Contact Interface | p. 4.6 |
The Contact Finish | p. 4.10 |
Contact Springs | p. 4.17 |
Connector Housings | p. 4.21 |
Separable Connections | p. 4.27 |
Permanent Connections | p. 4.33 |
Connector Applications | p. 4.49 |
Connector Types | p. 4.55 |
Connector Testing | p. 4.72 |
References | p. 4.80 |
Wiring and Cabling | |
Introduction | p. 5.1 |
Cabling Types | p. 5.2 |
Basic Construction | p. 5.4 |
Connector Characteristics | p. 5.45 |
Electromagnetic Interference and Shielding | p. 5.47 |
References | p. 5.55 |
Solder Technologies for Electronic Packaging and Assembly | |
Introduction | p. 6.1 |
Solder Materials | p. 6.6 |
Solder Paste | p. 6.23 |
Soldering Methodology | p. 6.31 |
Solderability | p. 6.50 |
Cleaning | p. 6.52 |
Fine-Pitch Application | p. 6.53 |
Soldering-Related Issues | p. 6.57 |
Solder-Joint Appearance and Microstructure | p. 6.66 |
Solder-Joint Integrity | p. 6.71 |
Lead-Free Solders | p. 6.78 |
References | p. 6.82 |
Interconnection Technologies | |
Packaging and Interconnection of Integrated Circuits | |
Introduction | p. 7.1 |
Conventional Package Technologies | p. 7.20 |
Advanced Package Technologies | p. 7.45 |
Comparison of Technologies | p. 7.59 |
Package Families | p. 7.61 |
Package Design Considerations | p. 7.67 |
Package IC Assembly Processes | p. 7.77 |
Outsourcing--Subcontract Assembly | p. 7.91 |
Package to Second-Level Interconnection | p. 7.94 |
Summary and Future Trends | p. 7.95 |
References | p. 7.97 |
Surface Mount Technologies | |
Introduction | p. 8.1 |
The Challenges of SMT | p. 8.2 |
Engineering Skills | p. 8.8 |
Electronics Packaging Families | p. 8.12 |
SMT Design for Manufacture | p. 8.26 |
Materials Impact on Process | p. 8.34 |
Process Guidelines for SMT Manufacturing | p. 8.41 |
Inspection and Quality Assurance | p. 8.72 |
Reliability | p. 8.78 |
References | p. 8.87 |
The Hybrid Microelectronics and Multichip Module Technologies | |
Introduction | p. 9.1 |
Ceramic Substrates for Microelectronic Applications | p. 9.2 |
Composite Materials | p. 9.9 |
Thick Film Technology | p. 9.11 |
Cermet Thick Film Conductor Materials | p. 9.18 |
Thick Film Resistor Materials | p. 9.20 |
Thick Film Dielectric Materials | p. 9.28 |
Overglaze Materials | p. 9.29 |
Conclusions | p. 9.30 |
Thin Film Technology | p. 9.30 |
Thin Film Materials | p. 9.35 |
Comparison of Thick and Thin Film | p. 9.37 |
Copper Metallization Technologies | p. 9.37 |
Summary of Substrate Metallization Technologies | p. 9.46 |
Resistor Trimming | p. 9.46 |
Assembly of Hybrid Circuits | p. 9.51 |
Packaging | p. 9.62 |
Design of Hybrid Circuits | p. 9.68 |
Multichip Modules | p. 9.71 |
References | p. 9.75 |
Chip Scale Packaging and Direct Chip Attach Technologies | |
Introduction | p. 10.1 |
Background and History | p. 10.2 |
Electronic Interconnection Regime | p. 10.5 |
Early Minimalist IC Packaging Solution | p. 10.6 |
Current Interconnection Trends | p. 10.7 |
Important Shared Issues | p. 10.7 |
Markets for CSP and DCA | p. 10.15 |
Direct Chip Attach Technologies | p. 10.19 |
Chip scale Packages | p. 10.26 |
Testing CSPs and Direct Attach Assemblies | p. 10.48 |
Summary | p. 10.58 |
References | p. 10.58 |
Rigid and Flexible Printed Wiring Boards and Microvia Technology | |
Introduction | p. 11.1 |
Printed Circuit Board System Types | p. 11.2 |
Printed Circuit Board Materials | p. 11.6 |
Design Considerations | p. 11.19 |
Manufacturing Considerations | p. 11.54 |
Microvias | p. 11.65 |
Industry Standards | p. 11.84 |
Suggested Reading | p. 11.86 |
Acknowledgment | p. 11.88 |
System Packaging Technologies | |
Packaging of High-Speed and Microwave Electronic Systems | |
Introduction | p. 12.1 |
Types of Circuit Media for Modern Microwave Packaging | p. 12.4 |
Limitations of Microwave Integrated Circuits | p. 12.9 |
Technology of Microwave Integrated Circuits | p. 12.13 |
Planar Waveguides | p. 12.21 |
Lumped-Element Circuits for Microwave Packages | p. 12.29 |
High-Speed Digital Packaging | p. 12.34 |
Electrical Design Inputs | p. 12.37 |
Netlist Analysis | p. 12.40 |
Design Restrictions | p. 12.42 |
PWB Layout Considerations | p. 12.52 |
Preferred Redesign Options | p. 12.54 |
CAD Interface | p. 12.57 |
References | p. 12.59 |
Packaging of High-Voltage Systems | |
Introduction | p. 13.1 |
Properties of Insulating Materials | p. 13.1 |
Field Stress and Configurations | p. 13.21 |
Aerospace Design Considerations | p. 13.29 |
Design and Manufacturing Guidelines | p. 13.37 |
Tests | p. 13.48 |
Problems and Suggested Solutions | p. 13.53 |
Conclusions | p. 13.54 |
References | p. 13.55 |
Electrical Characterization and Modeling of IC Packaging | |
Introduction | p. 14.1 |
Package Electrical Analysis | p. 14.2 |
Package Modeling | p. 14.23 |
Package Modeling Program | p. 14.34 |
Verification Method for Modeling Programs | p. 14.41 |
Summary | p. 14.52 |
References | p. 14.53 |
Electronic Packaging Terms and Abbreviations | p. 1 |
Index | p. 1 |
About the Editor | p. 1 |
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