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Failure Analysis A Practical Guide for Manufacturers of Electronic Components and Systems

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ISBN-10: 0470748249

ISBN-13: 9780470748244

Edition: 2011

Authors: Marius Bazu, Titu Bajenescu

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This book is divided into four main parts. The first section (10% of the text) offers an introduction to the subject of failure analysis (FA), describing the history as well as the new challenges in reliability testing, such as its use in microsystems and nanostructures. The second part discusses why failure analysis should be used with electronic components. Failure modes and mechanisms are looked at in detail, along with reliability physics and the failure analysis of materials. This section presents eight main reasons why FA is an important tool for improving yield and reliability by corrective actions. It explains a synergetic approach, emphasizing the cooperation needed between a whole…    
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Book details

Copyright year: 2011
Publisher: John Wiley & Sons, Limited
Publication date: 4/18/2011
Binding: Hardcover
Pages: 344
Size: 7.00" wide x 9.90" long x 0.94" tall
Weight: 1.628
Language: English

Series Editor's Foreword
Series Editor's Preface
About the Authors
The Three Goals of the Book
Historical Perspective
State of the Art and Future Trends
General Plan of the Book
Failure Analysis - Why?
Eight Possible Applications
Forensic Engineering
Reliability Modeling
Reverse Engineering
Controlling Critical Input Variables
Design for Reliability
Process Improvement
Saving Money by Early Control
A Synergetic Approach
Failure Analysis - When?
During Development Cycle
Preparing the Fabrication
FA during Fabrication
FA after Fabrication
FA during Operation or Storage
Failure Analysis - How?
Procedures for failure analysis
Techniques for decapsulating the device and for sample preparation
Techniques for failure analysis
Failure Analysis - What?
Failure Modes and Mechanisms at Various Process Steps
Failure Modes and Mechanisms of Passive Electronic Parts
Failure Modes and Mechanisms of Silicon Bipolar Technology
Failure Modes and Mechanisms of MOS Technology
Failure Modes and Mechanisms of Optoelectronic and Photonic Technologies
Failure Modes and Mechanisms of Non-Silicon Technologies
Failure Modes and Mechanisms of Hybrid Technology
Failure Modes and Mechanisms of Microsystem Technologies
Case Studies
Case Study No. 1: Capacitors
Case Study No. 2: Bipolar Power Devices
Case Study No. 3: CMOS Devices
Case Study No. 4: MOS Field Effect Transistors
Case Study No. 5: Thin Film Transistors
Case Study No. 6: High Electron Mobility Transistors
Case Study No. 7: MEMS Resonators
Case Study No. 8: MEMS Micro-Cantilevers
Case Study No. 9: MEMS Switches
Case Study No. 10: Magnetic MEMS Switches
Case Study No. 11: Chip-Scale Packages
Case Study No. 12: Solder Joints