Failure Analysis A Practical Guide for Manufacturers of Electronic Components and Systems

Name: Failure Analysis A Practical Guide for Manufacturers of Electronic Components and Systems
Price: 92.61 USD
Availability: InStock
ISBN: 9780470748244

ISBN-10: 0470748249

ISBN-13: 9780470748244

Edition: 2011

Authors: Marius Bazu, Titu Bajenescu

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Description:

This book is divided into four main parts. The first section (10% of the text) offers an introduction to the subject of failure analysis (FA), describing the history as well as the new challenges in reliability testing, such as its use in microsystems and nanostructures. The second part discusses why failure analysis should be used with electronic components. Failure modes and mechanisms are looked at in detail, along with reliability physics and the failure analysis of materials. This section presents eight main reasons why FA is an important tool for improving yield and reliability by corrective actions. It explains a synergetic approach, emphasizing the cooperation needed between a whole…

Book details

Copyright year: 2011
Publisher: John Wiley & Sons, Limited
Publication date: 4/18/2011
Binding: Hardcover
Pages: 344
Size: 7.00" wide x 9.90" long x 0.94" tall
Weight: 1.628
Language: English



Series Editor's Foreword


Foreword



Series Editor's Preface


Preface


About the Authors



Introduction



The Three Goals of the Book



Historical Perspective



Terminology



State of the Art and Future Trends



General Plan of the Book


References



Failure Analysis - Why?



Eight Possible Applications



Forensic Engineering



Reliability Modeling



Reverse Engineering



Controlling Critical Input Variables



Design for Reliability



Process Improvement



Saving Money by Early Control



A Synergetic Approach


References



Failure Analysis - When?



During Development Cycle



Preparing the Fabrication



FA during Fabrication



FA after Fabrication



FA during Operation or Storage


References



Failure Analysis - How?



Procedures for failure analysis



Techniques for decapsulating the device and for sample preparation



Techniques for failure analysis


References



Failure Analysis - What?



Failure Modes and Mechanisms at Various Process Steps



Failure Modes and Mechanisms of Passive Electronic Parts



Failure Modes and Mechanisms of Silicon Bipolar Technology



Failure Modes and Mechanisms of MOS Technology



Failure Modes and Mechanisms of Optoelectronic and Photonic Technologies



Failure Modes and Mechanisms of Non-Silicon Technologies



Failure Modes and Mechanisms of Hybrid Technology



Failure Modes and Mechanisms of Microsystem Technologies


References



Case Studies



Case Study No. 1: Capacitors



Case Study No. 2: Bipolar Power Devices



Case Study No. 3: CMOS Devices



Case Study No. 4: MOS Field Effect Transistors



Case Study No. 5: Thin Film Transistors



Case Study No. 6: High Electron Mobility Transistors



Case Study No. 7: MEMS Resonators



Case Study No. 8: MEMS Micro-Cantilevers



Case Study No. 9: MEMS Switches



Case Study No. 10: Magnetic MEMS Switches



Case Study No. 11: Chip-Scale Packages



Case Study No. 12: Solder Joints



Conclusions


References



Conclusions


References


Acronyms


Glossary


Index.