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Preface | |
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Overview of MEMS and Microsystems | |
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MEMS and Microsystem | |
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Typical MEMS and Microsystems Products | |
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Evolution of Microfabrication | |
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Microsystems and Microelectronics | |
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The Multidisciplinary Nature of Microsystems Design and Manufacture | |
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Microsystems and Miniaturization | |
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Application of Microsystems in Automotive Industry | |
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Application of Microsystems in Other Industries | |
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Markets for Microsystems | |
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Problems | |
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Working Principles of Microsystems | |
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Introduction | |
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Microsensors | |
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Microactuation | |
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MEMS with Microactuators | |
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Microaccelerometers | |
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Microfluidics | |
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Problems | |
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Engineering Science for Microsystems Design and Fabrication | |
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Introduction | |
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Atomic Structure of Matters | |
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Ions and Ionization | |
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Molecular Theory of Matter and Inter-molecular Forces | |
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Doping of Semiconductors | |
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The Diffusion Process | |
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Plasma Physics | |
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Electrochemistry | |
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Problems | |
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Engineering Mechanics for Microsystems Design | |
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Introduction | |
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Static Bending of Thin Plates | |
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Mechanical Vibration | |
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Thermomechanics | |
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Fracture Mechanics | |
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Thin Film Mechanics | |
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Overview on Finite Element Stress Analysis | |
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Problems | |
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Thermofluid Engineering and Microsystems Design | |
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Introduction | |
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Overview on the Basics of Fluid Mechanics in Macro and Mesoscales | |
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Basic Equations in Continuum Fluid Dynamics | |
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Laminar Fluid Flow in Circular Conduits | |
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Computational Fluid Dynamics | |
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Incompressible Fluid Flow in Microconduits | |
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Overview on Heat Conduction in Solids | |
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Heat Conduction in Multi-layered Thin Films | |
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Heat Conduction in Solids in Submicrometer Scale | |
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Problems | |
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Scaling Laws in Miniaturization | |
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Introduction to Scaling | |
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Scaling in Geometry | |
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Scaling in Rigid-Body Dynamics | |
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Scaling in Electrostatic Forces | |
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Scaling of Electromagnetic Forces | |
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Scaling in Electricity | |
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Scaling in Fluid Mechanics | |
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Scaling in Heat Transfer | |
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Problems | |
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Materials for MEMS and Microsystems | |
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Introduction | |
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Substrates and Wafers | |
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Active Substrate Materials | |
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Silicon as a Substrate Material | |
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Silicon Compounds | |
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Silicon Piezoresistors | |
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Gallium Arsenide | |
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Quartz | |
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Piezoelectric Crystals | |
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Polymers | |
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Packaging Materials | |
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Problems | |
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Microsystems Fabrication Processes | |
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Introduction | |
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Photolithography | |
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Ion Implantation | |
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Diffusion | |
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Oxidation | |
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Chemical Vapor Deposition | |
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Physical Vapor Deposition - Sputtering | |
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Deposition by Epitaxy | |
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Etching | |
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Summary of Microfabrication | |
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Problems | |
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Overview of Micromanufacturing | |
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Introduction | |
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Bulk Micromanufacturing | |
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Surface Micromachining | |
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The LIGA Process | |
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Summary on Micromanufacturing | |
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Problems | |
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Microsystem Design | |
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Introduction | |
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Design Considerations | |
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Process Design | |
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Mechanical Design | |
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Mechanical Design Using Finite Element Method | |
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Design of Silicon Die of a Micropressure Sensor | |
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Design of Microfluidics Network Systems | |
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Computer-Aided Design | |
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Problems | |
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Assembly, Packaging and Testing of Microsystems | |
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Introduction | |
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Overview of Microassembly | |
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The High Costs of Microassembly | |