Skip to content

Coombs' Printed Circuits Handbook

ISBN-10: 0071350160

ISBN-13: 9780071350167

Edition: 5th 2002 (Revised)

Authors: Clyde F. Coombs

List price: $125.00
Blue ribbon 30 day, 100% satisfaction guarantee!
Buy eBooks
what's this?
Rush Rewards U
Members Receive:
Carrot Coin icon
XP icon
You have reached 400 XP and carrot coins. That is the daily max!

Description:

* The "bible" of printed circuit board (PCB) technology, revised by Clyde F. Coombs, Jr., the author of the original edition * Describes the processes used to make today's micro-PCBs and shows how they differ from past techniques A definitive reference source on the design, selection and operation of A/C and refrigeration systems
Customers also bought

Book details

List price: $125.00
Edition: 5th
Copyright year: 2002
Publisher: McGraw-Hill Professional Publishing
Binding: Mixed Media
Pages: 1200
Size: 7.50" wide x 9.50" long x 2.00" tall
Weight: 4.730
Language: English

List of Contributorsp. xxxvii
Prefacep. xxxix
Introduction to Printed Circuits
Electronic Packaging and High-Density Interconnectivityp. 3
Semiconductor Packaging Technologyp. 1
Advanced Packagingp. 1
Types of Printed Wiring Boardsp. 1
Materials
Introduction to Base Materialsp. 3
Base Material Componentsp. 1
Base Material Manufacturing Processesp. 1
Properties of Base Materialsp. 1
Densification Issues for Base Materialsp. 1
Introducing Base Materials into the PCB Manufacturing Processp. 1
HDI Microvia Materialsp. 1
Laminate Qualification and Testingp. 1
Engineering and Design
Physical Characteristics of PCBp. 3
The PCB Design Processp. 1
Electrical and Mechanical Design Parametersp. 1
Controlled Impedancep. 1
Multilayer Design Issuesp. 1
Planning for Design, Fabrication, and Assemblyp. 1
Manufacturing Information Documentation and Transferp. 1
Electronic Contract Manufacturing Supplier Selection and Managementp. 1
High-Density Interconnect
Introduction to High-Density Interconnection Technologyp. 3
High-Density Interconnect-Build-up Technologiesp. 1
Microvia Hole Technologiesp. 1
Fabrication Processes
Drilling Processesp. 3
High-Density Interconnect Drillingp. 1
Imagingp. 1
Multilayer Materials and Processingp. 1
Preparing Boards for Platingp. 1
Electroplatingp. 1
Direct Platingp. 1
PWB Manufacture Using Fully Electroless Copperp. 1
Surface Finishesp. 1
Etching Process and Technologiesp. 1
Solder Resist Material and Processesp. 1
Machining and Routingp. 1
Process Capability and Controlp. 1
Bare Board Test Objectives and Definitionsp. 1
Bare Board Test Methodsp. 1
Bare Board Test Equipmentp. 1
HDI Bare Board Special Testing Methodsp. 1
Assembly
Assembly Processesp. 3
Soldering
Design for Soldering and Solderabilityp. 3
Solder Materials and Processesp. 1
No-Clean Assembly Processp. 1
Lead-Free Solderingp. 1
Fluxes and Cleaningp. 1
Press-Fit Connectionsp. 1
Quality Control and Reliability
Acceptability of Fabricated Boardsp. 3
Acceptability of Printed Circuit Board Assembliesp. 1
Assembly Inspectionp. 1
Design for Testingp. 1
Loaded Board Testingp. 1
Reliability of Printed Circuit Assembliesp. 1
Component-to-PWB Reliabilityp. 1
Environmental Issues and Waste Treatment
Process Waste Minimization and Treatmentp. 3
Flexible Circuits
Flexible Circuits: Applications and Materialsp. 3
Design of Flexible Circuitsp. 1
Manufacturing of Flexible Circuitsp. 1
Termination of Flexible Circuitsp. 1
Special Constructions of Flexible Circuitsp. 1
Quality Assurance of Flexible Circuitsp. 1
Appendixp. 1
Glossaryp. 1
Indexp. 1
About the Authorp. 16
Table of Contents provided by Syndetics. All Rights Reserved.