| List of Contributors | p. xxxvii |
| Preface | p. xxxix |
| Introduction to Printed Circuits | |
| Electronic Packaging and High-Density Interconnectivity | p. 3 |
| Semiconductor Packaging Technology | p. 1 |
| Advanced Packaging | p. 1 |
| Types of Printed Wiring Boards | p. 1 |
| Materials | |
| Introduction to Base Materials | p. 3 |
| Base Material Components | p. 1 |
| Base Material Manufacturing Processes | p. 1 |
| Properties of Base Materials | p. 1 |
| Densification Issues for Base Materials | p. 1 |
| Introducing Base Materials into the PCB Manufacturing Process | p. 1 |
| HDI Microvia Materials | p. 1 |
| Laminate Qualification and Testing | p. 1 |
| Engineering and Design | |
| Physical Characteristics of PCB | p. 3 |
| The PCB Design Process | p. 1 |
| Electrical and Mechanical Design Parameters | p. 1 |
| Controlled Impedance | p. 1 |
| Multilayer Design Issues | p. 1 |
| Planning for Design, Fabrication, and Assembly | p. 1 |
| Manufacturing Information Documentation and Transfer | p. 1 |
| Electronic Contract Manufacturing Supplier Selection and Management | p. 1 |
| High-Density Interconnect | |
| Introduction to High-Density Interconnection Technology | p. 3 |
| High-Density Interconnect-Build-up Technologies | p. 1 |
| Microvia Hole Technologies | p. 1 |
| Fabrication Processes | |
| Drilling Processes | p. 3 |
| High-Density Interconnect Drilling | p. 1 |
| Imaging | p. 1 |
| Multilayer Materials and Processing | p. 1 |
| Preparing Boards for Plating | p. 1 |
| Electroplating | p. 1 |
| Direct Plating | p. 1 |
| PWB Manufacture Using Fully Electroless Copper | p. 1 |
| Surface Finishes | p. 1 |
| Etching Process and Technologies | p. 1 |
| Solder Resist Material and Processes | p. 1 |
| Machining and Routing | p. 1 |
| Process Capability and Control | p. 1 |
| Bare Board Test Objectives and Definitions | p. 1 |
| Bare Board Test Methods | p. 1 |
| Bare Board Test Equipment | p. 1 |
| HDI Bare Board Special Testing Methods | p. 1 |
| Assembly | |
| Assembly Processes | p. 3 |
| Soldering | |
| Design for Soldering and Solderability | p. 3 |
| Solder Materials and Processes | p. 1 |
| No-Clean Assembly Process | p. 1 |
| Lead-Free Soldering | p. 1 |
| Fluxes and Cleaning | p. 1 |
| Press-Fit Connections | p. 1 |
| Quality Control and Reliability | |
| Acceptability of Fabricated Boards | p. 3 |
| Acceptability of Printed Circuit Board Assemblies | p. 1 |
| Assembly Inspection | p. 1 |
| Design for Testing | p. 1 |
| Loaded Board Testing | p. 1 |
| Reliability of Printed Circuit Assemblies | p. 1 |
| Component-to-PWB Reliability | p. 1 |
| Environmental Issues and Waste Treatment | |
| Process Waste Minimization and Treatment | p. 3 |
| Flexible Circuits | |
| Flexible Circuits: Applications and Materials | p. 3 |
| Design of Flexible Circuits | p. 1 |
| Manufacturing of Flexible Circuits | p. 1 |
| Termination of Flexible Circuits | p. 1 |
| Special Constructions of Flexible Circuits | p. 1 |
| Quality Assurance of Flexible Circuits | p. 1 |
| Appendix | p. 1 |
| Glossary | p. 1 |
| Index | p. 1 |
| About the Author | p. 16 |
| Table of Contents provided by Syndetics. All Rights Reserved. |