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Marketplace listings for: Through-Silicon Vias for 3D Integration

ISBN-10: 0071785140
ISBN-13: 9780071785143
Edition: 2012
Authors: John H. Lau

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Seller: Internationalbooks81 (83% rating)
Ships from: TX, United States
Expedited shipping available
$109.82 + $2.99 shipping
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Seller notes: New, US edition. Satisfaction guaranteed!!

New

Seller: Alibris Marketplace (73% rating)
Ships from: CA, United States
$118.51 + $2.99 shipping
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Seller notes: New Book Original US edition, We Ship to PO BOX Address also.

New

Seller: Internationalbooks81 (83% rating)
Ships from: TX, United States
Expedited shipping available
$109.82 + $2.99 shipping
Add to cart
Seller notes: New, US edition. Satisfaction guaranteed!!

New

Seller: Alibris Marketplace (73% rating)
Ships from: CA, United States
$118.51 + $2.99 shipping
Add to cart
Seller notes: New Book Original US edition, We Ship to PO BOX Address also.
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