Study of Snagcu Alloy Reliability

ISBN-10: 3639133277
ISBN-13: 9783639133271
Edition: 2009
Authors: Krishna Tunga
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Description: This work aims to understand the reliability of SnAgCu solder interconnects used in PBGA packages using microstructure evolution, laser moire interferometry and finite-element modeling. A particle coarsening based microstructure evolution of the  More...

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Book details

Copyright year: 2009
Publisher: .AV Akademikerverlag GmbH & Co. KG
Binding: Paperback
Pages: 188
Size: 6.00" wide x 9.00" long x 0.43" tall
Weight: 0.638
Language: English

This work aims to understand the reliability of SnAgCu solder interconnects used in PBGA packages using microstructure evolution, laser moire interferometry and finite-element modeling. A particle coarsening based microstructure evolution of the solder joint material during thermal excursions was studied for extended periods of time lasting for several months. The microstructure evolution and particle coarsening was quantified, and acceleration factors were determined between benign field-use conditions and ATC conditions for PBGA packages with different form factors and for two different lead-free solder alloys. A new technique using laser moire interferometry was developed to assess the deformation behavior of SnAgCu based solder joints during thermal excursions. This technique can used to estimate the fatigue life of solder joints quickly in a matter of few days instead of months. FEA in conjunction with experimental data from the ATC for different lead-free PBGA packages was used to develop a fatigue life model that can be used to predict solder joint fatigue life for any PBGA package."

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