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Preface | |
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Glossary of Symbols | |
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Fundamentals | |
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Impedance of Linear, Time-Invariant, Lumped-Element Circuits | |
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Power Ratios | |
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Rules of Scaling | |
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Scaling of Physical Size | |
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Power Scaling | |
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Time Scaling | |
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Impedance Scaling with Constant Voltage | |
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Dielectric-Constant Scaling | |
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Magnetic Permeability Scaling | |
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The Concept of Resonance | |
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Extra for Experts: Maximal Linear System Response to a Digital Input | |
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Transmission Line Parameters | |
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Telegrapher's Equations | |
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So Good It Works on Barbed Wire | |
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The No-Storage Principle and Its Implications for Returning Signal Current | |
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Derivation of Telegrapher's Equations | |
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Definition of Characteristic Impedance ZC | |
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Changes in Characteristic Impedance | |
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Calculation of Impedance Zc From Parameters R, L, G, And C | |
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Definition of Propagation Coefficient [gamma] | |
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Calculation of Propagation Coefficient [gamma] from Parameters R, L, G, and C | |
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Ideal Transmission Line | |
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DC Resistance | |
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DC Conductance | |
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Skin Effect | |
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What Causes the Skin Effect, and What Does It Have to Do With Skin? | |
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Eddy Currents within a Conductor | |
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High and Low-Frequency Approximations for Series Resistance | |
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Skin-Effect Inductance | |
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Modeling Internal Impedance | |
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Practical Modeling of Internal Impedance | |
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Special Issues Concerning Rectangular Conductors | |
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Concentric-Ring Skin-Effect Model | |
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Modeling Skin Effect | |
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Regarding Modeling Skin Effect | |
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Proximity Effect | |
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Proximity Factor | |
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Proximity Effect for Coaxial Cables | |
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Proximity Effect for Microstrip and Stripline Circuits | |
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Last Words on Proximity Effect | |
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Surface Roughness | |
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Severity of Surface Roughness | |
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Onset of Roughness Effect | |
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Roughness of PCB Materials | |
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Controlling Roughness | |
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Dielectric Effects | |
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Dielectric Loss Tangent | |
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Rule of Mixtures | |
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Calculating the Loss Tangent for a Uniform Dielectric Mixture | |
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Calculating the Loss Tangent When You Don't Know q | |
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Causality and the Network Function Relations | |
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Finding [vertical bar]er[vertical bar] to Match a Measured Loss Tangent | |
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Kramers-Kronig Relations | |
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Complex Magnetic Permeability | |
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Impedance in Series with the Return Path | |
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Slow-Wave Mode On-Chip | |
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Performance Regions | |
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Signal Propagation Model | |
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Extracting Parameters for RLGC Simulators | |
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Hierarchy of Regions | |
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A Transmission Line Is Always a Transmission Line | |
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Necessary Mathematics: Input Impedance and Transfer Function | |
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Lumped-Element Region | |
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Boundary of Lumped-Element Region | |
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Pi Model | |
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Taylor-Series Approximation of H (Lumped-Element Region) | |
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Input impedance (Lumped-Element Region) | |
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Transfer Function (Lumped-Element Region) | |
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Step Response (Lumped-Element Region) | |
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RC Region | |
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Boundary of RC Region | |
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Input Impedance (RC Region) | |
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Characteristic Impedance (RC Region) | |
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General Behavior within RC Region | |
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Propagation Coefficient (RC Region) | |
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Transfer Function (RC Region) | |
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Normalized Step Response (RC Region) | |
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Tradeoffs Between Distance and Speed (RC Region) | |
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Closed-Form Solution for Step Response (RC Region) | |
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Elmore Delay Estimation (RC Region) | |
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LC Region (Constant-Loss Region) | |
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Boundary of LC Region | |
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Characteristic Impedance (LC Region) | |
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Influence of Series Resistance on TDR Measurements | |
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Propagation Coefficient (LC Region) | |
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Possibility of Severe Resonance within the LC Region | |
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Terminating an LC Transmission Line | |
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Tradeoffs Between Distance And Speed (LC Region) | |
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Mixed-Mode Operation (LC and RC Regions) | |
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Skin-Effect Region | |
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Boundary of Skin-Effect Region | |
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Characteristic Impedance (Skin-Effect Region) | |
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Influence of Skin-Effect on TDR Measurement | |
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Propagation Coefficient (Skin-Effect Region) | |
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Possibility of Severe Resonance within Skin-Effect Region | |
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Step Response (Skin-Effect Region) | |
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Tradeoffs Between Distance and Speed (Skin-Effect Region) | |
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Dielectric Loss Region | |
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Boundary of Dielectric-Loss-Limited Region | |
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Characteristic Impedance (Dielectric-Loss-Limited Region) | |
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Influence of Dielectric Loss on TDR Measurement | |
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Propagation Coefficient (Dielectric-Loss-Limited Region) | |
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Possibility of Severe Resonance within Dielectric-Loss Limited Region | |
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Step Response (Dielectric-Loss-Limited Region) | |
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Tradeoffs Between Distance and Speed (Dielectric-Loss Region) | |
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Waveguide Dispersion Region | |
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Boundary of Waveguide-Dispersion Region | |
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Summary of Breakpoints Between Regions | |
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Equivalence Principle for Transmission Media | |
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Scaling Copper Transmission Media | |
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Scaling Multimode Fiber-Optic Cables | |
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Linear Equalization: Long Backplane Trace Example | |
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Adaptive Equalization: Accelerant Networks Transceiver | |
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Frequency-Domain Modeling | |
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Going Nonlinear | |
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Approximations to the Fourier Transform | |
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Discrete Time Mapping | |
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Other Limitations of the FFT | |
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Normalizing the Output of an FFT Routine | |
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Deriving the DFT Normalization Factors | |
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Useful Fourier Transform-Pairs | |
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Effect of Inadequate Sampling Rate | |
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Implementation of Frequency-Domain Simulation | |
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Embellishments | |
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What if a Large Bulk-Transport Delay Causes the Waveform to Slide Off the end of the Time-Domain Window? | |
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How Do I Transform an Arbitrary Data Sequence? | |
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How Do I Shift the Time-Domain Waveforms? | |
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What If I Want to Model a More Complicated System? | |
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What About Differential Modeling? | |
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Checking the Output of Your FFT Routine | |
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Pcb (printed-circuit board) Traces | |
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Pcb Signal Propagation | |
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Characteristic Impedance and Delay | |
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Resistive Effects | |
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Dielectric Effects | |
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Mixtures of Skin Effect and Dielectric Loss | |
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Non-TEM Modes | |
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Limits to Attainable Distance | |
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SONET Data Coding | |
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Pcb Noise and Interference | |
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Pcb: Reflections | |
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Pcb Crosstalk | |
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Pcb Connectors | |
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Mutual Understanding | |
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Through-Hole Clearances | |
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Measuring Connectors | |
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Tapered Transitions | |
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Straddle-Mount Connectors | |
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Cable Shield Grounding | |
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Modeling Vias | |
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Incremental Parameters of a Via | |
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Three Models for a Via | |
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Dangling Vias | |
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Capacitance Data | |
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Inductance Data | |
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The Future of On-Chip Interconnections | |
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Differential Signaling | |
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Single-Ended Circuits | |
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Two-Wire Circuits | |
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Differential Signaling | |
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Differential and Common-Mode Voltages and Currents | |
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Differential and Common-Mode velocity | |
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Common-Mode Balance | |
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Common-Mode Range | |
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Differential to Common-Mode Conversion | |
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Differential Impedance | |
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Relation Between Odd-Mode and Uncoupled Impedance | |
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Why the Odd-Mode Impedance Is Always Less Than the Uncoupled Impedance | |
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Differential Reflections | |
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Pcb Configurations | |
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Differential (Microstrip) Trace Impedance | |
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Edge-Coupled Stripline | |
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Breaking Up a Pair | |
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Broadside-Coupled Stripline | |
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PCB Applications | |
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Matching to an External, Balanced Differential Transmission Medium | |
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Defeating ground bounce | |
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Reducing EMI with Differential Signaling | |
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Punching Through a Noisy Connector | |
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Reducing Clock Skew | |
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Reducing Local Crosstalk | |
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A Good Reference about Transmission Lines | |
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Differential Clocks | |
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Differential Termination | |
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Differential U-Turn | |
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Your Layout Is Skewed | |
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Buying Time | |
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Intercabinet Applications | |
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Ribbon-Style Twisted-Pair Cables | |
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Immunity to Large Ground Shifts | |
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Rejection of External Radio-Frequency Interference (RFI) | |
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Differential Receivers Have Superior Tolerance to Skin Effect and Other High-Frequency Losses | |
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LVDS Signaling | |
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Output Levels | |
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Common-Mode Output | |
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Common-Mode Noise Tolerance | |
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Differential-Mode Noise Tolerance | |
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Hysteresis | |
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Impedance Control | |
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Trace Radiation | |
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Risetime | |
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Input Capacitance | |
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Skew | |
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Fail-Safe | |
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Generic Building-Cabling Standards | |
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Generic Cabling Architecture | |
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SNR Budgeting | |
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Glossary of Cabling Terms | |
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Preferred Cable Combinations | |
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FAQ: Building-Cabling Practices | |
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Crossover Wiring | |
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Plenum-Rated Cables | |
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Laying cables in an Uncooled Attic Space | |
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FAQ: Older Cable Types | |
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100-Ohm Balanced Twisted-Pair Cabling | |
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UTP Signal Propagation | |
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UTP Modeling | |
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Adapting the Metallic-Transmission Model | |
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UTP Transmission Example: 10BASE-T | |
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UTP Noise and Interference | |
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UTP: Far-End Reflections | |
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UTP: Near-End Reflections | |
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UTP: Hybrid Circuits | |
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UTP: Near-End Crosstalk | |
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UTP: Alien crosstalk | |
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UTP: Far-End Crosstalk | |
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Power sum NEXT and ELFEXT | |
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UTP: Radio-Frequency Interference | |
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UTP: Radiation | |
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UTP Connectors | |
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Issues with Screening | |
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Category-3 UTP at Elevated Temperature | |
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150-Ohm STP-A Cabling | |
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150-[Omega] STP-A Signal Propagation | |
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150-[Omega] STP-A Noise and Interference | |
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150-[Omega] STP-A: Skew | |
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150-[Omega] STP-A: Radiation and Safety | |
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150-[Omega] STP-A: Comparison with UTP | |
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150-[Omega] STP-A Connectors | |
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Coaxial Cabling | |
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Coaxial Signal Propagation | |
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Stranded Center-Conductors | |
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Why 50 Ohms? | |
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50-Ohm Mailbag | |
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Coaxial Cable Noise and Interference | |
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Coax: Far-End Reflected Noise | |
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Coax: Radio Frequency Interference | |
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Coax: Radiation | |
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Coaxial Cable: Safety Issues | |
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Coaxial Cable Connectors | |
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Fiber-Optic Cabling | |
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Making Glass Fiber | |
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Finished Core Specifications | |
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Cabling the Fiber | |
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Wavelengths of Operation | |
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Multimode Glass Fiber-Optic Cabling | |
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Multimode Signal Propagation | |
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Why Is Graded-Index Fiber Better than Step-Index? | |
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Standards for Multimode Fiber | |
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What Considerations Govern the Use of 50-micron Fiber? | |
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Multimode Optical Performance Budget | |
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Jitter | |
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Multimode Fiber-Optic Noise and Interference | |
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Multimode Fiber Safety | |
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Multimode Fiber with Laser Source | |
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VCSEL Diodes | |
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Multimode Fiber-Optic Connectors | |
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Single-Mode Fiber-Optic Cabling | |
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Single-Mode Signal Propagation | |
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Single-Mode Fiber-Optic Noise and Interference | |
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Single-Mode Fiber Safety | |
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Single-Mode Fiber-Optic Connectors | |
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Clock Distribution | |
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Extra Fries, Please | |
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Arithmetic of Clock Skew | |
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Clock Repeaters | |
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Active Skew Correction | |
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Zero-Delay Clock Repeaters | |
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Compensating for Line Length | |
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Stripline vs. Microstrip Delay | |
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Importance of Terminating Clock Lines | |
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Effect of Clock Receiver Thresholds | |
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Effect of Split Termination | |
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Intentional Delay Adjustments | |
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Fixed Delay | |
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Adjustable Delays | |
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Automatically Programmable Delays | |
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Serpentine Delays | |
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Switchback Coupling | |
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Driving Multiple Loads with Source Termination | |
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To Tee or Not To Tee | |
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Driving Two Loads | |
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Daisy-Chain Clock Distribution | |
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Case Study of Daisy-Chained Clock | |
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The Jitters | |
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When Clock Jitter Matters | |
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Measuring Clock Jitter | |
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Power Supply Filtering for Clock Sources, Repeaters, and PLL Circuits | |
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Healthy Power | |
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Clean Power | |
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Intentional Clock Modulation | |
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Signal Integrity Mailbag | |
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Jitter-Free Clocks | |
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Reduced-Voltage Signaling | |
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Controlling Crosstalk on Clock Lines | |
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Reducing Emissions | |
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Time-Domain Simulation Tools and Methods | |
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Ringing in a New Era | |
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Signal Integrity Simulation Process | |
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How Much Modeling Do You Need? | |
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What Happens After Parameter Extraction? | |
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A Word of Caution | |
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The Underlying Simulation Engine | |
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Evolving Forward | |
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Pitfalls of SPICE-Like Algorithms | |
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Transmission Lines | |
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Interpreting Your Results | |
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Using SPICE Intelligently | |
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IBIS (I/O Buffer Information Specification) | |
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What Is IBIS? | |
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Who Created IBIS? | |
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What Is Good About IBIS? | |
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What's Wrong with IBIS? | |
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What You Can Do to Help | |
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IBIS: History and Future Direction | |
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IBIS Historical Overview | |
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Comparison to SPICE | |
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Future Directions | |
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IBIS: Issues with Interpolation | |
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IBIS: Issues with SSO Noise | |
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Nature of EMC Work | |
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EMC Simulation | |
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Power and Ground Resonance | |
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Collected References | |
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Points to Remember | |
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Building a Signal Integrity Department | |
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Calculation of Loss Slope | |
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Two-Port Analysis | |
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Simple Cases Involving Transmission Lines | |
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Fully Configured Transmission Line | |
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Complicated Configurations | |
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Accuracy of Pi Model | |
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Pi-Model Operated in the LC Region | |
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erf() | |
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Index | |