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| Preface | |
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| Contributors | |
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| Introduction to Direct-Write Technologies for Rapid Prototyping | |
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| Direct-Write Technologies | |
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| Electronics | |
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| Biomaterials | |
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| Miscellaneous Application Areas | |
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| Conclusions | |
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| Applications | |
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| Overview of Commercial and Military Application Areas in Passive and Active Electronic Devices | |
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| Introduction | |
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| Direct-Write Electronic Component Manufacturing | |
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| Making Direct-Write Processes a Reality | |
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| Applications of Direct-Write Manufacturing | |
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| Conclusions | |
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| Role of Direct-Write Tools and Technologies for Microelectronic Manufacturing | |
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| Introduction | |
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| Direct-Write Technology in the Microelectronics Industry | |
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| Next Generation System | |
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| Technology Diffusion in Microelectronic Industry | |
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| Conclusions | |
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| Direct-Write Materials and Layers for Electrochemical Power Devices | |
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| Introduction | |
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| Background | |
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| Need for Direct-Write Layers | |
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| Materials for Metal-Air Batteries and PEM Fuel Cells | |
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| Direct-Write Layers for Battery and Fuel Cell Applications | |
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| Conclusions | |
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| The Role of Direct Writing for Chemical and Biological Materials: Commercial and Military Sensing Applications | |
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| Introduction | |
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| Chemical Microsensors | |
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| Biosensors and Microwell Technology | |
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| Coating Techniques for Sensing Applications | |
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| Case Studies | |
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| Summary | |
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| Materials | |
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| Advanced Materials Systems for Ultra-Low-Temperature, Digital, Direct-Write Technologies | |
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| Introduction | |
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| Deposition Methods and Associated Materials Requirements | |
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| Super-Low-Fire Inks and Pastes | |
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| Conductors | |
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| Resistors | |
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| Dielectrics and Ferrites | |
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| Phosphor Materials for Information Display Technologies | |
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| Materials for Metal-Air Batteries and Proton Exchange Membrane Fuel Cells | |
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| Conclusions | |
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| Direct-Write Techniques | |
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| Direct Write Using Ink-Jet Techniques | |
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| Introduction | |
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| History | |
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| Background on Ink-Jet Technology | |
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| Jetting Materials | |
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| Pattern/Image Formation: Fluid/Substrate Interaction | |
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| Throughput Considerations | |
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| Direct-Write Applications | |
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| Commercial Systems | |
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| Future Trends | |
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| Summary | |
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| Micropen Printing of Electronic Components | |
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| Introduction | |
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| The Micropen | |
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| Rheological Characteristics of Thick-Film Pastes | |
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| Prototyping of Components from Commercial Slurries | |
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| Summary | |
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| Direct Write Thermal Spraying of Multilayer Electronics and Sensor Structures | |
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| Introduction | |
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| Process Description | |
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| Materials and Microstructural Characteristics | |
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| Multilayer Electronic Circuits and Sensors by Thermal Spray | |
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| Fine Feature Deposition by Direct-Write Thermal Spray | |
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| Summary | |
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| Dip-Pen Nanolithography: Direct Writing Soft Structures on the Sub-100-Nanometer-Length Scale | |
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| Introduction | |
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| Scanning Probe Microscope Methods | |
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| Dip-Pen Nanolithography Methods | |
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| Future Issues | |
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| Nanolithography with Electron Beams: Theory and Practice | |
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| Introduction | |
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| The Areal Image | |
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| Conventional Probe-Forming E-Beam Tools | |
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| Mathematical Approaches to Proximity Control | |
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| Summary and Conclusions | |
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| Focused Ion Beams for Direct Writing | |
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| Introduction | |
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| Equipment | |
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| Ion Solid Interaction | |
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| Applications | |
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| Conclusions | |
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| Laser Direct-Write Micromachining | |
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| Introduction | |
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| Trends in Microfabrication | |
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| Overview of Laser-Matter Interactions | |
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| Laser Micromachining | |
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| Summary | |
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| 3D Microengineering via Laser Direct-Write Processing Approaches | |
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| Introduction | |
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| The Laser Direct-Write 3D Processing Tool | |
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| Laser Material Interaction Physics | |
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| Topics Relevant to 3D Laser Microengineering | |
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| 3D Microfabrication by 2D Direct-Write Patterning Approaches | |
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| Direct-Write Volumetric (3D) Patterning | |
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| Tailoring the Material to Advantage | |
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| Summary and Conclusions | |
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| Flow- and Laser-Guided Direct Write of Electronic and Biological Components | |
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| Motivation | |
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| Fundamentals | |
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| Material Results | |
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| Electronic Components | |
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| Future Work | |
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| Conclusion | |
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| Laser-Induced Forward Transfer: An Approach to Single-Step Microfabrication | |
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| An Overview of the Laser-Induced Forward Transfer Process | |
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| Deposition of Single Elements | |
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| Deposition of Oxide Compounds | |
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| Transfer Mechanisms | |
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| Applications of LIFT | |
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| Summary and Conclusions | |
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| Matrix Assisted Pulsed Laser Evaporation-Direct Write (MAPLE-DW): A New Method to Rapidly Prototype Organic and Inorganic Materials | |
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| Introduction | |
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| Background | |
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| Matrix Assisted Pulsed Laser Evaporation-Direct Write | |
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| MAPLE-DW of Inorganic Materials | |
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| MAPLE-DW of Organic and Biomaterials | |
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| Summary and Future Work | |
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| Comparison to Other Approaches to Pattern Material | |
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| Technologies for Micrometer and Nanometer Pattern and Material Transfer | |
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| Introduction | |
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| Applications of Pattern Transfer Technologies | |
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| Overview of Pattern Transfer Technologies | |
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| Optical Lithographies | |
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| Extreme Ultraviolet Lithography | |
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| X-ray Lithography | |
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| Particle Lithographies | |
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| Proximal Probe Lithography | |
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| Other Pattern Transfer Methods | |
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| Applications of Material Transfer Technologies | |
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| Overview of Material Transfer Technologies | |
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| Fixed Pattern Subtractive Techniques | |
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| Programmable Subtractive Techniques | |
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| Fixed Pattern Additive Material Transfer Methods | |
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| Programmable Additive Liquid Methods | |
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| Beam-Based Programmable Additive Techniques | |
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| Other Programmable Additive Technologies | |
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| Three-Dimensional Rapid Microprototyping | |
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| Molding and Related Technologies | |
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| Pattern and Material Transfer by Self-Assembly | |
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| Comparison of Pattern and Material Transfer Techniques | |
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| Conclusion | |
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| Ancillary Techniques | |
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| Radiation Sources | |
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| Masks | |
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| Stage Motion and Pattern Alignment | |
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| Materials for Thin Films | |
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| Processes for Thin Films | |
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| Characterization of Materials and Tools | |
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| Metrology and Inspection of Patterns and Structures | |
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| Packaging | |
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| Permissions | |
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| Index | |