Electronic Packaging and Interconnection Handbook

ISBN-10: 0071430482

ISBN-13: 9780071430487

Edition: 4th 2005 (Revised)

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Description: Charles A. Harper's 4th edition on designing and manufacturing all the major types of electronic systems is considerably expanded. It draws upon the expertise of a dozen experts to make sense of this highly interdisciplinary field.

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Book details

List price: $206.00
Edition: 4th
Copyright year: 2005
Publisher: McGraw-Hill Professional Publishing
Publication date: 10/19/2004
Binding: Hardcover
Pages: 1000
Size: 7.50" wide x 9.25" long x 2.50" tall
Weight: 4.092
Language: English

Preface
Electronic Packaging Defined
Contributors
Fundamental Technologies
Materials for Electronic Packaging
Polymers for Electronic Packaging
Introduction
Future Electronic Packaging System Needs
Recent Advancements in Polymeric Materials for Electronic Packaging
Polymeric Materials For Microelectronics
Conclusions and Future Developments
Bibliography
Flip Chip Technology: Materials and Processes for the Next Generation of High-Performance Electronics
Basics
Under-Bump Metallization
Bumping Materials
Bumping Processes
Joining Materials and Agents
The Assembly Process
Encapsulation/Underfill
Substrates for Flip Chips
Features and Benefits
Limitations and Issues
Performance and Reliability
Applications
Summary and Conclusions
References
Ceramic Materials
Introduction
Classes of Materials Covered
Summary--Ceramics
References
Thermal Management
Introduction
Why Thermal Management?
Heat Flow Theory
The Thermal Design
Heat Sinks
Circuit Card Assembly Cooling
High heat-load cooling
Special cooling devices
Computer-Based Thermal Analysis
Thermal Measurements
References
Thermal and Mechanical Stress Behavior in Electronic Packaging
Introduction
Stress Generation and Fatigue
Stress Environments
Material Mechanical Properties
Soft Solder Fatigue
Mechanical and Thermomechanical Models
Modified Coffin-Manson Equations
Miner's Rule
FEM Package Representation
Thermal Analysis Using FEM
Total Inelastic Strain Energy
Crack Growth Theory
Temperature Dependence of Properties
Packaging Fatigue
Die Cracking and Delamination
Flip Chips
Ball Grid Arrays
Chip on Board
Level-Two Packaging--Pin-in-Hole
Leadless and Leaded Quad Packages
FEM Stress Analysis of Temperature-Cycled LCCC Solder Joints
Leaded Chip Carriers (Quad Flat Packages)
Summary
References
Connector and Interconnection Technology
Connector Overview
The Contact Interface
The Contact Finish
Contact Springs
Connector Housings
Separable Connections
Permanent Connections
Connector Applications
Connector Types
Connector Testing
References
Wiring and Cabling
Introduction
Cabling Types
Basic Construction
Connector Characteristics
Electromagnetic Interference and Shielding
References
Solder Technologies for Electronic Packaging and Assembly
Introduction
Solder Materials
Solder Paste
Soldering Methodology
Solderability
Cleaning
Fine-Pitch Application
Soldering-Related Issues
Solder-Joint Appearance and Microstructure
Solder-Joint Integrity
Lead-Free Solders
References
Interconnection Technologies
Packaging and Interconnection of Integrated Circuits
Introduction
Conventional Package Technologies
Advanced Package Technologies
Comparison of Technologies
Package Families
Package Design Considerations
Package IC Assembly Processes
Outsourcing--Subcontract Assembly
Package to Second-Level Interconnection
Summary and Future Trends
References
Surface Mount Technologies
Introduction
The Challenges of SMT
Engineering Skills
Electronics Packaging Families
SMT Design for Manufacture
Materials Impact on Process
Process Guidelines for SMT Manufacturing
Inspection and Quality Assurance
Reliability
References
The Hybrid Microelectronics and Multichip Module Technologies
Introduction
Ceramic Substrates for Microelectronic Applications
Composite Materials
Thick Film Technology
Cermet Thick Film Conductor Materials
Thick Film Resistor Materials
Thick Film Dielectric Materials
Overglaze Materials
Conclusions
Thin Film Technology
Thin Film Materials
Comparison of Thick and Thin Film
Copper Metallization Technologies
Summary of Substrate Metallization Technologies
Resistor Trimming
Assembly of Hybrid Circuits
Packaging
Design of Hybrid Circuits
Multichip Modules
References
Chip Scale Packaging and Direct Chip Attach Technologies
Introduction
Background and History
Electronic Interconnection Regime
Early Minimalist IC Packaging Solution
Current Interconnection Trends
Important Shared Issues
Markets for CSP and DCA
Direct Chip Attach Technologies
Chip scale Packages
Testing CSPs and Direct Attach Assemblies
Summary
References
Rigid and Flexible Printed Wiring Boards and Microvia Technology
Introduction
Printed Circuit Board System Types
Printed Circuit Board Materials
Design Considerations
Manufacturing Considerations
Microvias
Industry Standards
Suggested Reading
Acknowledgment
System Packaging Technologies
Packaging of High-Speed and Microwave Electronic Systems
Introduction
Types of Circuit Media for Modern Microwave Packaging
Limitations of Microwave Integrated Circuits
Technology of Microwave Integrated Circuits
Planar Waveguides
Lumped-Element Circuits for Microwave Packages
High-Speed Digital Packaging
Electrical Design Inputs
Netlist Analysis
Design Restrictions
PWB Layout Considerations
Preferred Redesign Options
CAD Interface
References
Packaging of High-Voltage Systems
Introduction
Properties of Insulating Materials
Field Stress and Configurations
Aerospace Design Considerations
Design and Manufacturing Guidelines
Tests
Problems and Suggested Solutions
Conclusions
References
Electrical Characterization and Modeling of IC Packaging
Introduction
Package Electrical Analysis
Package Modeling
Package Modeling Program
Verification Method for Modeling Programs
Summary
References
Electronic Packaging Terms and Abbreviations
Index
About the Editor
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