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| Preface | |
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| Electronic Packaging Defined | |
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| Contributors | |
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| Fundamental Technologies | |
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| Materials for Electronic Packaging | |
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| Polymers for Electronic Packaging | |
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| Introduction | |
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| Future Electronic Packaging System Needs | |
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| Recent Advancements in Polymeric Materials for Electronic Packaging | |
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| Polymeric Materials For Microelectronics | |
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| Conclusions and Future Developments | |
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| Bibliography | |
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| Flip Chip Technology: Materials and Processes for the Next Generation of High-Performance Electronics | |
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| Basics | |
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| Under-Bump Metallization | |
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| Bumping Materials | |
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| Bumping Processes | |
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| Joining Materials and Agents | |
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| The Assembly Process | |
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| Encapsulation/Underfill | |
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| Substrates for Flip Chips | |
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| Features and Benefits | |
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| Limitations and Issues | |
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| Performance and Reliability | |
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| Applications | |
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| Summary and Conclusions | |
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| References | |
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| Ceramic Materials | |
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| Introduction | |
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| Classes of Materials Covered | |
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| Summary--Ceramics | |
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| References | |
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| Thermal Management | |
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| Introduction | |
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| Why Thermal Management? | |
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| Heat Flow Theory | |
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| The Thermal Design | |
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| Heat Sinks | |
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| Circuit Card Assembly Cooling | |
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| High heat-load cooling | |
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| Special cooling devices | |
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| Computer-Based Thermal Analysis | |
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| Thermal Measurements | |
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| References | |
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| Thermal and Mechanical Stress Behavior in Electronic Packaging | |
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| Introduction | |
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| Stress Generation and Fatigue | |
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| Stress Environments | |
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| Material Mechanical Properties | |
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| Soft Solder Fatigue | |
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| Mechanical and Thermomechanical Models | |
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| Modified Coffin-Manson Equations | |
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| Miner's Rule | |
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| FEM Package Representation | |
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| Thermal Analysis Using FEM | |
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| Total Inelastic Strain Energy | |
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| Crack Growth Theory | |
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| Temperature Dependence of Properties | |
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| Packaging Fatigue | |
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| Die Cracking and Delamination | |
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| Flip Chips | |
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| Ball Grid Arrays | |
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| Chip on Board | |
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| Level-Two Packaging--Pin-in-Hole | |
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| Leadless and Leaded Quad Packages | |
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| FEM Stress Analysis of Temperature-Cycled LCCC Solder Joints | |
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| Leaded Chip Carriers (Quad Flat Packages) | |
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| Summary | |
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| References | |
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| Connector and Interconnection Technology | |
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| Connector Overview | |
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| The Contact Interface | |
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| The Contact Finish | |
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| Contact Springs | |
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| Connector Housings | |
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| Separable Connections | |
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| Permanent Connections | |
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| Connector Applications | |
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| Connector Types | |
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| Connector Testing | |
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| References | |
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| Wiring and Cabling | |
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| Introduction | |
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| Cabling Types | |
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| Basic Construction | |
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| Connector Characteristics | |
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| Electromagnetic Interference and Shielding | |
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| References | |
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| Solder Technologies for Electronic Packaging and Assembly | |
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| Introduction | |
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| Solder Materials | |
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| Solder Paste | |
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| Soldering Methodology | |
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| Solderability | |
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| Cleaning | |
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| Fine-Pitch Application | |
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| Soldering-Related Issues | |
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| Solder-Joint Appearance and Microstructure | |
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| Solder-Joint Integrity | |
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| Lead-Free Solders | |
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| References | |
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| Interconnection Technologies | |
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| Packaging and Interconnection of Integrated Circuits | |
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| Introduction | |
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| Conventional Package Technologies | |
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| Advanced Package Technologies | |
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| Comparison of Technologies | |
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| Package Families | |
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| Package Design Considerations | |
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| Package IC Assembly Processes | |
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| Outsourcing--Subcontract Assembly | |
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| Package to Second-Level Interconnection | |
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| Summary and Future Trends | |
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| References | |
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| Surface Mount Technologies | |
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| Introduction | |
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| The Challenges of SMT | |
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| Engineering Skills | |
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| Electronics Packaging Families | |
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| SMT Design for Manufacture | |
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| Materials Impact on Process | |
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| Process Guidelines for SMT Manufacturing | |
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| Inspection and Quality Assurance | |
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| Reliability | |
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| References | |
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| The Hybrid Microelectronics and Multichip Module Technologies | |
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| Introduction | |
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| Ceramic Substrates for Microelectronic Applications | |
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| Composite Materials | |
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| Thick Film Technology | |
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| Cermet Thick Film Conductor Materials | |
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| Thick Film Resistor Materials | |
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| Thick Film Dielectric Materials | |
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| Overglaze Materials | |
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| Conclusions | |
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| Thin Film Technology | |
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| Thin Film Materials | |
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| Comparison of Thick and Thin Film | |
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| Copper Metallization Technologies | |
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| Summary of Substrate Metallization Technologies | |
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| Resistor Trimming | |
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| Assembly of Hybrid Circuits | |
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| Packaging | |
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| Design of Hybrid Circuits | |
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| Multichip Modules | |
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| References | |
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| Chip Scale Packaging and Direct Chip Attach Technologies | |
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| Introduction | |
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| Background and History | |
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| Electronic Interconnection Regime | |
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| Early Minimalist IC Packaging Solution | |
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| Current Interconnection Trends | |
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| Important Shared Issues | |
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| Markets for CSP and DCA | |
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| Direct Chip Attach Technologies | |
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| Chip scale Packages | |
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| Testing CSPs and Direct Attach Assemblies | |
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| Summary | |
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| References | |
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| Rigid and Flexible Printed Wiring Boards and Microvia Technology | |
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| Introduction | |
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| Printed Circuit Board System Types | |
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| Printed Circuit Board Materials | |
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| Design Considerations | |
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| Manufacturing Considerations | |
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| Microvias | |
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| Industry Standards | |
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| Suggested Reading | |
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| Acknowledgment | |
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| System Packaging Technologies | |
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| Packaging of High-Speed and Microwave Electronic Systems | |
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| Introduction | |
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| Types of Circuit Media for Modern Microwave Packaging | |
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| Limitations of Microwave Integrated Circuits | |
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| Technology of Microwave Integrated Circuits | |
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| Planar Waveguides | |
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| Lumped-Element Circuits for Microwave Packages | |
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| High-Speed Digital Packaging | |
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| Electrical Design Inputs | |
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| Netlist Analysis | |
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| Design Restrictions | |
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| PWB Layout Considerations | |
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| Preferred Redesign Options | |
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| CAD Interface | |
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| References | |
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| Packaging of High-Voltage Systems | |
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| Introduction | |
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| Properties of Insulating Materials | |
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| Field Stress and Configurations | |
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| Aerospace Design Considerations | |
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| Design and Manufacturing Guidelines | |
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| Tests | |
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| Problems and Suggested Solutions | |
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| Conclusions | |
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| References | |
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| Electrical Characterization and Modeling of IC Packaging | |
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| Introduction | |
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| Package Electrical Analysis | |
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| Package Modeling | |
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| Package Modeling Program | |
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| Verification Method for Modeling Programs | |
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| Summary | |
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| References | |
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| Electronic Packaging Terms and Abbreviations | |
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| Index | |
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| About the Editor | |