Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies Direct Chip Attack

Name: Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies Direct Chip Attack
Price: 53.98 USD
Availability: InStock
ISBN: 9780071351416

ISBN-10: 0071351418

ISBN-13: 9780071351416

Edition: 2000

Authors: John H. Lau

List price: $89.95

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Low-Cost Flip Chip Technologies:For DCA, WLCSP, and PBGA AssembliesJohn H. LauThe first comprehensive and in-depth guide to low-cost flip chip technologies, this reference gives you cutting edge information on the most important new developments and latest research results in applying flip chip technologies to direct chip attach (DCA) - also called flip chip on board (FCOB), wafer level chip scale package (WLCSP), and plastic ball grid array (PBGA) package assemblies. For professionals active in flip chip research and development, those who wish to master flip chip problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their…

Book details

List price: $89.95
Copyright year: 2000
Publisher: McGraw-Hill Professional Publishing
Publication date: 2/8/2000
Binding: Hardcover
Pages: 585
Size: 6.00" wide x 9.00" long x 2.00" tall
Weight: 2.442
Language: English

John Lau graduated with a first class honours in womenswear design at London College of Fashion and has a masters in enterprise. John has worked in various roles within the fashion industry and has experience as a fashion stylist and writer for the international magazines Loaded and the Chinese edition of Vogue. He has helped new brands develop their creative and business direction both in the UK, Hong Kong and China, and continues to have an active role in fashion as a consultant for retail, branding, production and distribution.John is currently a Senior Lecturer in International Fashion Business at Manchester Metropolitan University, teaching on the Fashion Buying and Clothing Design and…

Foreword	p. xv
Preface	p. xvii
Acknowledgments	p. xxi
Integrated Circuit Packaging Trends	p. 1
Introduction	p. 1
IC Trends	p. 2
IC Density and Feature Size	p. 2
IC Operating Voltage	p. 3
Microprocessor, ASIC, DRAM, and SRAM	p. 4
Copper Interconnects	p. 6
Moore's Law	p. 8
Packaging Technology Update	p. 9
Area-Array Flip Chip Technology	p. 11
BGA Technology	p. 12
TCP	p. 12
TSOP and PQFP	p. 12
CSP and DCA	p. 13
Wafer-Level Packaging	p. 13
Summary	p. 16
References	p. 17
Chip-Level Interconnects: Wire Bonds and Solder Bumps	p. 27
Introduction	p. 27
Wire Bonds Versus Solder Bumps	p. 28
Assembly Process	p. 33
Major Equipment	p. 34
Cost of Materials	p. 35
Summary	p. 43
Wafer Bumping with Solders	p. 43
Evaporation Method	p. 44
Electroplating Method	p. 47
Under-Bump Metallurgy (UBM)	p. 48
Stencil Printing Method	p. 50
Solder Jet Printing Method	p. 55
Fly-Through Solder Jet Printing Method	p. 58
Micropunching Method	p. 61
Molten Solder Injection Method	p. 67
SuperSolder Method	p. 69
Microball Mounting Method	p. 72
Tacky Dots Method	p. 78
Solder Bumps on PCB Method	p. 84
Solder Bumps on AI Pads Without UBM	p. 84
Alpha Particle	p. 89
Wafer Bumping with Solderless Materials	p. 90
Acknowledgments	p. 90
References	p. 90
Lead-Free Solders	p. 95
Introduction	p. 95
Worldwide Efforts on Lead-Free Solders	p. 95
Physical and Mechanical Properties of Lead-Free Solders	p. 100
Determining Melting Temperature with a DSC	p. 100
Determining TCE with TMA	p. 103
Measuring Storage Modulus with DMA	p. 105
Measuring Moisture Absorption with TGA	p. 109
Steady-State Creep of Lead-Free Solders	p. 110
Isothermal Fatigue of Lead-Free Solders	p. 114
Thermal Fatigue of Lead-Free Solders	p. 115
Lead-Free Solders for Flip Chip Applications	p. 116
Melting Characteristics	p. 116
Electrical Resistivity	p. 116
Wetability	p. 118
Microhardness	p. 118
Acknowledgments	p. 118
References	p. 119
High-Density PCB and Substrates	p. 121
Introduction	p. 121
Categories of Vias	p. 122
Forming Microvias by Conventional Mechanical NC Drilling	p. 125
Forming Microvias by Laser Drilling	p. 126
Materials Choice with Laser Drilling	p. 127
CO[subscript 2] Laser	p. 128
UV-YAG Laser	p. 128
Excimer Laser	p. 130
Comparison of Excimer, UV-YAG, and CO[subscript 2] Lasers	p. 130
Photo-Defined Microvias	p. 132
Process for Photo-Defined Vias	p. 132
Notes on Photo-Defined Vias	p. 133
Materials Choice with Photo-Defined Vias	p. 133
Design Guidelines and Equipment with Photo-Defined Vias	p. 134
Reliability Data with Photo-Defined Vias	p. 134
Chemical (Wet)- and Plasma (Dry)-Etched Microvias	p. 135
Process for Etched Vias	p. 135
Notes on Plasma-Etched Vias	p. 136
Conductive-Ink-Formed Microvias	p. 136
Materials Choice	p. 138
Fabrication Process of CB100	p. 138
Fabrication Process of ALIVH	p. 140
Reliability of Conductive-Ink-Formed Vias	p. 140
Microvia Production in Japan	p. 141
Fujitsu Limited	p. 141
Hitachi Chemical Co.	p. 142
Ibiden	p. 142
IBM at Yasu	p. 142
JVC	p. 142
Matsushita	p. 143
NEC	p. 143
Toshiba	p. 143
Summary	p. 143
Micro Via-in-Pad (VIP)	p. 145
Useful Design Charts for High-Speed Circuits	p. 145
Acknowledgments	p. 154
References	p. 154
Flip Chip on Board with Solderless Materials	p. 157
Introduction	p. 157
FCOB Assemblies with ACF	p. 157
The Wafer	p. 158
Wafer Bumping with Au, Cu, and Ni-Au	p. 159
PCB	p. 163
ACF	p. 164
FCOB Assembly with ACF	p. 165
Thermal Cycling Test of FCOB Assemblies with ACF	p. 170
SIR Test Results of FCOB Assemblies with ACF	p. 172
Summary	p. 172
FCOB Assemblies with ACA	p. 173
IC, PCB, and ACA Materials	p. 174
FCOB with Ni-Au Bumps and ACA	p. 175
FCOB with Au Bumps and ACA	p. 178
Accelerated Aging Test and Results	p. 178
Summary	p. 179
Acknowledgments	p. 181
References	p. 181
Flip Chip on Board with Conventional Underfills	p. 183
Introduction	p. 183
FCOB with High-Temperature Solder Bumps	p. 184
FCOB with Low-Temperature Solder Bumps	p. 186
Most Desirable Features of Underfills	p. 189
Handling and Application of Underfills	p. 190
Curing Conditions of Underfills	p. 191
Material Properties of Underfills	p. 193
TCE	p. 193
Storage Modulus	p. 194
Tan [delta] and T[subscript g]	p. 195
Moisture Content	p. 196
Young's Modulus	p. 197
Stress-Strain Relations	p. 199
Creep Curves	p. 200
Fracture Toughness of Underfills	p. 201
Fracture Toughness of Underfill-Chip Interfaces	p. 202
Fracture Toughness of Underfill-PCB Interfaces	p. 204
Flow Rate of FCOB with Underfills	p. 204
Shear Test of FCOB with Underfills	p. 206
Test Results	p. 206
Failure Modes	p. 206
Acknowledgments	p. 210
References	p. 210
Flip Chip on Board with No-Flow Underfills	p. 223
Introduction	p. 223
No-Flow Liquidlike Underfill Materials	p. 224
Curing Conditions of Liquidlike Underfills	p. 227
Material Properties of Liquidlike Underfills	p. 232
TCE	p. 232
Storage Modulus and Loss Modulus	p. 233
T[subscript g]	p. 233
Moisture Content	p. 234
FCOB Assembly with Liquidlike No-Flow Underfills	p. 237
Reliability Testing of FCOB with Liquidlike No-Flow Underfills	p. 240
Shear Test	p. 240
Thermal Cycling Test	p. 240
Nonlinear Finite Element Analysis of Liquidlike Underfills	p. 241
Summary and Recommendations for Liquidlike Underfills	p. 246
FCOB with Filmlike No-Flow Underfills	p. 251
Material	p. 251
Process	p. 251
Shear Test	p. 252
Summary and Recommendations	p. 253
Acknowledgments	p. 256
References	p. 256
Flip Chip on Board with Imperfect Underfills	p. 263
Introduction	p. 263
Possible Failure Modes of FCOB with Imperfect Underfills	p. 264
Fracture Mechanics in Finite Element Analysis	p. 265
FCOB with Imperfect Underfills near the Fillet Areas	p. 267
Problem Definition	p. 267
Effects of Imperfect Fillet Underfills on Solder Joint Reliability	p. 271
FCOB with Imperfect Underfills near the Corner Solder Joints (Chip Size Effect)	p. 277
Problem Definition	p. 277
Effects of Chip Size on Solder Joint Reliability Without Underfill	p. 278
Effects of Chip Size on Solder Joint Reliability with Perfect Underfill	p. 280
Effects of Chip Size on Solder Joint Reliability with Imperfect Underfill	p. 280
Summary	p. 282
FCOB with Imperfect Underfill near the Corner Solder Joints (PCB Thickness Effect)	p. 285
Problem Definition	p. 285
Stresses and Strains at the Corner Solder Joint	p. 285
Strain Energy Release Rate and Phase Angle at the Crack Tip	p. 289
Summary	p. 290
Effects of Underfill Voids on Solder Joint Reliability	p. 291
Problem Definition	p. 291
Stresses and Strains at the Corner Solder Joint	p. 292
Strain Energy Release Rate and Phase Angle at the Crack Tip	p. 294
Summary	p. 295
Acknowledgments	p. 298
References	p. 298
Thermal Management of Flip Chip on Board	p. 301
Introduction	p. 301
The SGS-Thomson Test Chip	p. 301
Effects of PCB Construction	p. 302
Effect of Air Flow	p. 303
Effects of Chip Size and Power Dissipation Area	p. 304
Heat Paths of Solder-Bumped Flip Chip on Board	p. 306
Effects of Solder Joint Population	p. 308
Effects of Signal Copper Content in PCB	p. 308
Effects of Underfill Materials	p. 309
Effects of Heat Sinks	p. 310
Summary	p. 312
Acknowledgments	p. 314
References	p. 314
Wafer-Level Packaging	p. 317
Introduction	p. 317
EPS/APTOS's WLCSP	p. 318
WLCSP Redistribution and Bumping	p. 318
WLCSP Solder Bump Height	p. 320
WLCSP Solder Bump Strength	p. 322
PCB Assembly of WLCSP	p. 322
Finite Element Modeling of WLCSP Assemblies	p. 323
Time-Temperature-Dependent Creep Analysis	p. 324
Life Prediction for WLCSP Corner Solder Joint	p. 329
Shear Test of WLCSP on Board	p. 330
Thermal Cycling of WLCSP on Board	p. 330
Summary	p. 330
Amkor/Anam's wsCSP	p. 331
wsCSP Design and Assembly Flow	p. 332
wsCSP Package-Level Reliability	p. 333
wsCSP on Board Reliability Tests	p. 336
Summary	p. 339
Hyundai's Omega-CSP	p. 339
Design of Omega-CSP	p. 339
Materials for Omega-CSP	p. 341
Processing of Omega-CSP	p. 341
Reliability of Omega-CSP on Board	p. 343
FormFactor's WLCSP	p. 344
MicroSpring	p. 344
MicroSpring Flip Chip on Board	p. 345
Reliability of MicroSpring Flip Chip on Board	p. 346
Applications of MicroSpring Flip Chip on Board	p. 346
Tessera's WAVE	p. 348
Uniqueness of WAVE	p. 348
Design of WAVE	p. 350
Processing of WAVE	p. 350
Reliability of WAVE	p. 352
WAVE's Solution to Die Shrink	p. 353
Oxford's WLCSP	p. 353
Device Design	p. 356
Device Fabrication	p. 356
Processing of WLCSP for Optoelectronic Devices	p. 357
Acknowledgments	p. 359
References	p. 359
Solder-Bumped Flip Chip on Micro Via-in-Pad Substrates	p. 363
Introduction	p. 363
Flip Chip on Micro-VIP Substrate in a CSP	p. 363
IC Wafer for the 32-Pin SRAM Device	p. 364
Micro-VIP Substrate	p. 365
Solder-Bumped Flip Chip on Micro-VIP Substrate	p. 367
PCB Assembly of the Micro-VIP CSP	p. 367
Elastoplastic Analysis of the Micro-VIP	p. 370
Solder Joint Reliability of the Micro-VIP CSP Assembly	p. 375
Summary	p. 379
Effects of Underfill on the Deformations of SLC Substrates	p. 380
Problem Definition	p. 380
Experimental Results: Fringe Patterns	p. 380
Global Deformation of Surface Laminar Layer	p. 382
Local Deformation: Photosensitive Dielectric Layer	p. 383
Local Deformation: Solder Mask	p. 383
Local Deformation: Microvia	p. 384
Summary	p. 385
Acknowledgments	p. 385
References	p. 386
PCB Manufacturing, Testing, and Assembly of RIMMs	p. 389
Introduction	p. 389
PCB Manufacturing and Testing of Rambus Modules	p. 392
Electrical Requirements of Rambus Modules	p. 392
Manufacturing of Rambus Modules	p. 392
Electrical Measurement of Rambus Modules	p. 396
Measurement Results	p. 398
Summary and Recommendations	p. 402
PCB Assembly of [mu]BGA on Rambus Modules	p. 403
Tessera's [mu]BGA Component	p. 403
Test Board	p. 404
Assembly Flow Chart	p. 405
Paste, Printing, and Pick and Place	p. 405
Solder Reflow	p. 406
Two-Sided Assembly Results	p. 408
Shear Test and Results	p. 410
Thermal Cycling Test and Results	p. 411
Finite Element Modeling and Results	p. 413
Summary	p. 415
Acknowledgments	p. 415
References	p. 415
Wire Bonding Chip (Face-Up) in PBGA Packages	p. 417
Introduction	p. 417
Measurements of Popcorning of PBGA Packages	p. 417
Electrical Resistance Strain Gauge Method	p. 418
Solder Reflow of Dried PBGAs	p. 423
Solder Reflow of Moistured PBGAs	p. 427
Summary	p. 433
Popcorning of PBGA Packages by Fracture Mechanics	p. 434
Crack Initiation due to Thermal Expansion Mismatch	p. 435
Popcorning due to Thermal Expansion Mismatch and Pressure	p. 437
Fracture Mechanics Methods	p. 438
Fracture Mechanics Results	p. 440
Crack Growth in the Middle of the Die Attach	p. 442
Crack Growth at the Interface Between the Solder Mask and Copper	p. 447
Summary and Recommendations	p. 451
PCB Assembly of PBGA with Large PQFP Directly on the Opposite Side	p. 452
PBGA and PQFP Components	p. 452
Test Board	p. 454
Assembly Flow Chart	p. 454
Paste, Printing, and Pick and Place	p. 456
Solder Reflow	p. 456
Two-Sided Assembly Results	p. 456
Thermal Cycling Test and Results	p. 462
Summary	p. 463
Acknowledgments	p. 463
References	p. 464
Wire Bonding Chip (Face-Down) in PBGA Packages	p. 465
Introduction	p. 465
NuBGA Design Concepts	p. 466
Programmable VDD/VSS SVCs and Microstripline and Coplanar Stripline Traces	p. 467
Programmable VDD/VSS SWA and Microstripline and Coplanar Stripline Traces	p. 469
NuBGA Design Examples	p. 471
Conventional PCB Design Rules and Processes	p. 471
Electrically and Thermally Enhanced Low-Cost Package	p. 471
NuBGA Package Family	p. 474
NuBGA Electrical Performance	p. 474
NuBGA Package Parasitic Parameters	p. 474
NuBGA Package SSO Noise	p. 477
NuBGA Thermal Performance	p. 478
Problem Definition	p. 479
Temperature Distribution	p. 480
Thermal Resistance	p. 486
Cooling Power	p. 486
Solder Ball Temperature	p. 487
NuBGA Solder Joint Reliability	p. 490
Summary of the Standard NuBGA Packages	p. 493
Thinner Substrate and Nonuniform Heat Spreader NuBGA	p. 494
Thermal Performance of the New NuBGA Package	p. 496
Temperature Distribution	p. 496
Thermal Resistance	p. 496
Cooling Power	p. 498
Wind Tunnel Experimental Analysis	p. 500
Solder Joint Reliability of the New NuBGA Package	p. 504
Electrical Performance of the New NuBGA Package	p. 505
Capacitance	p. 505
Inductance	p. 506
Summary of the New NuBGA Package	p. 508
Acknowledgments	p. 508
References	p. 508
Solder-Bumped Flip Chip in PBGA Packages	p. 511
Introduction	p. 511
Intel's OLGA Package Technology	p. 511
OLGA Package Design	p. 513
OLGA Wafer Bumping	p. 513
OLGA Substrate Technology	p. 514
OLGA Package Assembly	p. 514
OLGA Package Reliability	p. 518
Mitsubishi's FC-BGA Package	p. 519
Wafer Bumping	p. 521
Mitsubishi's SBU Substrate	p. 523
PC-BGA Assembly Process	p. 523
Thermal Management	p. 525
Electrical Performance	p. 527
Qualification Tests and Results	p. 528
IBM's FC-PBGA Package	p. 529
Problem Definition	p. 529
CFD Analysis for Thermal Boundary Conditions	p. 530
Nonlinear Finite Element Stress Analysis	p. 531
Simulation Results	p. 534
Solder Joint Thermal Fatigue Life Prediction	p. 536
Motorola's FC-PBGA Packages	p. 537
Thermal Management of FC-PBGA Assemblies with E3 Bumps	p. 538
Solder Joint Reliability of FC-PBGA Assemblies with C4 Bumps	p. 544
Acknowledgments	p. 545
References	p. 547
Failure Analysis of Flip Chip on Low-Cost Substrates	p. 553
Introduction	p. 553
Failure Analysis of FCOB with Imperfect Underfills	p. 554
Test Chip	p. 554
Test Board	p. 556
Flip Chip Assembly	p. 556
Preconditions, Reflows, and Qualification Tests	p. 556
Failure Modes and Discussions	p. 557
Die Cracking	p. 562
Summary	p. 563
Interfacial Shear Strength	p. 566
Interfacial Shear Strength Between Solder Mask and Underfill	p. 566
Interfacial Shear Strength Between Passivation and Underfill	p. 567
Load Displacement Response of a Solder-Bumped FCOB Assembly	p. 568
Summary and Recommendations	p. 570
Acknowledgments	p. 572
References	p. 572
Index	p. 575
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