Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansysï¿½
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This book allows engineers to conduct fatigue reliability analysis of solder joints in electronic packages by describing the most widely-used method in detail, starting from the theoretical basis.
Copyright year: 2003
Publication date: 12/31/2002
Size: 6.25" wide x 9.25" long x 0.75" tall
|List of Commands|
|List of Tables|
|List of Figures|
|Thermomechanical Fatigue Life Prediction Analysis|
|Mechanical Bending Fatigue Life Prediction Analysis|
|Macro Reference Library|
|Installation and Execution|
|Input Listings for Case Studies|