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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys�

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ISBN-10: 1402073305

ISBN-13: 9781402073304

Edition: 2003

Authors: Erdogan Madenci, Ibrahim Guven, Bahattin Kilic

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This book allows engineers to conduct fatigue reliability analysis of solder joints in electronic packages by describing the most widely-used method in detail, starting from the theoretical basis.
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Book details

Copyright year: 2003
Publisher: Springer
Publication date: 12/31/2002
Binding: Hardcover
Pages: 185
Size: 6.25" wide x 9.25" long x 0.75" tall
Weight: 1.100
Language: English

List of Commands
List of Tables
List of Figures
Thermomechanical Fatigue Life Prediction Analysis
Mechanical Bending Fatigue Life Prediction Analysis
Macro Reference Library
Installation and Execution
Input Listings for Case Studies