Skip to content

Mechanics of Microelectronics

ISBN-10: 140204934X

ISBN-13: 9781402049347

Edition: 2006

Authors: G. Q. Zhang, W. D. van Driel, X. J. Fan

List price: $279.99
Shipping box This item qualifies for FREE shipping.
Blue ribbon 30 day, 100% satisfaction guarantee!
what's this?
Rush Rewards U
Members Receive:
Carrot Coin icon
XP icon
You have reached 400 XP and carrot coins. That is the daily max!

Description:

The technology trends of Microelectronics and Microsystems are mainly characterized by miniaturization down to the nano-scale, increasing levels of system and function integration, and the introduction of new materials, while the business trends are mainly characterized by cost reduction, shorter-time-to market and outsourcing. Combination of these trends leads to increasing design complexity, dramatically decreasing design margins and process windows, reducing product development and qualification times, increasing risks of failures, and increasing difficulties to meet quality, robustness and reliability requirements. Consequentially, thermo-mechanical related failures, accounting for more than 65% of the total reliability failures, become the bottleneck for both current and future product and technology developments. From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-failure mode. Their responses in manufacturing, assembling, qualification tests and application conditions are strongly nonlinear and stochastic. Mechanics of Microelectronics is extremely important and challenging, in terms of both industrial applications and academic research. Written by the leading experts with both profound knowledge and rich practical experience in advanced mechanics and microelectronics industry, this book aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains essential and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies, covering the contents of:The trends in Microelectronics and MicrosystemsReliability engineering and practicesThermal managementAdvanced mechanics Thermo-mechanics of integrated circuits and packagesCharacterization and modelling of moisture behaviourCharacterization and modelling of solder joint reliabilityVirtual thermo-mechanical prototypingChallenges and future perspectives.
Customers also bought

Book details

List price: $279.99
Copyright year: 2006
Publisher: Springer
Publication date: 6/23/2006
Binding: Hardcover
Pages: 566
Size: 6.25" wide x 9.25" long x 1.00" tall
Weight: 2.596
Language: English

Microelectronics technology
Introduction
A heart of silicon In a little black box
Baseline CMOS Non-CMOS options
Packaging Systems
Conclusions
References
Nomenclature Reliability practices
Introduction
Reliability assessment
Reliability statistics
Acceleration factor models
Failure mechanisms
Conclusions
References
Exercises Thermal Management
Introduction
Heat transfer basics
Thermal design of assemblies
Thermal design for a SQFP
Heatsink design choices
Conclusions / final remarks
References
Introduction to Advanced Mechanics
Introduction
Stress and strain
Failure criteria
Fracture mechanics
Finite element method
References
Exercises Thermo-Mechanics of Integrated Circuits and Packages
Introduction
IC Backend and packaging processes and testing
Thermo-mechanics of IC backend processes
Thermo-Mechanics of packaging processes
Thermo-Mechanics of coupled IC backend and packaging processes
Case studies
References
Exercises Characterization and Modeling of Moisture Behavior
Introduction
Moisture diffusion modeling
Characterization of moisture diffusivity and saturation concentration
Vapor pressure modeling
Hygroscopic swelling characterization & modeling
Single void
Instability behavior
Subjected to vapor pressure and thermal stress
Interface strength characterization and modeling
Case studies
References
Exercises Characterization and Modeling of Solder Joint Reliability
Introduction
Analytical-empirical prognosis of the reliability
Thermo-mechanical characteristics of soft solders
Data evaluation and Life-time estimation
Case studies
References
Exercises Virtual thermo-mechanical prototyping
Introduction
The state-of-the-art of virtual prototyping
Case studies
Conclusions
References
Exercises Challenges and future perspectives
Introduction
Product and process inputs
Tests and experiments
Multi-scale mechanics
Advanced simulation tools
Multi-physics modeling
Material and interface behavior
Simulation-based optimization
Conclusions
References