Materials for Electronic Packaging

Name: Materials for Electronic Packaging
Price: 360.82 USD
Availability: InStock
ISBN: 9780750693141

ISBN-10: 0750693142

ISBN-13: 9780750693141

Edition: 1995

Authors: Deborah D. L. Chung

List price: $300.00

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Description:

Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. the last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.

Book details

List price: $300.00
Copyright year: 1995
Publisher: Elsevier Science & Technology
Publication date: 3/31/1995
Binding: Hardcover
Pages: 368
Size: 6.25" wide x 9.25" long x 0.93" tall
Weight: 1.628
Language: English



Overview of materials for electronic packaging


Solderability fundamentals: role of microscopic processes


Determining the damaging strains which cause failure in lead tin solders


Fluxless soldering for microelectronic applications, The effect of microstructure on the bonding of metal/ceramic interfaces


The future of advanced composite electronic packaging


Low thermal expansion composite materials for electronic packaging


Electrically conducting polymer-matrix composites


Thick-film technology


Electroless copper for micropackaging and ultra large scale integrated circuit applications


Vacuum metallization for integrated circuit packages


Electrically conducting polymers and organic materials


Diamond films


Measurements of properties of materials in electronic packaging