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Materials for Electronic Packaging

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ISBN-10: 0750693142

ISBN-13: 9780750693141

Edition: 1995

Authors: Deborah D. L. Chung

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Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. the last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.
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Book details

Copyright year: 1995
Publisher: Elsevier Science & Technology Books
Publication date: 3/31/1995
Binding: Hardcover
Pages: 368
Size: 6.50" wide x 9.25" long x 1.00" tall
Weight: 1.584
Language: English

Overview of materials for electronic packaging
Solderability fundamentals: role of microscopic processes
Determining the damaging strains which cause failure in lead tin solders
Fluxless soldering for microelectronic applications, The effect of microstructure on the bonding of metal/ceramic interfaces
The future of advanced composite electronic packaging
Low thermal expansion composite materials for electronic packaging
Electrically conducting polymer-matrix composites
Thick-film technology
Electroless copper for micropackaging and ultra large scale integrated circuit applications
Vacuum metallization for integrated circuit packages
Electrically conducting polymers and organic materials
Diamond films
Measurements of properties of materials in electronic packaging