Advanced Electronic Packaging

ISBN-10: 0471466093

ISBN-13: 9780471466093

Edition: 2nd 2006 (Revised)

Authors: William D. Brown, Richard K. Ulrich

List price: $197.00
30 day, 100% satisfaction guarantee

If an item you ordered from TextbookRush does not meet your expectations due to an error on our part, simply fill out a return request and then return it by mail within 30 days of ordering it for a full refund of item cost.

Learn more about our returns policy


As in the "First Edition," each chapter in this new "Second Edition" is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the "First Edition," which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
what's this?
Rush Rewards U
Members Receive:
You have reached 400 XP and carrot coins. That is the daily max!
Study Briefs

Limited time offer: Get the first one free! (?)

All the information you need in one place! Each Study Brief is a summary of one specific subject; facts, figures, and explanations to help you learn faster.

Add to cart
Study Briefs
Business Ethics Online content $4.95 $1.99
Add to cart
Study Briefs
Business Law Online content $4.95 $1.99
Add to cart
Study Briefs
Management Online content $4.95 $1.99
Customers also bought

Book details

List price: $197.00
Edition: 2nd
Copyright year: 2006
Publisher: John Wiley & Sons, Incorporated
Publication date: 2/24/2006
Binding: Hardcover
Pages: 840
Size: 7.25" wide x 10.25" long x 1.75" tall
Weight: 4.246
Language: English

WILLIAM D. BROWN, PhD, is Associate Dean for Research, College of Engineering, and Distinguished Professor of Electrical Engineering, University of Arkansas. Since 1991, he has played an active role in sponsoring and guiding research at the University's High Density Electronics Center (HiDEC), which is dedicated to advancing the state of the art in electronics packaging materials and technologies.

Introduction and overview of microelectronic packaging
Materials for microelectronic packaging
Processing technologies
Organic printed circuit board materials and processes
Ceramic substrates
Electrical considerations, modeling, and simulation
Thermal considerations
Mechanical design considerations
Discrete and embedded passive devices
Electronic package assembly
Design considerations
Radio frequency and microwave packaging
Power electronics packaging
Multichip and three-dimensional packaging
Packaging of MEMS and MOEMS
Reliability considerations
Cost evaluation and analysis
Analytical techniques for materials characterization
Free shipping on orders over $35*

*A minimum purchase of $35 is required. Shipping is provided via FedEx SmartPost® and FedEx Express Saver®. Average delivery time is 1 – 5 business days, but is not guaranteed in that timeframe. Also allow 1 - 2 days for processing. Free shipping is eligible only in the continental United States and excludes Hawaii, Alaska and Puerto Rico. FedEx service marks used by permission."Marketplace" orders are not eligible for free or discounted shipping.

Learn more about the TextbookRush Marketplace.