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Science and Engineering of Microelectronic Fabrication

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ISBN-10: 0195136055

ISBN-13: 9780195136050

Edition: 2nd 2001 (Revised)

Authors: Stephen A. Campbell

List price: $129.00
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Ideal for upper-level undergraduate or first-year graduate courses and as a handy reference for professionals, The Science and Engineering of Microelectronic Fabrication, Second Edition, provides a thorough and accessible introduction to the field of microfabrication. Revised and expanded in this second edition, the text covers all the basic unit processes used to fabricate integrated circuits, including photolithography, plasma and reactive ion etching, ion implantation, diffusion, oxidation, evaporation, vapor phase epitaxial growth, sputtering, and chemical vapor deposition. Advanced processing topics such as rapid thermal processing, next generation lithography, molecular beam epitaxy,…    
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Book details

List price: $129.00
Edition: 2nd
Copyright year: 2001
Publisher: Oxford University Press, Incorporated
Publication date: 2/1/2001
Binding: Hardcover
Pages: 624
Size: 7.75" wide x 9.25" long x 1.50" tall
Weight: 2.640
Language: English

Overview and Materials
An Introduction to Microelectronic Fabrication
Microelectronic Technologies: A Simple Example
Unit Processes and Technologies
A Roadmap for the Course
Semiconductor Substrates
Phase Diagrams and Solid Solubility
Crystallography and Crystal Structure
Crystal Defects
Czochralski Growth
Bridgman Growth of GaAs
Float Zone Growth
Water Preparation and Specifications
Summary and Future TrendsProblemsReferences
Unit Process I: Hot Processing and Ion Implantation
Fick''s Diffusion Equation in One Dimension
Atomistic Models of Diffusion
Analytic Solutions of Fick''s Law
Corrections to Simple Theory
Diffusion Coefficients for Common Dopants
Analysis of Diffused Profiles
Diffusion in SiO2
Diffusion Systems
SUPREM Simulations of Diffusion Profiles
Thermal Oxidation
The Deal-Grove Model of Oxidation
The Linear and Parabolic Rate Coeffients
The Initial Oxidation Regime
The Structure of SiO2
Oxide Characterization
The Effects of Dopants During Oxidation and Polysilicon Oxidation
Oxidation-Induced Stacking Faults
Alternative Gate Insulators
Oxidation Systems
SUPREM Oxidations
Ion Implantation
Idealized Ion Implantation Systems
Coulomb Scattering
Vertical Projected Range
Channeling and Lateral Projected Range
Implantation Damage
Shallow Junction Formation
Buried Dielectrics
Ion Implantation Systems: Problems and Concerns
Implanted Profiles Using SUPREM
Rapid Thermal Processing
Gray Body Radiation, Heat Exchange, and Optical Absorption
High-Intensity Optical Sources and Chamber Design
Temperature Measurement
Thermoplastic Stress
Rapid Thermal Activation of Impurities
Rapid Thermal Processing of Dielectrics
Silicidation and Contact Formation
Alternative Rapid Thermal Processing Systems
Unit Processes 2: Pattern Transfer
Optical Lithography
Lithography Overview
The Modulation Transfer Function and Optical Exposures
Source Systems and Spatial Coherence
Contact/Proximity Printers
Projection Printers
Advanced Mask Concepts
Surface Reflections and Standing Waves
Photoresist Types
Organic Materials and Polymers
Typical Reactions of DQN Positive Photoresist
Contrast Curves
The Critical Modulation Transfer Function
Applying and Developing Photoresist
Second-Order Exposure Effects
Advanced Photoresists and Photoresist Processes
Nonoptical Lithographic Techniques
Interactions of High-Energy Beams with Matter
Direct Write Electron Beam Lithography Systems
Direct Write Electron Beam Lithography Summary and Outlook
X-Ray Sources
Proximity X-Ray Exposure Systems
Membrane Masks
Projection X-Ray Lithography
Projection Electron-Beam Lithography (SCALPEL)
E-Beam and X-Ray Resists
Radiation Damage in MOS Devices
Vacuum Science and Plasmas
The Kinetic Theory of Gasses
Gas Flow and Conductance
Pressure Ranges and Vacuum Pumps
Vacuum Seals and Pressure Measurement
The DC Glow Discharge
RF Discharges
High-Density Plasmas
Wet Etching
Chemical Mechanical Polishing
Basic Regimes of Plasma Etching
High-Pressure Plasma Etching
Ion Milling
Reactive Ion Etching
Damage in Reative Ion Etching
High-Density Plasma (HDP) Etching
Unit Processes 3: Thin Films
Physical Deposition: Evaporation and Sputterin