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| Overview and Materials | |
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| An Introduction to Microelectronic Fabrication | |
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| Microelectronic Technologies: A Simple Example | |
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| Unit Processes and Technologies | |
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| A Roadmap for the Course | |
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| Summary | |
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| Semiconductor Substrates | |
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| Phase Diagrams and Solid Solubility | |
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| Crystallography and Crystal Structure | |
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| Crystal Defects | |
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| Czochralski Growth | |
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| Bridgman Growth of GaAs | |
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| Float Zone Growth | |
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| Water Preparation and Specifications | |
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| Summary and Future TrendsProblemsReferences | |
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| Unit Process I: Hot Processing and Ion Implantation | |
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| Diffusion | |
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| Fick''s Diffusion Equation in One Dimension | |
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| Atomistic Models of Diffusion | |
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| Analytic Solutions of Fick''s Law | |
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| Corrections to Simple Theory | |
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| Diffusion Coefficients for Common Dopants | |
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| Analysis of Diffused Profiles | |
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| Diffusion in SiO2 | |
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| Diffusion Systems | |
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| SUPREM Simulations of Diffusion Profiles | |
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| SummaryProblemsReferences | |
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| Thermal Oxidation | |
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| The Deal-Grove Model of Oxidation | |
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| The Linear and Parabolic Rate Coeffients | |
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| The Initial Oxidation Regime | |
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| The Structure of SiO2 | |
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| Oxide Characterization | |
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| The Effects of Dopants During Oxidation and Polysilicon Oxidation | |
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| Oxidation-Induced Stacking Faults | |
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| Alternative Gate Insulators | |
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| Oxidation Systems | |
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| SUPREM Oxidations | |
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| SummaryProblemsReferences | |
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| Ion Implantation | |
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| Idealized Ion Implantation Systems | |
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| Coulomb Scattering | |
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| Vertical Projected Range | |
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| Channeling and Lateral Projected Range | |
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| Implantation Damage | |
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| Shallow Junction Formation | |
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| Buried Dielectrics | |
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| Ion Implantation Systems: Problems and Concerns | |
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| Implanted Profiles Using SUPREM | |
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| SummaryProblemsReferences | |
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| Rapid Thermal Processing | |
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| Gray Body Radiation, Heat Exchange, and Optical Absorption | |
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| High-Intensity Optical Sources and Chamber Design | |
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| Temperature Measurement | |
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| Thermoplastic Stress | |
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| Rapid Thermal Activation of Impurities | |
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| Rapid Thermal Processing of Dielectrics | |
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| Silicidation and Contact Formation | |
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| Alternative Rapid Thermal Processing Systems | |
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| SummaryProblemsReferences | |
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| Unit Processes 2: Pattern Transfer | |
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| Optical Lithography | |
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| Lithography Overview | |
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| Diffraction | |
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| The Modulation Transfer Function and Optical Exposures | |
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| Source Systems and Spatial Coherence | |
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| Contact/Proximity Printers | |
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| Projection Printers | |
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| Advanced Mask Concepts | |
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| Surface Reflections and Standing Waves | |
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| Alignment | |
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| SummaryProblemsReferences | |
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| Photoresists | |
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| Photoresist Types | |
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| Organic Materials and Polymers | |
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| Typical Reactions of DQN Positive Photoresist | |
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| Contrast Curves | |
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| The Critical Modulation Transfer Function | |
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| Applying and Developing Photoresist | |
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| Second-Order Exposure Effects | |
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| Advanced Photoresists and Photoresist Processes | |
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| SummaryProblemsReferences | |
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| Nonoptical Lithographic Techniques | |
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| Interactions of High-Energy Beams with Matter | |
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| Direct Write Electron Beam Lithography Systems | |
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| Direct Write Electron Beam Lithography Summary and Outlook | |
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| X-Ray Sources | |
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| Proximity X-Ray Exposure Systems | |
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| Membrane Masks | |
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| Projection X-Ray Lithography | |
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| Projection Electron-Beam Lithography (SCALPEL) | |
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| E-Beam and X-Ray Resists | |
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| Radiation Damage in MOS Devices | |
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| SummaryProblemsReferences | |
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| Vacuum Science and Plasmas | |
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| The Kinetic Theory of Gasses | |
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| Gas Flow and Conductance | |
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| Pressure Ranges and Vacuum Pumps | |
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| Vacuum Seals and Pressure Measurement | |
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| The DC Glow Discharge | |
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| RF Discharges | |
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| High-Density Plasmas | |
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| SummaryProblemsReferences | |
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| Etching | |
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| Wet Etching | |
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| Chemical Mechanical Polishing | |
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| Basic Regimes of Plasma Etching | |
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| High-Pressure Plasma Etching | |
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| Ion Milling | |
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| Reactive Ion Etching | |
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| Damage in Reative Ion Etching | |
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| High-Density Plasma (HDP) Etching | |
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| Liftoff | |
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| SummaryProblemsReferences | |
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| Unit Processes 3: Thin Films | |
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| Physical Deposition: Evaporation and Sputterin | |