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Contributors | |
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Preface | |
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Technology Advances | |
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History of Fiber Optics | |
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Earliest Civilization to the Printing Press | |
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The Next 500 Years: Printing Press to Year 2000 | |
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Fiber Optic Communication Advancement, 1950-2000 | |
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Communication Storage and Retrieval | |
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Future of Fiber Optic Communications, 2000-2050 | |
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References | |
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Market Analysis and Business Planning | |
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Introduction | |
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The Need for Applications | |
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Supporting Technology Infrastructure | |
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Implementing a Market Survey | |
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Business Planning | |
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Summary | |
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Market Analysis on a Transmitter | |
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Optical Subassembly | |
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Industry Description and Outlook | |
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World Fiber Optics Industry | |
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Target Markets | |
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Competition | |
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Position | |
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Conclusion | |
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References | |
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Small Form Factor Fiber Optic Connectors | |
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Introduction | |
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MT-RJ Connector | |
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SC-DC Connector | |
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VF-45 Connector | |
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LC Connector | |
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Other Types of SFF Connectors | |
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Transceivers | |
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SFF Comparison | |
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References | |
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Specialty Fiber Optic Cables | |
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Introduction | |
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Fabrication of Conventional Fiber Cables | |
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Fiber Transport Services | |
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Polarization Controlling Fibers | |
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Dispersion Controlling Fibers | |
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Photosensitive Fibers | |
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Plastic Optical Fiber | |
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Optical Amplifiers | |
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Futures | |
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References | |
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Optical Wavelength Division Multiplexing for Data Communication Networks | |
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Introduction and Background | |
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Wavelength Multiplexing | |
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Commercial WDM Systems | |
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Intelligent Optical Internetworking | |
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Future Directions and Conclusions | |
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References | |
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Optical Backplanes, Board and Chip Interconnects | |
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Introduction | |
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Frame-to-Frame Interconnections | |
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Optical Backplanes | |
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Optical Board Interconnects | |
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Optical Chip Interconnections | |
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Conclusion | |
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References | |
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Parallel Computer Architectures Using Fiber Optics | |
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Introduction | |
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Historical and Current Processors | |
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Detailed Architecture Descriptions | |
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Optically Interconnected Parallel Supercomputers | |
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Parallel Futures | |
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References | |
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The Future | |
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Packaging Assembly Techniques | |
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Packaging Assembly--Overview | |
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Optoelectronic Packaging Overview | |
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Component Level Optoelectronic Packaging | |
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Module Level Optoelectronic Packaging | |
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System Level Optoelectronic Packaging | |
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References | |
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InfiniBand--The Interconnect from Backplane to Fiber | |
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Introduction | |
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Infiniband Link Layer | |
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Optical Signal and Jitter Methodology | |
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Optical Specifications | |
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Optical Receptacle and Connector | |
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Fiber Optic Cable Plant Specifications | |
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References | |
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New Devices for Optoelectronics: Smart Pixels | |
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Historical Perspective | |
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Multiple Quantum Well Devices | |
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Smart Pixel Technology | |
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Design Considerations | |
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Applications | |
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Future Trends and Directions | |
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References | |
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Emerging Technology for Fiber Optic Data Communication | |
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Introduction | |
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Architecture of All-Optical Network | |
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Tunable Transmitter | |
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Tunable Receiver | |
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Optical Amplifier | |
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Wavelength Multiplexer/Demultiplexer | |
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Wavelength Router | |
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Wavelength Converter | |
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Summary | |
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References | |
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Manufacturing Challenges | |
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Customer Requirements--Trends | |
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Manufacturing Requirements--Trends | |
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Manufacturing Alternatives | |
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Measurement Conversion Tables | |
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Physical Constants | |
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Index of Professional Organizations | |
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OSI Model | |
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Network Standards and Documents | |
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Data Network Rates | |
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Other Datacom Developments | |
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Acronyms | |
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Glossary | |
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Index | |