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Reliability of RoHS-Compliant 2D and 3D IC Interconnects

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ISBN-10: 0071753796

ISBN-13: 9780071753791

Edition: 2011

Authors: John H. Lau

List price: $92.99
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Book details

List price: $92.99
Copyright year: 2011
Publisher: McGraw-Hill Professional Publishing
Publication date: 12/16/2010
Binding: Hardcover
Pages: 640
Size: 6.50" wide x 9.50" long x 1.25" tall
Weight: 1.980
Language: English

John Lau graduated with a first class honours in womenswear design at London College of Fashion and has a masters in enterprise. John has worked in various roles within the fashion industry and has experience as a fashion stylist and writer for the international magazines Loaded and the Chinese edition of Vogue. He has helped new brands develop their creative and business direction both in the UK, Hong Kong and China, and continues to have an active role in fashion as a consultant for retail, branding, production and distribution.John is currently a Senior Lecturer in International Fashion Business at Manchester Metropolitan University, teaching on the Fashion Buying and Clothing Design and…    

Introduction to RoHS Compliant Semiconductor and Packaging Technologies
Reliability Engineering of Lead-Free Interconnects
Notes on Failure Criterion
Reliability of 1657-Pin CCGA Lead-Free Solder Joints
Reliability of PBGA Lead-Free Solder Joints (With and Without Underfills)
Reliability of LED Lead-Free Interconnects
Reliability of VCSEL Lead-Free Interconnects
Reliability of Low-Temperature Lead-Free (SnBiAg) Solder Joints
Reliability of Lead-Free (SACX) Solder Joints
Chip-to-Wafer (C2W) Bonding and Lead-Free Interconnect Reliability
Wafer-to-Wafer (W2W) Bonding and Lead-Free Interconnect Reliability
Through-Silicon-Via (TSV) Interposer Reliability
Electromigration of Lead-Free Microbumps for 3D IC Integration
Effects of Dwell-Time and Ramp-Rate on SAC Thermal Cycling Test Results
Effects of High Strain Rate (Impact) on SAC Solder Balls/Bumps
Effects of Voids on Solder Joints Reliability
Index