Skip to content

Wire Bonding in Microelectronics, 3/e

Spend $50 to get a free movie!

ISBN-10: 0071476237

ISBN-13: 9780071476232

Edition: 3rd 2010

Authors: George Harman

List price: $119.00
Blue ribbon 30 day, 100% satisfaction guarantee!
Out of stock
what's this?
Rush Rewards U
Members Receive:
Carrot Coin icon
XP icon
You have reached 400 XP and carrot coins. That is the daily max!

Description:

The classic sourcebook for designing and evaluating wire bonds engineered with the latest metallurgies_completely updated ..Wire bonding is the attachment of fine wires from semiconductor chips to their substratesa connection that is vital to the success of ever-shrinking consumer electronic devices, such as iPODs. Long-established as the industry standard, this book has been completely revised and expanded to cover wire bonding advances for the era of super-small electronics...Wire Bonding in Microelectronics, Second Edition,equips you with everything needed to design and evaluate wire bonds engineered with cutting-edge metallurgies. The Second Edition provides full details and…    
Customers also bought

Book details

List price: $119.00
Edition: 3rd
Copyright year: 2010
Publisher: McGraw-Hill Education
Publication date: 2/10/2010
Binding: Hardcover
Pages: 446
Size: 6.50" wide x 9.50" long x 1.25" tall
Weight: 1.694
Language: English

Steven E. Miller is Editor-in-chief of International Security and Directorof the International Security Program at the Belfer Center.George G. Harman is a Fellow of the National Institute of Standards and Technology's Semiconductor Electronics Division.

Introduction to Third Edition
Acknowledgments
Introduction to CD
The Technical Introduction to the Third Edition
Ultrasonic Bonding Systems and Technologies, Including a Description of the Ultrasonic Wire Bonding Mechanism
Bonding Wire Metallurgy and Characteristics That Can Affect Bonding, Reliability, or Testing
Wire Bond Testing
Gold-Aluminum Intermetallic Compounds and Other Metallic Interface Reactions in Wire Bonding
Introduction to Plating, Section a (Gold) and Section B (Nickel-Based) Bond Pad Technology and Reliability
Cleaning to Improve Bondability and Reliability
Mechanical Problems in Wire Bonding
Advanced and Specialized Wire Bonding Technologies
An Overview of the Materials and Material Science of Copper, Low-k Devices that Affect Bonding and Packaging
Wire Bonding Process Modeling and Simulation
Glossary
Bibliography
Index