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Epoxy Adhesive Formulations

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ISBN-10: 0071455442

ISBN-13: 9780071455442

Edition: 2006

Authors: Edward M. Petrie

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This comprehensive text presents a variety of methods to accomplish what up to now has been a formidable task. It begins with epoxy chemistry, moving on to fillers, filler treatments, and surfactants, and ending with current and future development in formulating epoxy adhesives.
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Book details

Copyright year: 2006
Publisher: McGraw-Hill Education
Publication date: 9/30/2005
Binding: Hardcover
Pages: 535
Size: 6.30" wide x 8.80" long x 1.67" tall
Weight: 1.870

Epoxy adhesives
Epoxy resin chemistry
Important properties of epoxy adhesives
Epoxy resins
Epoxy curing agents and catalysts
Solvents and diluents
Hybrid resins
Flexibilizers and tougheners
Fillers and extenders
Adhesion promoters and primers
Room temperature curing epoxy adhesives
Elevated-temperature curing liquid and paste epoxy adhesives
Solid epoxy adhesive systems
Unconventional epoxy adhesives
Effect of the service environment
Epoxy adhesives on selected substrates
Processing of epoxy adhesives
Health and safety issues
Quality control and specifications