Area Array Packaging Processes For BGA, Flip Chip, and CSP

Name: Area Array Packaging Processes For BGA, Flip Chip, and CSP
Price: 40.88 USD
Availability: InStock
ISBN: 9780071428293

ISBN-10: 0071428291

ISBN-13: 9780071428293

Edition: 2004

Authors: Ken Gilleo

List price: $129.50

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Description:

Written by a team of noted professionals and researchers in the field, this engineering reference covers the most important assembly processes in modern electronic packaging, including flip chip assembly and processes, die-attach, and BGA and CSP rework.

Book details

List price: $129.50
Copyright year: 2004
Publisher: McGraw-Hill Professional Publishing
Publication date: 10/23/2003
Binding: Hardcover
Pages: 259
Size: 7.25" wide x 9.25" long x 0.75" tall
Weight: 1.430
Language: English

Preface
Next-Generation Flip Chip Materials and Processing	p. 1
Flip Chip Assembly and Underfilling	p. 99
BGA and CSP Rework: What Is Involved?	p. 143
BGA Assembly Reliability	p. 171
Die Attach and Rework	p. 195
Liquid Encapsulation Equipment and Processes	p. 209
Molding for Area Array Packages	p. 235
Index	p. 253
Table of Contents provided by Blackwell. All Rights Reserved.