Fundamentals of Microsystems Packaging

ISBN-10: 0071371699

ISBN-13: 9780071371698

Edition: 2001

Authors: Steve Chapman, Rao Tummala

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Description:

*A rigorous and thorough introduction to electronic packaging technologies*Each chapter covers a single major packaging technology illustrated with schematics and diagrams*Aspects of electrical, mechanical, chemical, and materials packaging are identified in each chapter
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Book details

List price: $162.00
Copyright year: 2001
Publisher: McGraw-Hill Education
Publication date: 5/29/2001
Binding: Hardcover
Pages: 967
Size: 7.75" wide x 9.75" long x 1.50" tall
Weight: 3.498
Language: English

Introduction to Microsystems Packaging
The Role of Packaging in Microelectronics
The Role of Packaging in Microsystems
Fundamentals of Electrical Package Design
Fundamentals of Design for Reliability
Fundamentals of Thermal Management
Fundamentals of Single Chip Packaging
Funamentals of Multichip Packaging
Fundamentals of IC Assembly
Fundamentals of Water-Level Packaging
Fundamentals of Passives: Discrete, Integrated, and Embedded
Fundamentals of Optoelectronics
Fundamentals of RF Packaging
Fundamentals of Microelectromechanical Systems
Fundamentals of Sealing and Encapsulation
Fundamentals of System-Level PWB Technologies
Fundamentals of Board Assembly
Fundamentals of Packaging Materials and Processes
Fundamentals of Electrical Testing
Fundamentals of Package Manufacturing
Fundamentals of Microsystems Design for the Environment
Fundamentals of Microsstems Reliability
Glossary.
Table of Contents provided by Publisher. All Rights Reserved.
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