Electronic Packaging and Interconnection Handbook

Name: Electronic Packaging and Interconnection Handbook
Price: 7.78 USD
Availability: InStock
ISBN: 9780071347457

ISBN-10: 0071347453

ISBN-13: 9780071347457

Edition: 3rd 2000

Authors: Charles A. Harper

30 day, 100% satisfaction guarantee!

Marketplace

2 new & used from $7.78

what's this?

Rush Rewards U
Members Receive:

You have reached 400 XP and carrot coins. That is the daily max!

Charles A. Harper's 3rd edition on designing and manufacturing all the major types of electronic systems is considerably expanded. It draws upon the expertise of a dozen experts to make sense of this highly interdisciplinary field.

Book details

Edition: 3rd
Copyright year: 2000
Publisher: McGraw-Hill Professional Publishing
Publication date: 2/18/2000
Binding: Hardcover
Pages: 992
Size: 6.25" wide x 9.50" long x 2.25" tall
Weight: 3.498
Language: English

Preface	p. xi
Electronic Packaging Defined	p. xiii
Contributors	p. xiv
Fundamental Technologies
Materials for Electronic Packaging
Polymers for Electronic Packaging
Introduction	p. 1.1
Future Electronic Packaging System Needs	p. 1.2
Recent Advancements in Polymeric Materials for Electronic Packaging	p. 1.2
Polymeric Materials For Microelectronics	p. 1.3
Conclusions and Future Developments	p. 1.15
Bibliography	p. 1.15
Flip Chip Technology: Materials and Processes for the Next Generation of High-Performance Electronics
Basics	p. 1.22
Under-Bump Metallization	p. 1.24
Bumping Materials	p. 1.27
Bumping Processes	p. 1.30
Joining Materials and Agents	p. 1.34
The Assembly Process	p. 1.38
Encapsulation/Underfill	p. 1.41
Substrates for Flip Chips	p. 1.46
Features and Benefits	p. 1.48
Limitations and Issues	p. 1.49
Performance and Reliability	p. 1.51
Applications	p. 1.51
Summary and Conclusions	p. 1.53
References	p. 1.54
Ceramic Materials
Introduction	p. 1.58
Classes of Materials Covered	p. 1.65
Summary--Ceramics	p. 1.93
References	p. 1.93
Thermal Management
Introduction	p. 2.1
Why Thermal Management?	p. 2.2
Heat Flow Theory	p. 2.5
The Thermal Design	p. 2.35
Heat Sinks	p. 2.36
Circuit Card Assembly Cooling	p. 2.50
High heat-load cooling	p. 2.57
Special cooling devices	p. 2.66
Computer-Based Thermal Analysis	p. 2.75
Thermal Measurements	p. 2.79
References	p. 2.90
Thermal and Mechanical Stress Behavior in Electronic Packaging
Introduction	p. 3.1
Stress Generation and Fatigue	p. 3.2
Stress Environments	p. 3.5
Material Mechanical Properties	p. 3.8
Soft Solder Fatigue	p. 3.12
Mechanical and Thermomechanical Models	p. 3.13
Modified Coffin-Manson Equations	p. 3.18
Miner's Rule	p. 3.20
FEM Package Representation	p. 3.22
Thermal Analysis Using FEM	p. 3.24
Total Inelastic Strain Energy	p. 3.25
Crack Growth Theory	p. 3.25
Temperature Dependence of Properties	p. 3.27
Packaging Fatigue	p. 3.28
Die Cracking and Delamination	p. 3.28
Flip Chips	p. 3.31
Ball Grid Arrays	p. 3.36
Chip on Board	p. 3.37
Level-Two Packaging--Pin-in-Hole	p. 3.39
Leadless and Leaded Quad Packages	p. 3.40
FEM Stress Analysis of Temperature-Cycled LCCC Solder Joints	p. 3.42
Leaded Chip Carriers (Quad Flat Packages)	p. 3.45
Summary	p. 3.46
References	p. 3.47
Connector and Interconnection Technology
Connector Overview	p. 4.1
The Contact Interface	p. 4.6
The Contact Finish	p. 4.10
Contact Springs	p. 4.17
Connector Housings	p. 4.21
Separable Connections	p. 4.27
Permanent Connections	p. 4.33
Connector Applications	p. 4.49
Connector Types	p. 4.55
Connector Testing	p. 4.72
References	p. 4.80
Wiring and Cabling
Introduction	p. 5.1
Cabling Types	p. 5.2
Basic Construction	p. 5.4
Connector Characteristics	p. 5.45
Electromagnetic Interference and Shielding	p. 5.47
References	p. 5.55
Solder Technologies for Electronic Packaging and Assembly
Introduction	p. 6.1
Solder Materials	p. 6.6
Solder Paste	p. 6.23
Soldering Methodology	p. 6.31
Solderability	p. 6.50
Cleaning	p. 6.52
Fine-Pitch Application	p. 6.53
Soldering-Related Issues	p. 6.57
Solder-Joint Appearance and Microstructure	p. 6.66
Solder-Joint Integrity	p. 6.71
Lead-Free Solders	p. 6.78
References	p. 6.82
Interconnection Technologies
Packaging and Interconnection of Integrated Circuits
Introduction	p. 7.1
Conventional Package Technologies	p. 7.20
Advanced Package Technologies	p. 7.45
Comparison of Technologies	p. 7.59
Package Families	p. 7.61
Package Design Considerations	p. 7.67
Package IC Assembly Processes	p. 7.77
Outsourcing--Subcontract Assembly	p. 7.91
Package to Second-Level Interconnection	p. 7.94
Summary and Future Trends	p. 7.95
References	p. 7.97
Surface Mount Technologies
Introduction	p. 8.1
The Challenges of SMT	p. 8.2
Engineering Skills	p. 8.8
Electronics Packaging Families	p. 8.12
SMT Design for Manufacture	p. 8.26
Materials Impact on Process	p. 8.34
Process Guidelines for SMT Manufacturing	p. 8.41
Inspection and Quality Assurance	p. 8.72
Reliability	p. 8.78
References	p. 8.87
The Hybrid Microelectronics and Multichip Module Technologies
Introduction	p. 9.1
Ceramic Substrates for Microelectronic Applications	p. 9.2
Composite Materials	p. 9.9
Thick Film Technology	p. 9.11
Cermet Thick Film Conductor Materials	p. 9.18
Thick Film Resistor Materials	p. 9.20
Thick Film Dielectric Materials	p. 9.28
Overglaze Materials	p. 9.29
Conclusions	p. 9.30
Thin Film Technology	p. 9.30
Thin Film Materials	p. 9.35
Comparison of Thick and Thin Film	p. 9.37
Copper Metallization Technologies	p. 9.37
Summary of Substrate Metallization Technologies	p. 9.46
Resistor Trimming	p. 9.46
Assembly of Hybrid Circuits	p. 9.51
Packaging	p. 9.62
Design of Hybrid Circuits	p. 9.68
Multichip Modules	p. 9.71
References	p. 9.75
Chip Scale Packaging and Direct Chip Attach Technologies
Introduction	p. 10.1
Background and History	p. 10.2
Electronic Interconnection Regime	p. 10.5
Early Minimalist IC Packaging Solution	p. 10.6
Current Interconnection Trends	p. 10.7
Important Shared Issues	p. 10.7
Markets for CSP and DCA	p. 10.15
Direct Chip Attach Technologies	p. 10.19
Chip scale Packages	p. 10.26
Testing CSPs and Direct Attach Assemblies	p. 10.48
Summary	p. 10.58
References	p. 10.58
Rigid and Flexible Printed Wiring Boards and Microvia Technology
Introduction	p. 11.1
Printed Circuit Board System Types	p. 11.2
Printed Circuit Board Materials	p. 11.6
Design Considerations	p. 11.19
Manufacturing Considerations	p. 11.54
Microvias	p. 11.65
Industry Standards	p. 11.84
Suggested Reading	p. 11.86
Acknowledgment	p. 11.88
System Packaging Technologies
Packaging of High-Speed and Microwave Electronic Systems
Introduction	p. 12.1
Types of Circuit Media for Modern Microwave Packaging	p. 12.4
Limitations of Microwave Integrated Circuits	p. 12.9
Technology of Microwave Integrated Circuits	p. 12.13
Planar Waveguides	p. 12.21
Lumped-Element Circuits for Microwave Packages	p. 12.29
High-Speed Digital Packaging	p. 12.34
Electrical Design Inputs	p. 12.37
Netlist Analysis	p. 12.40
Design Restrictions	p. 12.42
PWB Layout Considerations	p. 12.52
Preferred Redesign Options	p. 12.54
CAD Interface	p. 12.57
References	p. 12.59
Packaging of High-Voltage Systems
Introduction	p. 13.1
Properties of Insulating Materials	p. 13.1
Field Stress and Configurations	p. 13.21
Aerospace Design Considerations	p. 13.29
Design and Manufacturing Guidelines	p. 13.37
Tests	p. 13.48
Problems and Suggested Solutions	p. 13.53
Conclusions	p. 13.54
References	p. 13.55
Electrical Characterization and Modeling of IC Packaging
Introduction	p. 14.1
Package Electrical Analysis	p. 14.2
Package Modeling	p. 14.23
Package Modeling Program	p. 14.34
Verification Method for Modeling Programs	p. 14.41
Summary	p. 14.52
References	p. 14.53
Electronic Packaging Terms and Abbreviations	p. 1
Index	p. 1
About the Editor	p. 1
Table of Contents provided by Syndetics. All Rights Reserved.