Skip to content

Process Engineering Analysis in Semiconductor Device Fabrication

Best in textbook rentals since 2012!

ISBN-10: 0070418535

ISBN-13: 9780070418530

Edition: 1993

Authors: Stanley Middleman, Arthur K. Hochberg

List price: $111.56
Blue ribbon 30 day, 100% satisfaction guarantee!
what's this?
Rush Rewards U
Members Receive:
Carrot Coin icon
XP icon
You have reached 400 XP and carrot coins. That is the daily max!

Description:

Written primarily for chemical engineering students, the material included in this new text is an extension of upper level chemical engineering courses. Covering a range of processes in semiconductor device fabrication, the authors try to present traditional chemical engineering methodology in a non-traditional context. The text covers such topics as crystal growth and filtration and contains over 300 worked examples and problems.
Customers also bought

Book details

List price: $111.56
Copyright year: 1993
Publisher: McGraw-Hill Higher Education
Binding: Hardcover
Pages: 672
Size: 7.00" wide x 9.75" long x 1.50" tall
Weight: 2.750
Language: English

Preface
Some Background in the Physics of Solids
States of Matter
Atomic Structures
The Crystalline Solid
Electronic Energy Bands in Solids
Extrinsic Semiconductors (Doping)
The Fermi-Dirac Distribution
Device Background
Materials Selection
The pn Junction
The Bipolar Transistor
The Unipolar Transistor
The Unit Operations of Semiconductor Device Fabrication
A Process Sequence for Fabrication of a Bipolar Transistor
Process Modeling
A Process Model
The Conservation Equations
Cleanliness and Purity in the Process Environment: Filtration of Particulates
Particulate Control
Clean Room Dynamics
Filtration of Airborne Particles
Pressure Drop across Fibrous Filters
Porous Membrane Ultrafiltration
Pressure Drop across Microporous Filters
Use of Pressure Drop Measurements to Correct Filtration Models
Particle Deposition and Removal
Deposition of Particles on Surfaces
The Physics of Adhesion of Particles to Surfaces
Mechanism of Removal of Particles from Surfaces
Analysis of Some Features of a Wafer Scrubber
Some Other Aspects of Jet Dynamics
Production and Maintenance of Purity in Process Chemicals
Production of Ultrapure Nitrogen
Maintenance of Chemical Purity through Recovery
Purification of Silicon Tetrachloride
Silicon Production
The Siemens Process
Czochralski Growth
Oxidation of Silicon
Dry Thermal Oxidation of Silicon
Wet Thermal Oxidation of Silicon
Mechanisms of Oxide Growth
Microlithography
Microstructure Fabrication
Some Aspects of Organic Resist Materials
The Kinetics of Development
Resist Profile Development
Spin Coating of Resist
Doping
Simple Fickian Diffusion Model of Doping
Resistivity of Diffused Layers
Doping Systems
Dopant Redistribution
Lateral Diffusion
Concentration-Dependent Diffusion
The Mathematics of Nonlinear Diffusion
Etching
The Plasma State
Plasma Etching
Plasma Reactor Dynamics
Anisotropy: Ion Etching and Chemical Etching
Wet Etching
Anisotropy in Wet Etching
Chemical Vapor Deposition
Chemical Thermodynamics
Chemical Kinetics
Reactor Design for CVD
Nonkinetic Aspects of Reactor Design
Ion Implantation
Is Ion Implantation Necessary?
The Ion Implantation System
The Implant Process
Metallization
Conductivity of Metals
Physical Vapor Deposition
Index