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Ball Grid Array Technology

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ISBN-10: 007036608X

ISBN-13: 9780070366084

Edition: 1995

Authors: John H. Lau

List price: $89.00
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Description:

This text covers ball grid array (BGA) design and manufacturing. BGA is a relatively new way of connecting leads from an integrated circuit package to a printed circuit board, allowing a higher pin count and function density than other connection methods and giving the lowest signal delay. These features make it an important component of modern high performance systems, but the density of leads makes manufacturing and process control very difficult.
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Book details

List price: $89.00
Copyright year: 1995
Publisher: McGraw-Hill Professional Publishing
Binding: Hardcover
Pages: 635
Size: 6.50" wide x 9.50" long x 1.00" tall
Weight: 2.046
Language: English

John Lau graduated with a first class honours in womenswear design at London College of Fashion and has a masters in enterprise. John has worked in various roles within the fashion industry and has experience as a fashion stylist and writer for the international magazines Loaded and the Chinese edition of Vogue. He has helped new brands develop their creative and business direction both in the UK, Hong Kong and China, and continues to have an active role in fashion as a consultant for retail, branding, production and distribution.John is currently a Senior Lecturer in International Fashion Business at Manchester Metropolitan University, teaching on the Fashion Buying and Clothing Design and…    

Preface
Acknowledgments
A Brief Introduction to Ball Grid Array Technologiesp. 1
Ceramic Substrates for Ball Grid Array Packagesp. 65
Plastic Substrates for Ball Grid Array Packagesp. 93
Printed Circuit Board Routing Considerations for Ball Grid Array Packagesp. 115
An Overview of Ceramic Ball and Column Grid Array Packagingp. 131
Ceramic Ball Grid Array Assemblyp. 171
Thermal and Electrical Management of Ceramic Ball Grid Array Assemblyp. 193
Reliability of Ceramic Ball Grid Array Assemblyp. 223
Plastic Ball Grid Array Packaging Technologyp. 267
Plastic Ball Grid Array Assemblyp. 295
Thermal and Electrical Performance Management in Plastic Ball Grid Array Packages from the Vendor's Perspectivep. 331
Thermal and Electrical Management of Plastic BGA Packages - A User's Perspectivep. 359
Reliability of Plastic Ball Grid Array Assemblyp. 379
Area Tape Automated Bonding Ball Grid Array Technologyp. 443
Inspection of Ball Grid Array Assemblyp. 465
Rework of Ball Grid Array Assembliesp. 491
Burn-In Sockets for Ball Grid Arrays (BGAs)p. 517
BGA Infrastructurep. 543
Packaging Glossaryp. 555
Author Biographiesp. 613
Indexp. 627
Table of Contents provided by Blackwell. All Rights Reserved.