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Electronic Packaging of High Speed Circuitry

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ISBN-10: 0070359709

ISBN-13: 9780070359703

Edition: 1997

Authors: Stephen G. Konsowski, Arden R. Helland

List price: $65.00
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This book provides guidelines for designing and packaging high speed circuitry, it details the role of materials selection and also covers manufacturing considerations.
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Book details

List price: $65.00
Copyright year: 1997
Publisher: McGraw-Hill Professional Publishing
Binding: Hardcover
Pages: 345
Size: 6.50" wide x 9.75" long x 1.50" tall
Weight: 1.694
Language: English

Preface
Acknowledgments
Conversion Factors
High Speed Digital and Microwave Packagingp. 1
Fundamentals of Electricity and Magnetism Applied to Electromagneticsp. 11
Packaging Technologies for High Speed Digital and Microwave Circuitsp. 47
Practical Design Details for Microwave Circuit Packagingp. 79
Microwave Circuit Assembly and Developmentp. 107
Transmission Lines: Effects and Analysisp. 123
Ideal Transmission Linesp. 143
Transmission-Line Interconnections: Loads and Endsp. 173
Signal Reflections, Bandwidth, and Lossesp. 211
Transmission Lines: Reflection Diagramsp. 243
Transmission Lines: Signal Levelsp. 283
Interconnections: Routing of Critical Signalsp. 315
ECL Transmission Lines and Terminationsp. 337
Differential Line Drivers and Terminationsp. 365
Composites and Their Role in Electronic Packagingp. 419
Glossaryp. 427
Indexp. 443
Table of Contents provided by Blackwell. All Rights Reserved.