Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield

Name: Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield
Availability: OutOfStock
ISBN: 9780070326194

ISBN-10: 0070326193

ISBN-13: 9780070326194

Edition: 2nd 1998 (Revised)

Authors: George Harman

List price: $79.00

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Description:

This electronics-specific program shows how to apply modern techniques of quality management to the design and manufacture of electronic components and systems. Electronics professionals find out how to use an integrated quality management system that embraces sales and marketing, procurement and order administration, engineering, manufacturing, enterprise management, and support. They'll gain a working understanding of advanced techniques such as ISO 9000, SPC, Deming's methods, and statistical process control from an electronics viewpoint. Step-by-step guidelines throughout show how to use quality management to reduce program risk and improve product affordability, while shifting emphasis…

Book details

List price: $79.00
Edition: 2nd
Copyright year: 1998
Publisher: McGraw-Hill Professional Publishing
Publication date: 6/1/1997
Binding: Hardcover
Pages: 290
Size: 6.50" wide x 9.50" long x 1.00" tall
Weight: 1.386
Language: English

Steven E. Miller is Editor-in-chief of International Security and Directorof the International Security Program at the Belfer Center.George G. Harman is a Fellow of the National Institute of Standards and Technology's Semiconductor Electronics Division.



Technical Introduction to the Second Edition


Ultrasonic Bonding Systems and Technologies (Including Ultrasonic Wire Bonding Mechanism)


Some Aspects of Bonding Wire Characteristics That can Affect Bonding, Reliability, or Testing


Wire Bond Testing


Gold-Aluminum Intermetallic Compounds and Other Metallic Interface Reactions Encountered in Wire Bonding


Bond Failures Resulting from Gold-Plating Impurities and Conditions


Cleaning to Improve Bondability and Reliability


Mechanical Problems in Wire Bonding


High-Yield and Fine-Pitch Wire Bonding


Wire Bonding to Multichip Modules and Other Soft Substrates


Glossary


Index