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Foreword | |
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Preface | |
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Acknowledgments | |
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Getting Started | |
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Introduction | |
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Microsystems vs. MEMS | |
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What are they? | |
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How are they made? | |
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What are they made of? | |
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How are they designed? | |
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Markets for Microsystems and MEMS | |
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Case Studies | |
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Looking Ahead | |
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An Approach to MEMS Design | |
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Design: The Big Picture | |
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Device Categories | |
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High-Level Design Issues | |
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The Design Process | |
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Modeling Levels | |
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Analytical or Numerical? | |
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A Closer Look | |
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Example: A Position-Control System | |
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Going Forward From Here | |
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Microfabrication | |
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Overview | |
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Wafer-Level Processes | |
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Substrates | |
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Wafer Cleaning | |
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Oxidation of Silicon | |
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Local Oxidation | |
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Doping | |
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Thin-Film Deposition | |
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Wafer Bonding | |
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Pattern Transfer | |
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Optical Lithography | |
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Design Rules | |
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Mask Making | |
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Wet Etching | |
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Dry Etching | |
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Additive Processes: Lift-Off | |
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Planarization | |
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Conclusion | |
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Process Integration | |
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Developing a Process | |
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A Simple Process Flow | |
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The Self-Aligned Gate: A Paradigm-Shifting Process | |
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Basic Principles of Process Design | |
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From Shape to Process and Back Again | |
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Process Design Issues | |
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Sample Process Flows | |
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A Bulk-Micromachined Diaphragm Pressure Sensor | |
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A Surface-Micromachined Suspended Filament | |
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Moving On | |
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Modeling Strategies | |
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Lumped Modeling | |
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Introduction | |
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Conjugate Power Variables | |
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One-Port Elements | |
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Ports | |
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The Variable-Assignment Conventions | |
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One-Port Source Elements | |
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One-Port Circuit Elements | |
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Circuit Connections in the e [right arrow] V Convention | |
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Kirchhoff's Laws | |
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Formulation of Dynamic Equations | |
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Complex Impedances | |
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State Equations | |
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Transformers and Gyrators | |
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Impedance Transformations | |
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The Electrical Inductor | |
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Energy-Conserving Transducers | |
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Introduction | |
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The Parallel-Plate Capacitor | |
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Charging the Capacitor at Fixed Gap | |
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Charging the Capacitor at Zero Gap, then Lifting | |
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The Two-Port Capacitor | |
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Electrostatic Actuator | |
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Charge Control | |
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Voltage Control | |
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Pull-In | |
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Adding Dynamics to the Actuator Model | |
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The Magnetic Actuator | |
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Equivalent Circuits for Linear Transducers | |
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The Position Control System--Revisited | |
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Dynamics | |
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Introduction | |
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Linear System Dynamics | |
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Direct Integration | |
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System Functions | |
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Fourier Transform | |
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Sinusoidal Steady State | |
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Eigenfunction Analysis | |
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Nonlinear Dynamics | |
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Fixed Points of Nonlinear Systems | |
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Linearization About an Operating Point | |
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Linearization of the Electrostatic Actuator | |
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Transducer Model for the Linearized Actuator | |
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Direct Integration of State Equations | |
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Resonators and Oscillators | |
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And Then There's Chaos... | |
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Domain-Specific Details | |
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Elasticity | |
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Introduction | |
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Constitutive Equations of Linear Elasticity | |
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Stress | |
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Strain | |
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Elastic Constants for Isotropic Materials | |
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Other Elastic Constants | |
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Isotropic Elasticity in Three Dimensions | |
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Plane Stress | |
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Elastic Constants for Anisotropic Materials | |
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Thermal Expansion and Thin-Film Stress | |
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Other Sources of Residual Thin-Film Stress | |
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Selected Mechanical Property Data | |
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Material Behavior at Large Strains | |
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Plastic Deformation | |
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Structures | |
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Overview | |
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Axially Loaded Beams | |
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Beams With Varying Cross-section | |
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Statically Indeterminate Beams | |
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Stresses on Inclined Sections | |
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Bending of Beams | |
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Types of Support | |
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Types of Loads | |
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Reaction Forces and Moments | |
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Pure Bending of a Transversely Loaded Beam | |
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Differential Equation for Beam Bending | |
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Elementary Solutions of the Beam Equation | |
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Anticlastic Curvature | |
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Bending of Plates | |
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Plate in Pure Bending | |
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Effects of Residual Stresses and Stress Gradients | |
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Stress Gradients in Cantilevers | |
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Residual Stresses in Doubly-Supported Beams | |
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Buckling of Beams | |
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Plates With In-Plane Stress | |
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What about large deflections? | |
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Energy Methods | |
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Elastic Energy | |
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The Principle of Virtual Work | |
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Variational Methods | |
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Properties of the Variational Solution | |
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Large Deflections of Elastic Structures | |
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A Center-Loaded Doubly-Clamped Beam | |
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Combining Variational Results with Simulations | |
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The Uniformly Loaded Doubly-Clamped Beam | |
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Residual Stress in Clamped Structures | |
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Elastic Energy in Plates and Membranes | |
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Uniformly Loaded Plates and Membranes | |
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Membrane Load-Deflection Behavior | |
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Rayleigh-Ritz Methods | |
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Estimating Resonant Frequencies | |
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Extracting Lumped-Element Masses | |
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Dissipation and the Thermal Energy Domain | |
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Dissipation is Everywhere | |
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Electrical Resistance | |
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Charging a Capacitor | |
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Dissipative Processes | |
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The Thermal Energy Domain | |
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The Heat-Flow Equation | |
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Basic Thermodynamic Ideas | |
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Lumped Modeling in the Thermal Domain | |
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Self-Heating of a Resistor | |
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Temperature Coefficient of Resistance | |
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Current-source drive | |
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Voltage-source drive | |
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A Self-Heated Silicon Resistor | |
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Other Dissipation Mechanisms | |
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Contact Friction | |
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Dielectric losses | |
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Viscoelastic losses | |
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Magnetic Losses | |
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Diffusion | |
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Irreversible Thermodynamics: Coupled Flows | |
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Thermoelectric Power and Thermocouples | |
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Thermoelectric Heating and Cooling | |
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Other Coupled-Flow Problems | |
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Modeling Time-Dependent Dissipative Processes | |
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Lumped Modeling of Dissipative Processes | |
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Overview | |
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The Generalized Heat-Flow Equation | |
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The DC Steady State: The Poisson Equation | |
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Finite-Difference Solution of the Poisson Equation | |
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Temperature Distribution in a Self-Heated Resistor | |
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Eigenfunction Solution of the Poisson Equation | |
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Transient Response: Finite-Difference Approach | |
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Transient Response: Eigenfunction Method | |
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One-Dimensional Example | |
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Equivalent Circuit for a Single Mode | |
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Equivalent Circuit Including All Modes | |
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Fluids | |
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What Makes Fluids Difficult? | |
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Basic Fluid Concepts | |
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Viscosity | |
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Thermophysical Properties | |
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Surface Tension | |
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Conservation of Mass | |
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Time Rate of Change of Momentum | |
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The Navier-Stokes Equation | |
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Energy Conservation | |
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Reynolds Number and Mach Number | |
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Incompressible Laminar Flow | |
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Couette Flow | |
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Poiseuille Flow | |
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Development Lengths and Boundary Layers | |
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Stokes Flow | |
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Squeezed-Film Damping | |
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Rigid Parallel-Plate Small-Amplitude Motion | |
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Electrolytes and Electrokinetic Effects | |
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Ionic Double Layers | |
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Electroosmotic Flow | |
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Electrophoresis | |
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Diffusion Effects | |
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Pressure Effects | |
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Mixing | |
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Modeling of Electrokinetic Systems | |
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Circuit and System Issues | |
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Electronics | |
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Introduction | |
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Elements of Semiconductor Physics | |
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Equilibrium Carrier Concentrations | |
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Excess Carriers | |
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The Semiconductor Diode | |
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The Diffused Resistor | |
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The Photodiode | |
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The Bipolar Junction Transistor | |
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The MOSFET | |
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Large-Signal Characteristics of the MOSFET | |
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MOSFET Capacitances | |
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Small-Signal Model of the MOSFET | |
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MOSFET Amplifiers | |
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The CMOS Inverter | |
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Large-Signal Switching Speed | |
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The Linear-Gain Region | |
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Other Amplifier Configurations | |
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Operational Amplifiers | |
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Dynamic Effects | |
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Basic Op-Amp Circuits | |
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Inverting Amplifier | |
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Short Method for Analyzing Op-Amp Circuits | |
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Noninverting Amplifier | |
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Transimpedance Amplifier | |
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Integrator | |
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Differentiator | |
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Charge-Measuring Circuits | |
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Differential Charge Measurement | |
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Switched-Capacitor Circuits | |
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Feedback Systems | |
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Introduction | |
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Basic Feedback Concepts | |
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Feedback in Linear Systems | |
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Feedback Amplifiers | |
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Example: The Position Controller | |
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PID Control | |
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The Effect of Amplifier Bandwidth | |
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Phase Margin | |
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Noise and Disturbances | |
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Stabilization of Unstable Systems | |
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Controllability and Observability Revisited | |
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Feedback in Nonlinear Systems | |
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Quasi-static Nonlinear Feedback Systems | |
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Resonators and Oscillators | |
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Simulink Model | |
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The (Almost) Sinusoidal Oscillator | |
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Relaxation Oscillation | |
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Noise | |
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Introduction | |
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The Interference Problem | |
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Shields | |
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Ground Loops | |
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Guards | |
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Characterization of Signals | |
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Amplitude-Modulated Signals | |
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Characterization of Random Noise | |
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Mean-Square and Root-Mean-Square Noise | |
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Addition of Uncorrelated Sources | |
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Signal-to-Noise Ratio | |
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Spectral Density Function | |
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Noise in Linear Systems | |
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Noise Sources | |
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Thermal Noise | |
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Noise Bandwidth | |
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Shot Noise | |
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Flicker Noise | |
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Amplifier Noise | |
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Example: A Resistance Thermometer | |
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Using a DC source | |
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Modulation of an AC Carrier | |
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Caution: Modulation Does Not Always Work | |
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Drifts | |
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Case Studies | |
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Packaging | |
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Introduction to the Case Studies | |
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Packaging, Test, and Calibration | |
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An Approach to Packaging | |
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A Commercial Pressure-Sensor Case Study | |
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Device Concept | |
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System Partitioning | |
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Interfaces | |
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Details | |
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A Final Comment | |
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A Piezoresistive Pressure Sensor | |
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Sensing Pressure | |
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Piezoresistance | |
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Analytic Formulation in Cubic Materials | |
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Longitudinal and Transverse Piezoresistance | |
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Piezoresistive Coefficients of Silicon | |
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Structural Examples | |
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Averaging over Stress and Doping Variations | |
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A Numerical Example | |
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The Motorola MAP Sensor | |
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Process Flow | |
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Details of the Diaphragm and Piezoresistor | |
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Stress Analysis | |
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Signal-Conditioning and Calibration | |
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Device Noise | |
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Recent Design Changes | |
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Higher-Order Effects | |
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A Capacitive Accelerometer | |
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Introduction | |
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Fundamentals of Quasi-Static Accelerometers | |
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Position Measurement With Capacitance | |
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Circuits for Capacitance Measurement | |
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Demodulation Methods | |
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Chopper-Stabilized Amplifiers | |
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Correlated Double Sampling | |
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Signal-to-Noise Issues | |
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A Capacitive Accelerometer Case Study | |
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Specifications | |
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Sensor Design and Modeling | |
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Fabrication and Packaging | |
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Noise and Accuracy | |
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Position Measurement With Tunneling Tips | |
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Electrostatic Projection Displays | |
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Introduction | |
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Electromechanics of the DMD Device | |
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Electrode Structure | |
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Torsional Pull-in | |
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Electromechanics of Electrostatically Actuated Beams | |
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M-Test | |
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The Grating-Light-Valve Display | |
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Diffraction Theory | |
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Device Fabrication and Packaging | |
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Quantitative Estimates of GLV Device Performance | |
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A Comparison | |
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A Piezoelectric Rate Gyroscope | |
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Introduction | |
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Kinematics of Rotation | |
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The Coriolis Rate Gyroscope | |
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Sinusoidal Response Function | |
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Steady Rotation | |
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Response to Angular Accelerations | |
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Generalized Gyroscopic Modes | |
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Piezoelectricity | |
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The Origin of Piezoelectricity | |
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Analytical Formulation of Piezoelectricity | |
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Piezoelectric Materials | |
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Piezoelectric Actuation | |
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Sensing with Piezoelectricity | |
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A Quartz Rate Gyroscope Case Study | |
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Electrode Structures | |
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Lumped-Element Modeling of Piezoelectric Devices | |
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QRS Specifications and Performance | |
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A Quantitative Device Model | |
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The Drive Mode | |
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Sense-Mode Displacement of the Drive Tines | |
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Coupling to the Sense Tines | |
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Noise and Accuracy Considerations | |
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Closing Comments | |
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Dna Amplification | |
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Introduction | |
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Polymerase Chain Reaction (PCR) | |
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Elements of PCR | |
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Specifications for a PCR System | |
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Microsystem Approaches to PCR | |
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Batch System | |
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PCR Flow System | |
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Thermal Model of the Batch Reactor | |
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Control Circuit and Transient Behavior | |
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Thermal Model of the Continuous Flow Reactor | |
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A Comparison | |
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A Microbridge Gas Sensor | |
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Overview | |
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System-Level Issues | |
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First-Order Device and System Models | |
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Filament Characteristics | |
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Resistance-Control System | |
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A Practical Device and Fabrication Process | |
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Creating the Filament | |
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High-Temperature Bond Pads | |
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Catalyst Coating | |
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Sensor Performance | |
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Demonstration of Hydrogen Detection | |
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Mass-Transport-Limited Operation | |
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Reaction-Rate-Limited Operation | |
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Advanced Modeling | |
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Epilogue | |
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Appendices | |
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Glossary of Notation | |
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Electromagnetic Fields | |
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Introduction | |
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Quasistatic Fields | |
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Elementary Laws | |
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Electroquasistatic Systems | |
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Magnetoquasistatic Systems | |
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Elastic Constants in Cubic Material | |
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References | |
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Index | |