Microsensors, MEMS, and Smart Devices

ISBN-10: 047186109X
ISBN-13: 9780471861096
Edition: 2001
List price: $160.00 Buy it from $19.05
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Description: This text reports on developments in both the integration of a microsensor and its microelectronic circuitry to produce a smart sensor and the integration of a microsensor, a microactuator and their microelectronic circuitry to produce a microsystem.

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Book details

List price: $160.00
Copyright year: 2001
Publisher: John Wiley & Sons, Incorporated
Publication date: 12/27/2001
Binding: Hardcover
Pages: 522
Size: 7.00" wide x 10.00" long x 1.25" tall
Weight: 2.442
Language: English

This text reports on developments in both the integration of a microsensor and its microelectronic circuitry to produce a smart sensor and the integration of a microsensor, a microactuator and their microelectronic circuitry to produce a microsystem.

Preface
About the Authors
Acknowledgments
Introduction
Historical Development of Microelectronics
Evolution of Microsensors
Evolution of MEMS
Emergence of Micromachines
References
Electronic Materials and Processing
Introduction
Electronic Materials and their Deposition
Oxide Film Formation by Thermal Oxidation
Deposition of Silicon Dioxide and Silicon Nitride
Polysilicon Film Deposition
Pattern Transfer
The Lithographic Process
Mask Formation
Resist
Lift-off Technique
Etching Electronic Materials
Wet Chemical Etching
Dry Etching
Doping Semiconductors
Diffusion
Ion Implantation
Concluding Remarks
References
MEMS Materials and their Preparation
Overview
Atomic Structure and the Periodic Table
Atomic Bonding
Crystallinity
Metals
Physical and Chemical Properties
Metallisation
Semiconductors
Semiconductors: Electrical and Chemical Properties
Semiconductors: Growth and Deposition
Ceramic, Polymeric, and Composite Materials
References
Standard Microelectronic Technologies
Introduction
Wafer Preparation
Crystal Growth
Wafer Manufacture
Epitaxial Deposition
Monolithic Processing
Bipolar Processing
Characteristics of BJTs
MOS Processing
Characteristics of FETs
SOI CMOS Processing
Monolithic Mounting
Die Bonding and Wire Bonding
Tape-Automated Bonding
Flip TAB Bonding
Flip-Chip Mounting
Printed Circuit Board Technologies
Solid Board
Flexible Board
Plastic Moulded
Hybrid and MCM Technologies
Thick Film
Multichip Modules
Ball Grid Array
Programmable Devices And ASICs
References
Silicon Micromachining: Bulk
Introduction
Isotropic and Orientation-Dependent Wet Etching
Etch-Stop Techniques
Doping-Selective Etching (DSE)
Conventional Bias-Dependent BSE or Electrochemical Etch-Stop
Selective Etching of n-Type Silicon by Pulsed Potential Anodisation
Photovoltaic Electrochemical Etch-Stop Technique (PHET)
Dry Etching
Buried Oxide Process
Silicon Fusion Bonding
Wafer Fusion
Annealing Treatment
Fusion of Silicon-Based Materials
Anodic Bonding
Concluding Remarks
References
Silicon Micromachining: Surface
Introduction
Sacrificial Layer Technology
Simple Process
Sacrificial Layer Processes Utilising more than One Structural Layer
Material Systems in Sacrificial Layer Technology
Polycrystalline Silicon and Silicon Dioxide
Polyimide and Aluminum
Silicon Nitride/Polycrystalline Silicon and Tungsten/Silicon Dioxide
Surface Micromachining using Plasma Etching
Combined IC Technology and Anisotropic Wet Etching
Processes Using Both Bulk and Surface Micromachining
Adhesion Problems in Surface Micromachining
Surface Versus Bulk Micromachining
References
Microstereolithography for MEMS
Introduction
Photopolymerisation
Stereolithographic System
Microstereolithography
Scanning Method
Classical MSL
IH Process
Mass-IH Process
Super-IH Process
Two-photon MSL
Other MSL Approaches
Projection Method
Mask-Projection MSL
Dynamic Mask-Projection MSL
Polymeric MEMS Architecture with Silicon, Metal, and Ceramics
Ceramic MSL
Metallic Microstructures
Metal-Polymer Microstructures
Localised Electrochemical Deposition
Combined Silicon and Polymeric Structures
Architecture Combination by Photoforming Process
MSL Integrated with Thick Film Lithography
AMANDA Process
Applications
Microactuators Fabricated by MSL
Microconcentrator
Microdevices Fabricated by the AMANDA Process
Concluding Remarks
References
Microsensors
Introduction
Thermal Sensors
Resistive Temperature Microsensors
Microthermocouples
Thermodiodes and Thermotransistors
SAW Temperature Sensor
Radiation Sensors
Photoconductive Devices
Photovoltaic Devices
Pyroelectric Devices
Microantenna
Mechanical Sensors
Overview
Micromechanical Components and Statics
Microshuttles and Dynamics
Mechanical Microstructures
Pressure Microsensors
Microaccelerometers
Microgyrometers
Flow Microsensors
Magnetic Sensors
Magnetogalvanic Microsensors
Magnetoresistive Devices
Magnetodiodes and Magnetotransistors
Acoustic Devices and SQUIDs
Bio(chemical) Sensors
Conductimetric Devices
Potentiometric Devices
Others
Concluding Remarks
References
Introduction to SAW Devices
Introduction
Saw Device Development and History
The Piezoelectric Effect
Interdigital Transducers in SAW Devices
Acoustic Waves
Rayleigh Surface Acoustic Waves
Shear Horizontal Acoustic Waves
Love Surface Acoustic Waves
Concluding Remarks
References
Surface Acoustic Waves in Solids
Introduction
Acoustic Wave Propagation
Acoustic Wave Propagation Representation
Introduction to Acoustics
Particle Displacement and Strain
Stress
The Piezoelectric Effect
Acoustic Wave Propagation
Uniform Plane Waves in a Piezoelectric Solid: Quasi-Static Approximation
Shear Horizontal or Acoustic Plate Modes
Love Modes
Concluding Remarks
References
IDT Microsensor Parameter Measurement
Introduction to IDT SAW Sensor Instrumentation
Acoustic Wave Sensor Instrumentation
Introduction
Network Analyser and Vector Voltmeter
Analogue (Amplitude) Measuring System
Phase Measurement System
Frequency Measurement System
Acoustic Wave Sensor Output Frequency Translation
Measurement Setup
Calibration
References
IDT Microsensor Fabrication
Introduction
Saw-IDT Microsensor Fabrication
Mask Generation
Wafer Preparation
Metallisation
Photolithography
Wafer Dicing
Deposition of Waveguide Layer
Introduction
TMS PECVD Process and Conditions
Concluding Remarks
References
IDT Microsensors
Introduction
Saw Device Modeling via Coupled-mode Theory
Wireless SAW-based Microsensors
Applications
Strain Sensor
Temperature Sensor
Pressure Sensor
Humidity Sensor
SAW-Based Gyroscope
Concluding Remarks
References
MEMS-IDT Microsensors
Introduction
Principles of a MEMS-IDT Accelerometer
Fabrication of a MEMS-IDT Accelerometer
Fabrication of the SAW Device
Integration of the SAW Device and Seismic Mass
Testing of a MEMS-IDT Accelerometer
Measurement Setup
Calibration Procedure
Time Domain Measurement
Experimental
Fabrication of Seismic Mass
Wireless Readout
Hybrid Accelerometers and Gyroscopes
Concluding Remarks
References
Smart Sensors and MEMS
Introduction
Smart Sensors
MEMS Devices
Concluding Remarks
References
Appendices
List of Abbreviations
List of Symbols and Prefixes
List of Some Important Terms
Fundamental Constants
Unit Conversion Factors
Properties of Electronic and MEMS Metallic Materials
Properties of Electronic and MEMS Semiconducting Materials
Properties of Electronic and MEMS Ceramic and Polymer Materials
Complex Reciprocity Relation and Perturbation Analysis
Coupled-mode Modeling of a SAW Device
Suggested Further Reading
Webography
List of Worked Examples
Index

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