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| Preface | |
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| About the Authors | |
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| Acknowledgments | |
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| Introduction | |
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| Historical Development of Microelectronics | |
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| Evolution of Microsensors | |
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| Evolution of MEMS | |
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| Emergence of Micromachines | |
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| References | |
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| Electronic Materials and Processing | |
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| Introduction | |
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| Electronic Materials and their Deposition | |
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| Oxide Film Formation by Thermal Oxidation | |
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| Deposition of Silicon Dioxide and Silicon Nitride | |
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| Polysilicon Film Deposition | |
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| Pattern Transfer | |
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| The Lithographic Process | |
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| Mask Formation | |
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| Resist | |
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| Lift-off Technique | |
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| Etching Electronic Materials | |
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| Wet Chemical Etching | |
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| Dry Etching | |
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| Doping Semiconductors | |
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| Diffusion | |
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| Ion Implantation | |
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| Concluding Remarks | |
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| References | |
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| MEMS Materials and their Preparation | |
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| Overview | |
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| Atomic Structure and the Periodic Table | |
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| Atomic Bonding | |
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| Crystallinity | |
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| Metals | |
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| Physical and Chemical Properties | |
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| Metallisation | |
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| Semiconductors | |
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| Semiconductors: Electrical and Chemical Properties | |
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| Semiconductors: Growth and Deposition | |
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| Ceramic, Polymeric, and Composite Materials | |
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| References | |
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| Standard Microelectronic Technologies | |
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| Introduction | |
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| Wafer Preparation | |
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| Crystal Growth | |
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| Wafer Manufacture | |
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| Epitaxial Deposition | |
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| Monolithic Processing | |
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| Bipolar Processing | |
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| Characteristics of BJTs | |
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| MOS Processing | |
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| Characteristics of FETs | |
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| SOI CMOS Processing | |
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| Monolithic Mounting | |
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| Die Bonding and Wire Bonding | |
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| Tape-Automated Bonding | |
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| Flip TAB Bonding | |
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| Flip-Chip Mounting | |
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| Printed Circuit Board Technologies | |
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| Solid Board | |
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| Flexible Board | |
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| Plastic Moulded | |
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| Hybrid and MCM Technologies | |
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| Thick Film | |
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| Multichip Modules | |
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| Ball Grid Array | |
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| Programmable Devices And ASICs | |
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| References | |
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| Silicon Micromachining: Bulk | |
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| Introduction | |
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| Isotropic and Orientation-Dependent Wet Etching | |
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| Etch-Stop Techniques | |
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| Doping-Selective Etching (DSE) | |
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| Conventional Bias-Dependent BSE or Electrochemical Etch-Stop | |
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| Selective Etching of n-Type Silicon by Pulsed Potential Anodisation | |
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| Photovoltaic Electrochemical Etch-Stop Technique (PHET) | |
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| Dry Etching | |
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| Buried Oxide Process | |
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| Silicon Fusion Bonding | |
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| Wafer Fusion | |
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| Annealing Treatment | |
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| Fusion of Silicon-Based Materials | |
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| Anodic Bonding | |
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| Concluding Remarks | |
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| References | |
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| Silicon Micromachining: Surface | |
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| Introduction | |
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| Sacrificial Layer Technology | |
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| Simple Process | |
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| Sacrificial Layer Processes Utilising more than One Structural Layer | |
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| Material Systems in Sacrificial Layer Technology | |
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| Polycrystalline Silicon and Silicon Dioxide | |
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| Polyimide and Aluminum | |
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| Silicon Nitride/Polycrystalline Silicon and Tungsten/Silicon Dioxide | |
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| Surface Micromachining using Plasma Etching | |
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| Combined IC Technology and Anisotropic Wet Etching | |
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| Processes Using Both Bulk and Surface Micromachining | |
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| Adhesion Problems in Surface Micromachining | |
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| Surface Versus Bulk Micromachining | |
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| References | |
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| Microstereolithography for MEMS | |
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| Introduction | |
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| Photopolymerisation | |
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| Stereolithographic System | |
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| Microstereolithography | |
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| Scanning Method | |
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| Classical MSL | |
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| IH Process | |
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| Mass-IH Process | |
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| Super-IH Process | |
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| Two-photon MSL | |
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| Other MSL Approaches | |
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| Projection Method | |
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| Mask-Projection MSL | |
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| Dynamic Mask-Projection MSL | |
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| Polymeric MEMS Architecture with Silicon, Metal, and Ceramics | |
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| Ceramic MSL | |
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| Metallic Microstructures | |
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| Metal-Polymer Microstructures | |
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| Localised Electrochemical Deposition | |
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| Combined Silicon and Polymeric Structures | |
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| Architecture Combination by Photoforming Process | |
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| MSL Integrated with Thick Film Lithography | |
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| AMANDA Process | |
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| Applications | |
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| Microactuators Fabricated by MSL | |
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| Microconcentrator | |
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| Microdevices Fabricated by the AMANDA Process | |
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| Concluding Remarks | |
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| References | |
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| Microsensors | |
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| Introduction | |
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| Thermal Sensors | |
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| Resistive Temperature Microsensors | |
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| Microthermocouples | |
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| Thermodiodes and Thermotransistors | |
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| SAW Temperature Sensor | |
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| Radiation Sensors | |
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| Photoconductive Devices | |
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| Photovoltaic Devices | |
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| Pyroelectric Devices | |
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| Microantenna | |
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| Mechanical Sensors | |
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| Overview | |
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| Micromechanical Components and Statics | |
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| Microshuttles and Dynamics | |
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| Mechanical Microstructures | |
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| Pressure Microsensors | |
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| Microaccelerometers | |
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| Microgyrometers | |
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| Flow Microsensors | |
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| Magnetic Sensors | |
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| Magnetogalvanic Microsensors | |
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| Magnetoresistive Devices | |
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| Magnetodiodes and Magnetotransistors | |
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| Acoustic Devices and SQUIDs | |
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| Bio(chemical) Sensors | |
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| Conductimetric Devices | |
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| Potentiometric Devices | |
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| Others | |
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| Concluding Remarks | |
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| References | |
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| Introduction to SAW Devices | |
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| Introduction | |
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| Saw Device Development and History | |
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| The Piezoelectric Effect | |
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| Interdigital Transducers in SAW Devices | |
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| Acoustic Waves | |
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| Rayleigh Surface Acoustic Waves | |
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| Shear Horizontal Acoustic Waves | |
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| Love Surface Acoustic Waves | |
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| Concluding Remarks | |
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| References | |
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| Surface Acoustic Waves in Solids | |
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| Introduction | |
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| Acoustic Wave Propagation | |
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| Acoustic Wave Propagation Representation | |
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| Introduction to Acoustics | |
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| Particle Displacement and Strain | |
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| Stress | |
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| The Piezoelectric Effect | |
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| Acoustic Wave Propagation | |
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| Uniform Plane Waves in a Piezoelectric Solid: Quasi-Static Approximation | |
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| Shear Horizontal or Acoustic Plate Modes | |
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| Love Modes | |
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| Concluding Remarks | |
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| References | |
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| IDT Microsensor Parameter Measurement | |
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| Introduction to IDT SAW Sensor Instrumentation | |
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| Acoustic Wave Sensor Instrumentation | |
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| Introduction | |
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| Network Analyser and Vector Voltmeter | |
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| Analogue (Amplitude) Measuring System | |
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| Phase Measurement System | |
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| Frequency Measurement System | |
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| Acoustic Wave Sensor Output Frequency Translation | |
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| Measurement Setup | |
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| Calibration | |
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| References | |
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| IDT Microsensor Fabrication | |
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| Introduction | |
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| Saw-IDT Microsensor Fabrication | |
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| Mask Generation | |
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| Wafer Preparation | |
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| Metallisation | |
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| Photolithography | |
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| Wafer Dicing | |
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| Deposition of Waveguide Layer | |
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| Introduction | |
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| TMS PECVD Process and Conditions | |
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| Concluding Remarks | |
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| References | |
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| IDT Microsensors | |
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| Introduction | |
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| Saw Device Modeling via Coupled-mode Theory | |
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| Wireless SAW-based Microsensors | |
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| Applications | |
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| Strain Sensor | |
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| Temperature Sensor | |
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| Pressure Sensor | |
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| Humidity Sensor | |
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| SAW-Based Gyroscope | |
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| Concluding Remarks | |
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| References | |
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| MEMS-IDT Microsensors | |
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| Introduction | |
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| Principles of a MEMS-IDT Accelerometer | |
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| Fabrication of a MEMS-IDT Accelerometer | |
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| Fabrication of the SAW Device | |
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| Integration of the SAW Device and Seismic Mass | |
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| Testing of a MEMS-IDT Accelerometer | |
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| Measurement Setup | |
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| Calibration Procedure | |
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| Time Domain Measurement | |
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| Experimental | |
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| Fabrication of Seismic Mass | |
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| Wireless Readout | |
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| Hybrid Accelerometers and Gyroscopes | |
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| Concluding Remarks | |
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| References | |
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| Smart Sensors and MEMS | |
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| Introduction | |
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| Smart Sensors | |
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| MEMS Devices | |
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| Concluding Remarks | |
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| References | |
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| Appendices | |
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| List of Abbreviations | |
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| List of Symbols and Prefixes | |
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| List of Some Important Terms | |
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| Fundamental Constants | |
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| Unit Conversion Factors | |
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| Properties of Electronic and MEMS Metallic Materials | |
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| Properties of Electronic and MEMS Semiconducting Materials | |
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| Properties of Electronic and MEMS Ceramic and Polymer Materials | |
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| Complex Reciprocity Relation and Perturbation Analysis | |
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| Coupled-mode Modeling of a SAW Device | |
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| Suggested Further Reading | |
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| Webography | |
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| List of Worked Examples | |
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| Index | |