Advanced Electronic Packaging

ISBN-10: 0471466093
ISBN-13: 9780471466093
Edition: 2nd 2006 (Revised)
List price: $197.00 Buy it from $134.45
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Description: As in the "First Edition," each chapter in this new "Second Edition" is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive  More...

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Book details

List price: $197.00
Edition: 2nd
Copyright year: 2006
Publisher: John Wiley & Sons, Incorporated
Publication date: 2/24/2006
Binding: Hardcover
Pages: 840
Size: 7.25" wide x 10.25" long x 1.75" tall
Weight: 4.246
Language: English

As in the "First Edition," each chapter in this new "Second Edition" is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the "First Edition," which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.

WILLIAM D. BROWN, PhD, is Associate Dean for Research, College of Engineering, and Distinguished Professor of Electrical Engineering, University of Arkansas. Since 1991, he has played an active role in sponsoring and guiding research at the University's High Density Electronics Center (HiDEC), which is dedicated to advancing the state of the art in electronics packaging materials and technologies.

Introduction and overview of microelectronic packaging
Materials for microelectronic packaging
Processing technologies
Organic printed circuit board materials and processes
Ceramic substrates
Electrical considerations, modeling, and simulation
Thermal considerations
Mechanical design considerations
Discrete and embedded passive devices
Electronic package assembly
Design considerations
Radio frequency and microwave packaging
Power electronics packaging
Multichip and three-dimensional packaging
Packaging of MEMS and MOEMS
Reliability considerations
Cost evaluation and analysis
Analytical techniques for materials characterization

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