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| Preface | |
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| EMC Theory | |
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| Electromagnetic Compatibility | |
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| Introduction | |
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| Noise and Interference | |
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| Designing for Electromagnetic Compatibility | |
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| Engineering Documentation and EMC | |
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| United States' EMC Regulations | |
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| FCC Regulations | |
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| FCC Part 15, Subpart B | |
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| Emissions | |
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| Administrative Procedures | |
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| Susceptibility | |
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| Medical Equipment | |
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| Telecom | |
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| Automotive | |
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| Canadian EMC Requirements | |
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| European Union's EMC Requirements | |
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| Emission Requirements | |
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| Harmonics and Flicker | |
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| Immunity Requirements | |
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| Directives and Standards | |
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| International Harmonization | |
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| The Regulatory Process | |
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| Typical Noise Path | |
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| Methods of Noise Coupling | |
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| Conductively Coupled Noise | |
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| Common Impedance Coupling | |
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| Electric and Magnetic Field Coupling | |
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| Miscellaneous Noise Sources | |
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| Galvanic Action | |
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| Electrolytic Action | |
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| Triboelectric Effect | |
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| Conductor Motion | |
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| Use of Network Theory | |
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| Summary | |
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| Problems | |
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| References | |
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| Further Reading | |
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| Cabling | |
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| Capacitive Coupling | |
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| Effect of Shield on Capacitive Coupling | |
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| Inductive Coupling | |
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| Mutual Inductance Calculations | |
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| Effect of Shield on Magnetic Coupling | |
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| Magnetic Coupling Between Shield and Inner Conductor | |
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| Magnetic Coupling-Open Wire to Shielded Conductor | |
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| Shielding to Prevent Magnetic Radiation | |
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| Shielding a Receptor Against Magnetic Fields | |
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| Common Impedance Shield Coupling | |
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| Shield Transfer Impedance | |
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| Coaxial Cable Versus Twisted Pair | |
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| Braided Shields | |
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| Spiral Shields | |
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| Shield Terminations | |
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| Pigtails | |
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| Grounding of Cable Shields | |
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| Ribbon Cables | |
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| Electrically Long Cables | |
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| Summary | |
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| Problems | |
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| References | |
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| Further Reading | |
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| Grounding | |
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| AC Power Distribution and Safety Grounds | |
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| Service Entrance | |
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| Branch Circuits | |
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| Noise Control | |
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| Earth Grounds | |
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| Isolated Grounds | |
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| Separately Derived Systems | |
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| Grounding Myths | |
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| Signal Grounds | |
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| Single-Point Ground Systems | |
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| Multipoint Ground Systems | |
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| Common Impedance Coupling | |
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| Hybrid Grounds | |
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| Chassis Grounds | |
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| Equipment/System Grounding | |
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| Isolated Systems | |
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| Clustered Systems | |
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| Distributed Systems | |
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| Ground Loops | |
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| Low-Frequency Analysis of Common-Mode Choke | |
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| High-Frequency Analysis of Common-Mode Choke | |
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| Single Ground Reference for a Circuit | |
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| Summary | |
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| Problems | |
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| References | |
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| Further Reading | |
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| Balancing and Filtering | |
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| Balancing | |
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| Common-Mode Rejection Ratio | |
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| Cable Balance | |
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| System Balance | |
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| Balanced Loads | |
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| Filtering | |
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| Common-Mode Filters | |
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| Parasitic Effects in Filters | |
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| Power Supply Decoupling | |
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| Low-Frequency Analog Circuit Decoupling | |
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| Amplifier Decoupling | |
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| Driving Capacitive Loads | |
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| System Bandwidth | |
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| Modulation and Coding | |
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| Summary | |
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| Problems | |
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| References | |
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| Further Reading | |
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| Passive Components | |
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| Capacitors | |
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| Electrolytic Capacitors | |
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| Film Capacitors | |
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| Mica and Ceramic Capacitors | |
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| Feed-Through Capacitors | |
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| Paralleling Capacitors | |
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| Inductors | |
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| Transformers | |
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| Resistors | |
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| Noise in Resistors | |
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| Conductors | |
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| Inductance of Round Conductors | |
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| Inductance of Rectangular Conductors | |
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| Resistance of Round Conductors | |
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| Resistance of Rectangular Conductors | |
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| Transmission Lines | |
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| Characteristic Impedance | |
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| Propagation Constant | |
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| High-Frequency Loss | |
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| Relationship Among C, L and �r. | |
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| Final Thoughts | |
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| Ferrites | |
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| Summary | |
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| Problems | |
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| References | |
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| Further Reading | |
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| Shielding | |
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| Near Fields and Far Fields | |
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| Characteristic and Wave Impedances | |
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| Shielding Effectiveness | |
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| Absorption Loss | |
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| Reflection Loss | |
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| Reflection Loss to Plane Waves | |
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| Reflection Loss in the Near Field | |
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| Electric Field Reflection Loss | |
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| Magnetic Field Reflection Loss | |
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| General Equations for Reflection Loss | |
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| Multiple Reflections in Thin Shields | |
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| Composite Absorption and Reflection Loss | |
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| Plane Waves | |
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| Electric Fields | |
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| Magnetic Fields | |
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| Summary of Shielding Equations | |
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| Shielding with Magnetic Materials | |
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| Multiple Apertures | |
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| Seams | |
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| Transfer Impedance | |
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| Waveguide Below Cutoff | |
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| Conductive Gaskets | |
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| Joints of Dissimilar Metals | |
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| Mounting of Conductive Gaskets | |
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| The "Ideal" Shield | |
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| Conductive Windows | |
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| Transparent Conductive Coatings | |
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| Wire Mesh Screens | |
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| Mounting of Windows | |
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| Conductive Coatings | |
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| Conductive Paints | |
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| Flame/Arc Spray | |
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| Vacuum Metalizing | |
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| Electroless Plating | |
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| Metal Foil Linings | |
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| Filled Plastic | |
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| Internal Shields | |
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| Cavity Resonance | |
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| Grounding of Shields | |
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| Summary | |
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| Problems | |
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| References | |
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| Further Reading | |
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| Contact Protection | |
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| Glow Discharges | |
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| Metal-Vapor or Arc Discharges | |
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| AC Versus DC Circuits | |
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| Contact Material | |
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| Contact Rating | |
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| Loads with High Inrush Currents | |
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| Inductive Loads | |
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| Contact Protection Fundamentals | |
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| C Network | |
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| R-C Network | |
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| R-C-D Network | |
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| Inductive Loads Controlled by a Transistor Switch | |
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| Resistive Load Contact Protection | |
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| Contact Protection Selection Guide | |
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| Examples | |
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| Summary | |
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| Problems | |
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| References | |
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| Further Reading | |
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| Intrinsic Noise Sources | |
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| Thermal Noise | |
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| Characteristics of Thermal Noise | |
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| Equivalent Noise Bandwidth | |
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| Shot Noise | |
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| Contact Noise | |
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| Popcorn Noise | |
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| Addition of Noise Voltages | |
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| Measuring Random Noise | |
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| Summary | |
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| Problems | |
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| References | |
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| Further Reading | |
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| Active Device Noise | |
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| Noise Factor | |
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| Measurement of Noise Factor | |
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| Single-Frequency Method | |
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| Noise Diode Method | |
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| Calculating S/N Ratio and Input Noise Voltage from Noise Factor | |
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| Noise Voltage and Current Model | |
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| Measurment of Vn and In | |
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| Calculating Noise Factor and S/N Radio from Vn-In | |
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| Optimum Source Resistance | |
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| Noise Factor of Cascaded Stages | |
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| Transistor Noise Factor | |
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| Vn-In for Transistors | |
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| Field-Effect Transistor Noise | |
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| FET Noise Factor | |
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| Vn-In Representation of FET Noise | |
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| Noise in Operational Amplifiers | |
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| Methods of Specifying Op-Amp Noise | |
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| Op-Amp Noise Factor | |
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| Summary | |
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| Problems | |
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| References | |
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| Further Reading | |
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| Frequency Versus Time Domain | |
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| Analog Versus Digital Circuits | |
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| Digital Logic Noise | |
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| Internal Noise Sources | |
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| Digital Circuit Ground Noise | |
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| Minimizing Inductance | |
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| Mutual Inductance | |
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| Practical Digital Circuit Ground Systems | |
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| Loop Area | |
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| Ground Plane Current Distribution and Impedance | |
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| Reference Plane Current Distribution | |
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| Ground Plane Impedance | |
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| Ground Plane Voltage | |
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| End Effects | |
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| Digital Logic Current Flow | |
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| Microstrip Line | |
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| Stripline | |
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| Digital Circuit Current Flow Summary | |
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| Summary | |
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| Problems | |
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| References | |
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| Further Reading | |
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| EMC Applications | |
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| Digital Circuit Power Distribution | |
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| Power Supply Decoupling | |
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| Transient Power Supply Currents | |
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| Transient Load Current | |
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| Dynamic Internal Current | |
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| Fourier Spectrum of the Transient Current | |
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| Total Transient Current | |
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| Decoupling Capacitors | |
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| Effective Decoupling Strategies | |
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| Multiple Decoupling Capacitors | |
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| Multiple Capacitors of the Same Value | |
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| Multiple Capacitors of Two Different Values | |
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| Multiple Capacitors of Many Different Values | |
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| Target Impedance | |
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| Embedded PCB Capacitance | |
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| Power Supply Isolation | |
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| The Effect of Decoupling on Radiated Emissions | |
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| Decoupling Capacitor Type and Value | |
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| Decoupling Capacitor Placement and Mounting | |
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| Bulk Decoupling Capacitors | |
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| Power Entry Filters | |
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| Summary | |
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| Problems | |
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| References | |
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| Further Reading | |
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| Digital Circuit Radiation | |
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| Differential-Mode Radiation | |
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| Loop Area | |
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| Loop Current | |
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| Fourier Series | |
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| Radiated Emission Envelope | |
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| Controlling Differential-Mode Radiation | |
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| Board Layout | |
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| Canceling Loops | |
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| Dithered Clocks | |
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| Common-Mode Radiation | |
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| Controlling Common-Mode Radiation | |
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| Common-Mode Voltage | |
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| Cable Filtering and Shielding | |
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| Separate I/O Grounds | |
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| Dealing With Common-Mode Radiation Issues | |
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| Summary | |
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| Problems | |
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| References | |
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| Further Reading | |
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| Conducted Emissions | |
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| Power Line Impedance | |
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| Line Impedance Stabilization Network | |
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| Switched-Mode Power Supplies | |
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| Common-Mode Emissions | |
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| Differential-Mode Emissions | |
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| DC-to-DC Converters | |
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| Rectifier Diode Noise | |
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| Power-Line Filters | |
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| Common-Mode Filtering | |
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| Differential-Mode Filtering | |
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| Leakage Inductance | |
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| Filter Mounting | |
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| Power Supplies with Integral Power-Line Filters | |
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| High-Frequency Noise | |
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| Primary-to-Secondary Common-Mode Coupling | |
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| Frequency Dithering | |
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| Power Supply Instability | |
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| Magnetic Field Emissions | |
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| Variable Speed Motor Drives | |
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| Harmonic Suppression | |
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| Inductive Input Filters | |
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| Active Power Factor Correction | |
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| AC Line Reactors | |
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| Summary | |
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| Problems | |
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| References | |
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| Further Reading | |
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| RF and Transient Immunity | |
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| Performance Criteria | |
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| RF Immunity | |
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| The RF Environment | |
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| Audio Rectification | |
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| RFI Mitigation Techniques | |
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| Transient Immunity | |
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| Electrostatic Discharge | |
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| Electrical Fast Transient | |
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| Lightning Surge | |
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| Transient Suppression Networks | |
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| Signal Line Suppression | |
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| Protection of High-Speed Signal Lines | |
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| Power Line Transient Suppression | |
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| Hybrid Protection Network | |
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| Power Line Disturbances | |
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| Power Line Immunity Curve | |
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| Summary | |
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| Problems | |
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| References | |
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| Further Reading | |
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| Electrostatic Discharge | |
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| Static Generation | |
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| Inductive Charging | |
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| Energy Storage | |
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| Human Body Model | |
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| Static Discharge | |
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| Decay Time | |
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| ESD Protection in Equipment Design | |
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| Preventing ESD Entry | |
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| Metallic Enclosures | |
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| Input/Output Cable Treatment | |
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| Insulated Enclosures | |
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| Keyboards and Control Panels | |
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| Hardening Sensitive Circuits | |
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| ESD Grounding | |
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| Nongrounded Products | |
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| Field-Induced Upset | |
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| Inductive Coupling | |
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| Capacitive Coupling | |
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| Transient Hardened Software Design | |
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| Detecting Errors in Program Flow | |
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| Detecting Errors in Input/Output | |
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| Detecting Errors in Memory | |
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| Time Windows | |
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| Summary | |
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| Problems | |
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| References | |
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| Further Reading | |
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| PCB Layout and Stackup | |
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| General PCB Layout Considerations | |
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| Partitioning | |
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| Keep Out Zones | |
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| Critical Signals | |
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| System Clocks | |
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| PCB-to-Chassis Ground Connection | |
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| Return Path Discontinuities | |
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| Slots in Ground/Power Planes | |
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| Split Ground/Power Planes | |
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| Changing Reference Planes | |
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| Referencing the Top and Bottom of the Same Plane | |
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| Connectors | |
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| Ground Fill | |
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| PCB Layer Stackup | |
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| One- and Two-Layer Boards | |
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| Multilayer Boards | |
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| General PCB Design Procedure | |
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| Summary | |
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| Problems | |
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| References | |
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| Further Reading | |
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| Mixed-Signal PCB Layout | |
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| Split Ground Planes | |
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| Microstrip Ground Plane Current Distribution | |
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| Analog and Digital Ground Pins | |
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| When Should Split Ground Planes Be Used? | |
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| Mixed Signal ICs | |
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| Multi-Board Systems | |
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| High-Resolution A/D and D/A Converters | |
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| Stripline | |
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| Asymmetric Stripline | |
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| Isolated Analog and Digital Ground Planes | |
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| A/D and D/A Converter Support Circuitry | |
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| Sampling Clocks | |
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| Mixed-Signal Support Circuitry | |
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| Vertical Isolation | |
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| Mixed-Signal Power Distribution | |
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| Power Distribution | |
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| Decoupling | |
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| The IPC Problem | |
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| Summary | |
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| Problems | |
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| References | |
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| Further Reading | |
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| Precompliance EMC Measurements | |
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| Test Environment | |
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| Antennas Versus Probes | |
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| Common-Mode Currents on Cables | |
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| Test Procedure | |
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| Cautions | |
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| Near Field Measurements | |
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| Test Procedure | |
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| Cautions | |
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| Seams and Apertures in Enclosures | |
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| Noise Voltage Measurements | |
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| Balanced Differential Probe | |
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| DC to 1-GHz Probe | |
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| Cautions | |
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| Conducted Emission Testing | |
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| Test Procedure | |
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| Cautions | |
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| Separating C-M from D-M Noise | |
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| Spectrum Analyzers | |
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| Detector Functions | |
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| General Test Procedure | |
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| EMC Crash Cart | |
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| Mitigation Parts List | |
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| One-Meter Radiated Emission Measurements | |
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| Test Environment | |
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| Limits for 1-m Testing | |
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| Antennas for 1-m Testing | |
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| Precompliance Immunity Testing | |
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| Radiated Immunity | |
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| Conducted Immunity | |
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| Transient Immunity | |
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| Precompliance Power Quality Tests | |
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| Harmonics | |
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| Flicker | |
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| Margin | |
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| Radiated Emission Margin | |
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| Electrostatic Discharge Margin | |
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| Summary | |
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| Problems | |
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| References | |
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| Further Reading | |
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| Appendix | |
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| The Decibel | |
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| Properties of Logarithms | |
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| Using the Decibel for Other than Power Measurements | |
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| Power Loss or Negative Power Gain | |
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| Absolute Power Level | |
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| Summing Powers Expressed in Decibels | |
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| The Ten Best Ways to Maximize the Emission from Your Product | |
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| Multiple Reflections of Magnetic Fields in Thin Shields | |
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| Dipoles for Dummies | |
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| Basic Dipoles for Dummies | |
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| Intermediate Dipoles for Dummies | |
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| Advanced Dipoles for Dummies | |
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| Impedance of a Dipole | |
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| Dipole Resonance | |
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| Receiving Dipole | |
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| Theory of Images | |
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| Dipole Arrays | |
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| Very High-Frequency Dipoles | |
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| Summary | |
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| Further Reading | |
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| Partial Inductance | |
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| Inductance | |
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| Loop Inductance | |
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| Inductance of a Rectangular Loop | |
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| Partial Inductance | |
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| Partial Self-Inductance | |
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| Partial Mutual Inductance | |
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| Net Partial-Inductance | |
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| Partial Inductance Applications | |
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| Transmission Line Example | |
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| Ground Plane Inductance Measurement Test Setup | |
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| Inductance Notation | |
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| Summary | |
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| References | |
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| Further Reading | |
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| Answers to Problems | |
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| Index | |