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| Foreword | |
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| Preface | |
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| Acknowledgments | |
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| The Framework | |
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| Introduction | |
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| Background and Definitions | |
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| Finding Your Way | |
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| The Importance of Materials | |
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| The Importance of Manufacturing Processes | |
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| The Importance of Industry Infrastructure | |
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| Decision-Making as a Process | |
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| Overall Prospects for MCMs | |
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| MCM Package Selection: A Materials and Manufacturing Perspective | |
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| Package Body and Substrate Base Choices | |
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| Signal Interconnect and MCM Substrate Choices | |
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| Chip Mounting Choices | |
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| Module Level Connection Choices | |
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| Global Materials and Manufacturing Considerations | |
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| Module Design Examples | |
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| Future Trends in MCM Materials Manufacturing | |
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| MCM Package Selection: A Systems Need Perspective | |
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| System Design Process | |
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| The Packaging Hierarchy | |
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| Packaging Performance Factors | |
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| Packaging Cost Factors | |
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| Packaging Decisions and the System Design Process | |
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| Determining System Requirements and Goals | |
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| Determining and Evaluating Packaging Alternatives | |
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| Impact of Semiconductor Technology | |
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| Example of the System Design Process | |
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| MCM Package Selection: Cost Issues | |
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| Techniques for Cost Analysis | |
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| Technical Cost Modeling | |
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| Results of Technical Cost Modeling | |
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| Applications to Substrate Selection | |
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| Design Activity-Based Cost Modeling | |
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| The Basics | |
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| Laminate-Based Technologies for Multichip Modules | |
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| Standard MCM-L Construction Process | |
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| Material Considerations | |
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| Flexible ("Flex") Circuits | |
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| Advanced MCM-L Material and Process Technology | |
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| IC Connection and Repair: Laminate Implications | |
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| Versions of Assembled MCM-L Systems | |
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| MCM-L Extendibility and Cost Issues | |
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| Thick Film and Ceramic Technologies for Hybrid Multichip Modules | |
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| Material Considerations | |
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| Processing | |
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| Design Rules | |
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| Applications | |
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| Future Trends | |
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| Engineering Choices | |
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| Thin Film Multilayer Interconnection Technologies for Multichip Modules | |
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| Characteristics, Benefits of TFML Interconnections | |
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| Materials for Thin Film Interconnection Systems | |
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| Thin Film Multilayer Processing | |
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| Design Strategies for Thin Film Interconnections | |
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| Applications, Growth of Thin Film Interconnections | |
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| Selection Criteria For Multichip Module Dielectrics | |
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| Behavior and Function of Dielectrics | |
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| Multilevel Thin Film Structures | |
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| Polymer Properties | |
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| Polymer Materials | |
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| Chip-to-Substrate (First Level) Connection Technology Options | |
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| Die Bonding and Physical Attachment | |
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| Wire Bonding | |
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| Tape Automated Bonding | |
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| Flip Chip Connection Technology | |
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| Flip Chip Solder Bump (FCSB) Technology: An Example | |
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| MCM-to-Printed Wiring Board (Second Level) Connection Technology Options | |
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| Basic Issues Affecting Connection Choice | |
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| Basic Approaches to MCM Level Two Connections | |
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| Standards Activities | |
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| Electrical Design of Digital Multichip Modules | |
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| Delay and Noise in Digital Design | |
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| Propagation Delay and Reflection Noise | |
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| Crosstalk Noise | |
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| Simultaneous Switching Noise | |
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| Other Sources of Noise | |
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| The Electrical Design Process | |
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| Thermal Design Considerations for Multichip Module Applications | |
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| Thermal Management | |
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| Thermal Phenomena in Electronic Enclosures | |
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| Thermal Management of MCMs | |
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| Tools for Thermal Design | |
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| Electrical Testing of Multichip Modules | |
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| Substrate Test | |
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| IC Test | |
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| Assembled Module Test | |
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| Case Studies | |
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| The Development of Unisys Multichip Modules | |
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| The Driving Forces Behind Multichip Packaging | |
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| Advances in Silicon Delay Multichip Modules | |
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| Single Chip Packages have Limitations | |
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| Basic Packaging Goals | |
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| Multichip Module Development Process | |
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| Unisys Multichip Module Implementations | |
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| Multichip Module Industry Issues | |
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| High Performance Aerospace Multichip Module Technology Development at Hughes | |
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| MCMs Meet the Needs of Systems Evolution | |
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| New Packaging Roles | |
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| Developing Two Key MCM Technologies | |
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| Comprehensive Design/Manufacturing Services | |
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| Silicon-Based Multichip Modules | |
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| Materials | |
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| MCM Examples | |
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| The Technology and Manufacture of the VAX-9000 Multichip Unit | |
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| MCM System Perspective | |
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| VAX-9000 MCU Development | |
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| VAX-9000 MCU Technology | |
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| VAX-9000 MCU Manufacturing | |
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| Future Evolution of MCM Technology | |
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| Closing the Loop | |
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| Complementing Technologies for MCM Success | |
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| Separable Connectors and the Packaging Hierarchy | |
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| Effect of Semiconductor Type on Package Design | |
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| System Performance Level (Cycle Time) | |
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| Level of Chip Integration, Function Size and Chip I/O | |
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| Chip Joining Interface, Burn-in, Testability and Repair | |
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| Power Density and Cooling Methods | |
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| Timeliness of Introduction | |
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| Alternatives to MCMs | |
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| Inexpensive, Low Complexity MCMs | |
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| Epilogue | |
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| About the Authors | |
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| Index | |