Introduction to Microelectronic Fabrication

ISBN-10: 0201444941
ISBN-13: 9780201444940
Edition: 2nd 2002 (Revised)
List price: $98.00 Buy it from $47.18
This item qualifies for FREE shipping

*A minimum purchase of $35 is required. Shipping is provided via FedEx SmartPost® and FedEx Express Saver®. Average delivery time is 1 – 5 business days, but is not guaranteed in that timeframe. Also allow 1 - 2 days for processing. Free shipping is eligible only in the continental United States and excludes Hawaii, Alaska and Puerto Rico. FedEx service marks used by permission."Marketplace" orders are not eligible for free or discounted shipping.

30 day, 100% satisfaction guarantee

If an item you ordered from TextbookRush does not meet your expectations due to an error on our part, simply fill out a return request and then return it by mail within 30 days of ordering it for a full refund of item cost.

Learn more about our returns policy

Description: For courses in Theory and Fabrication of Integrated Circuits. The author's goal in writing this text was to present a concise survey of the most up-to-date techniques in the field. It is devoted exclusively to processing, and is highlighted by  More...

New Starting from $95.28
what's this?
Rush Rewards U
Members Receive:
coins
coins
You have reached 400 XP and carrot coins. That is the daily max!
You could win $10,000

Get an entry for every item you buy, rent, or sell.

Study Briefs

Limited time offer: Get the first one free! (?)

All the information you need in one place! Each Study Brief is a summary of one specific subject; facts, figures, and explanations to help you learn faster.

Add to cart
Study Briefs
History of Western Art Online content $4.95 $1.99
Add to cart
Study Briefs
History of World Philosophies Online content $4.95 $1.99
Add to cart
Study Briefs
American History Volume 1 Online content $4.95 $1.99
Add to cart
Study Briefs
History of Western Music Online content $4.95 $1.99

Customers also bought

Loading
Loading
Loading
Loading
Loading
Loading
Loading
Loading
Loading
Loading

Book details

List price: $98.00
Edition: 2nd
Copyright year: 2002
Publisher: Prentice Hall PTR
Publication date: 10/17/2001
Binding: Paperback
Pages: 316
Size: 7.00" wide x 9.00" long x 0.50" tall
Weight: 1.034
Language: English

For courses in Theory and Fabrication of Integrated Circuits. The author's goal in writing this text was to present a concise survey of the most up-to-date techniques in the field. It is devoted exclusively to processing, and is highlighted by careful explanations, clear, simple language, and numerous fully-solved example problems. This work assumes a minimal knowledge of integrated circuits and of terminal behavior of electronic components such as resistors, diodes, and MOS and bipolar transistors.

Preface
An Overview of Microelectronic Fabrication
A Historical Perspective
An Overview of Monolithic Fabrication Processes and Structures
Metal-Oxide-Semiconductor (MOS) Processes
Basic Bipolar Processing
Safety
Lithography
The Photolithographic Process
Etching Techniques
Photomask Fabrication
Exposure Systems
Exposure Sources
Optical and Electron Microscopy
Further Reading
Thermal Oxidation of Silicon
The Oxidation Process
Modeling Oxidation
Factors Influencing Oxidation Rate
Dopant Redistribution During Oxidation
Masking Properties of Silicon Dioxide
Technology of Oxidation
Oxide Quality
Selective Oxidation and Shallow Trench Formation
Oxide Thickness Characterization
Process Simulation
Diffusion
The Diffusion Process
Mathematical Model for Diffusion
The Diffusion Coefficient
Successive Diffusions
Solid-Solubility Limits
Junction Formation and Characterization
Sheet Resistance
Generation-Depth and Impurity Profile Measurement
Diffusion Simulation
Diffusion Systems
Gettering
Ion Implantation
Implantation Technology
Mathematical Model for Ion Implantation
Selective Implantation
Junction Depth and Sheet Resistance
Channeling, Lattice Damage, and Annealing
Shallow Implantation
Source Listing
Film Deposition
Evaporation
Sputtering
Chemical Vapor Deposition
Epitaxy
Further Reading
Interconnections and Contacts
Interconnections in Integrated Circuits
Metal Interconnections and Contact Technology
Diffused Interconnections
Polysilicon Interconnections and Buried Contacts
Silicides and Multilayer-Contact Technology
The Liftoff Process
Multilevel Metallization
Copper Interconnects and Damascene Processes
Further Reading
Packaging and Yield
Testing
Wafer Thinning and Die Separation
Die Attachment
Wire Bonding
Packages
Flip-Chip and Tape-Automated-Bonding Processes
Yield
Further Reading
MOS Process Integration
Basic MOS Device Considerations
MOS Transistor Layout and Design Rules
Complementary MOS (CMOS) Technology
Silicon on Insulator
Bipolar Process Integration
The Junction-Isolated Structure
Current Gain
Transit Time
Basewidth
Breakdown Voltages
Other Elements in SBC Technology
Layout Considerations
Advanced Bipolar Structures
Other Bipolar Isolation Techniques
BICMOS
Processes for Microelectromechanical Systems—MEMS
Mechanical Properties of Silicon
Bulk Micromachining
Silicon Etchants
Surface Micromachining
High-Aspect-Ratio Micromachining: The LIGA Molding Process
Silicon Wafer Bonding
IC Process Compatibility
Answers to Selected Problems
Index

×
Free shipping on orders over $35*

*A minimum purchase of $35 is required. Shipping is provided via FedEx SmartPost® and FedEx Express Saver®. Average delivery time is 1 – 5 business days, but is not guaranteed in that timeframe. Also allow 1 - 2 days for processing. Free shipping is eligible only in the continental United States and excludes Hawaii, Alaska and Puerto Rico. FedEx service marks used by permission."Marketplace" orders are not eligible for free or discounted shipping.

Learn more about the TextbookRush Marketplace.

×