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Preface | |
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Fundamentals | |
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Frequency and Time | |
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Time and Distance | |
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Lumped Versus Distributed Systems | |
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A Note About 3 dB and RMS Frequencies | |
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Four Kinds of Reactance | |
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Ordinary Capacitance | |
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Ordinary Inductance | |
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A Better Method for Estimating Decay Time | |
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Mutual Capacitance | |
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Mutual Inductance | |
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High-Speed Properties of Logic Gates | |
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Historical Development of a Very Old Digital Technology | |
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Power | |
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Speed | |
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Packaging | |
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Measurement Techniques | |
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Rise Time and Bandwidth of Oscilloscope Probes | |
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Self-inductance of a Probe Group Loop | |
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Spurious Signal Pickup from Probe Ground Loops | |
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How Probes Load Down a Circuit | |
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Special Probing Fixtures | |
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Avoiding Pickup from Probe Shield Currents | |
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Viewing a Serial Data Transmission System | |
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Slowing Down the System Clock | |
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Observing Crosstalk | |
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Measuring Operating Margins | |
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Observing Metastable States | |
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Transmission Lines | |
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Shortcomings of Ordinary Point-to-Point Wiring | |
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Infinite Uniform Transmission Line | |
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Effects of Source and Load Impedance | |
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Special Transmission Line Cases | |
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Line Impedance and Propagation Delay | |
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Ground Planes and Layer Stacking | |
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High-Speed Current Follows the Path of Least Inductance | |
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Crosstalk in Solid Ground Planes | |
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Crosstalk in Slotted Ground Planes | |
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Crosstalk in Cross-Hatched Ground Planes | |
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Crosstalk with Power and Ground Fingers | |
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Guard Traces | |
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Near-End and Far-End Crosstalk | |
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How to Stack Printed Circuit Board Layers | |
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Terminations | |
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End Terminators | |
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Source Terminators | |
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Middle Terminators | |
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AC Biasing for End Terminators | |
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Resistor Selection | |
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Crosstalk in Terminators | |
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Vias | |
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Mechanical Properties of Vias | |
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Capacitance of Vias | |
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Inductance of Vias | |
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Return Current and Its Relation to Vias | |
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Power Systems | |
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Providing a Stable Voltage Reference | |
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Distributing Uniform Voltage | |
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Everyday Distribution Problems | |
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Choosing a Bypass Capacitor | |
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Connectors | |
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Mutual Inductance - How Connectors Create Crosstalk | |
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Series Inductance - How Connectors Create EMI | |
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Parasitic Capacitance - Using Connectors on a Multidrop Bus | |
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Measuring Coupling in a Connector | |
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Continuity of Ground Underneath a Connector | |
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Fixing EMI Problems with External Connections | |
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Special Connectors for High-Speed Applications | |
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Differential Signaling Through a Connector | |
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Power Handling Features of Connectors | |
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Ribbon Cables | |
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Ribbon Cable Signal Propagation | |
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Ribbon Cable Crosstalk | |
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Ribbon Cable Connectors | |
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Ribbon Cable EMI | |
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Clock Distribution | |
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Timing Margin | |
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Clock Skew | |
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Using Low-Impedance Drivers | |
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Using Low-Impedance Clock Distribution Lines | |
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Source Termination of Multiple Clock Lines | |
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Controlling Crosstalk on Clock Lines | |
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Delay Adjustments | |
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Differential Distribution | |
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Clock Signal Duty Cycle | |
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Canceling Parasitic Capacitance of a Clock Repeater | |
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Decoupling Clock Receivers from the Clock Bus | |
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Clock Oscillators | |
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Using Canned Clock Oscillators | |
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Clock Jitter | |
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Collected References | |
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A Points to Remember | |
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B Calculation of Rise Time | |
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C MathCad Formulas | |
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Index | |