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Preface to Second Edition | |
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Preface to First Edition | |
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Note to Instructors | |
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About the Author | |
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Notational Conventions | |
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Introduction | |
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Preview | |
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The History of MEMS Development | |
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From the Beginning to 1990 | |
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From 1990 to 2001 | |
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2002 to present | |
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Future Trends | |
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The Intrinsic Characteristics of MEMS | |
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Miniaturization | |
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Microelectronics Integration | |
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Parallel Fabrication with Precision | |
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Devices: Sensors and Actuators | |
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Energy Domains and Transducers | |
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Sensors Considerations | |
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Sensor Noise and Design Complexity | |
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Actuators Considerations | |
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Summary | |
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Problems | |
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References | |
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First-Pass Introduction to Microfabrication | |
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Preview | |
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Overview of Microfabrication | |
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Essential Overview of Frequently Used Microfabrication Processes | |
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Photolithography | |
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Thin film deposition | |
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Thermal oxidation of silicon | |
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Wet Etching | |
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Silicon anisotropic etching | |
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Plasma etching and reactive ion etching | |
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Doping | |
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Wafer dicing | |
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Wafer bonding | |
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The Microelectronics Fabrication Process Flow | |
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Silicon-based MEMS Processes | |
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Packaging and Integration | |
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Integration Options | |
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Encapsulation | |
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New Materials and Fabrication Processes | |
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Process Selection and Design | |
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Points of Consideration for Deposition Processes | |
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Points of Consideration for Etching Processes | |
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Ideal Rules for Building a Process Flow | |
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Rules for Building a Robust Process | |
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Summary | |
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Problems | |
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References | |
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Review of Essential Electrical and Mechanical Concepts | |
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Preview | |
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Conductivity of Semiconductors | |
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Semiconductor Materials | |
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Calculation of Charge Carrier Concentration | |
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Conductivity and Resistivity | |
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Crystal Planes and Orientations | |
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Stress and Strain | |
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Internal Force Analysis: Newton's Laws of Motion | |
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Definitions of Stress and Strain | |
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General Scalar Relation between Tensile Stress and Strain | |
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Mechanical Properties of Silicon and Related Thin Films | |
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General Stress Strain Relations | |
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Flexural Beam Bending Analysis under Simple Loading Conditions | |
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Types of Beams | |
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Longitudinal Strain under Pure Bending | |
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Deflection of Beams | |
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Finding the Spring Constants | |
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Torsional Deflections | |
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Intrinsic Stress | |
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Dynamic System, Resonant Frequency, and Quality Factor | |
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Dynamic System and Governing Equation | |
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Response under Sinusoidal Resonant Input | |
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Damping and Quality Factor | |
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Resonant Frequency and Bandwidth | |
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Active Tuning of Spring Constant and Resonant Frequency | |
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A List of Suggested Courses and Books | |
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Summary | |
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Problems | |
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References | |
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Electrostatic Sensing and Actuation | |
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Preview | |
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Introduction to Electrostatic Sensors and Actuators | |
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Parallel Plate Capacitor | |
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Capacitance of Parallel Plates | |
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Equilibrium Position of Electrostatic Actuator under Bias | |
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Pull-in Effect of Parallel-Plate Actuators | |
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Applications of Parallel-Plate Capacitors | |
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Inertia Sensor | |
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Pressure Sensor | |
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Flow Sensor | |
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Tactile sensor | |
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Parallel-plate actuators | |
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Interdigitated Finger Capacitors | |
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Applications of Comb-Drive Devices | |
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Inertia Sensors | |
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Actuators | |
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Summary | |
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Problems | |
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References | |
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Thermal Sensing and Actuation | |
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Preview | |
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Introduction | |
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Thermal Sensors | |
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Thermal Actuators | |
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Fundamentals of Thermal Transfer | |
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Sensors and Actuators Based on Thermal Expansion | |
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Thermal Bimorph Principle | |
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Thermal Actuators with a Single Material | |
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Thermal Couples | |
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Thermal Resistors | |
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Applications | |
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Inertia Sensors | |
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Flow Sensors | |
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Infrared Sensors | |
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Other Sensors | |
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Summary | |
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Problems | |
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References | |
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Piezoresistive Sensors | |
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Preview | |
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Origin and Expression of Piezoresistivity | |
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Piezoresistive Sensor Materials | |
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Metal Strain Gauges | |
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Single Crystal Silicon | |
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Polycrystalline Silicon | |
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Stress Analysis of Mechanical Elements | |
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Stress in Flexural Cantilevers | |
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Stress and Deformation in Membrane | |
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Applications of Piezoresistive Sensors | |
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Inertial Sensors | |
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Pressure Sensors | |
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Tactile sensor | |
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Flow sensor | |
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Summary | |
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Problems | |
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References | |
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Piezoelectric Sensing and Actuation | |
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Preview | |
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Introduction | |
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Background | |
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Mathematical description of piezoelectric effects | |
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Cantilever piezoelectric actuator model | |
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Properties of Piezoelectric Materials | |
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Quartz | |
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PZT | |
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PVDF | |
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ZnO | |
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Other Materials | |
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Applications | |
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Inertia Sensors | |
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Acoustic Sensors | |
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Tactile Sensors | |
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Flow Sensors | |
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Surface Elastic Waves | |
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Summary | |
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Problems | |
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References | |
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Magnetic Actuation | |
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Preview | |
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Essential Concepts and Principles | |
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Magnetization and Nomenclatures | |
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Selected Principles of Micro Magnetic Actuators | |
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Fabrication of Micro Magnetic Components | |
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Deposition of Magnetic Materials | |
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Design and Fabrication of Magnetic Coil | |
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Case Studies of MEMS Magnetic Actuators | |
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Summary | |
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Problems | |
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References | |
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Summary of Sensing and Actuation Methods | |
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Preview | |
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Comparison of Major Sensing and Actuation Methods | |
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Other Sensing and Actuation Methods | |
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Tunneling Sensing | |
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Optical Sensing | |
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Field Effect Transistors | |
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Radio Frequency Resonance Sensing | |
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Summary | |
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Problems | |
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References | |
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Bulk Micromachining and Silicon Anisotropic Etching | |
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Preview | |
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Introduction | |
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Anisotropic Wet Etching | |
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Introduction | |
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Rules of Anisotropic Etching���Simplest Case | |
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Rules of Anisotropic Etching���Complex Structures | |
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Forming Protrusions | |
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Interaction of Etching Profiles from Isolated Patterns | |
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Summary of design methodology | |
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Chemicals for Wet Anisotropic Etching | |
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Dry Etching and Deep Reactive Ion Etching | |
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Isotropic Wet Etching | |
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Gas Phase Etchants | |
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Native Oxide | |
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Special Wafers and Techniques | |
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Summary | |
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Problems | |
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References | |
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Surface Micromachining | |
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Preview | |
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Basic Surface Micromachining Processes | |
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Sacrificial Etching Process | |
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Micro Motor Fabrication Process���A First Pass | |
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Micro Motor Fabrication Process���A Second Pass | |
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Micro Motor Fabrication Process���Third Pass | |
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Structural and Sacrificial Materials | |
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Material Selection Criteria for a Two-layer Process | |
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Thin Films by Low Pressure Chemical Vapor Deposition | |
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Other Surface Micromachining Materials and Processes | |
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Acceleration of Sacrificial Etch | |
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Stiction and Anti-stiction Methods | |
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Summary | |
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Problems | |
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References | |
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Process Synthesis: Putting It all Together | |
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Preview | |
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Process for Suspension Beams | |
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Process for Membranes | |
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Process for Cantilevers | |
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SPM Technologies Case Motivation | |
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General Fabrication Methods for Tips | |
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Cantilevers with Integrated Tips | |
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Cantilevers with Integrated Sensors | |
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SPM Probes with Actuators | |
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Practical Factors Affecting Yield of MEMS | |
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Summary | |
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Problems | |
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References | |
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Polymer MEMS | |
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Preview | |
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Introduction | |
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Polymers in MEMS | |
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Polyimide | |
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SU-8 | |
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Liquid Crystal Polymer (LCP) | |
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PDMS | |
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PMMA | |
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Parylene | |
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Fluorocarbon | |
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Other Polymers | |
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Representative Applications | |
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Acceleration Sensors | |
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Pressure Sensors | |
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Flow sensors | |
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Tactile Sensors | |
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Summary | |
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Problems | |
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Reference | |
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Micro Fluidics Applications | |
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Preview | |
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Motivation for Microfluidics | |
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Essential Biology Concepts | |
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Basic Fluid Mechanics Concepts | |
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The Reynolds Number and Viscosity | |
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Methods for Fluid Movement in Channels | |
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Pressure Driven Flow | |
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Electrokinetic Flow | |
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Electrophoresis and Dielectrophoresis | |
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Design and Fabrication of Selective Components | |
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Channels | |
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Valves | |
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Summary | |
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Problems | |
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References | |
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Case Studies of Selected MEMS Products | |
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Preview | |
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Case Studies: Blood Pressure (BP) Sensor | |
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Background and History | |
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Device Design Considerations | |
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Commercial Case: NovaSensor BP Sensor | |
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Case Studies: Microphone | |
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Background and History | |
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Design Considerations | |
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Commercial Case: Knowles Microphone | |
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Case Studies: Acceleration Sensors | |
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Background and History | |
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Design Considerations | |
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Commercial Case: Analog Devices and MEMSIC | |
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Case Studies: Gyros | |
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Background and History | |
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The Coriolis Force | |
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MEMS Gyro Design | |
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Single Axis Gyro Dynamics | |
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Commercial Case: InvenSense Gyro | |
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Summary of Top Concerns for MEMS Product Development | |
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Performance and Accuracy | |
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Repeatability and Reliability | |
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Managing the Cost of MEMS Products | |
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Market Uncertainties, Investment, and Competition | |
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Summary | |
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Problems | |
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References | |
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Characteristics of selected MEMS material | |
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Frequently Used Formula for Beams, Cantilevers, and Plates | |
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Basic Tools for Dealing with a Mechanical Second-order Dynamic System | |
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Most Commonly Encountered Materials | |
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Most Commonly Encountered Material Removal Process Steps | |
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A List of General Compatibility between General Materials and Processes | |
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Comparison of Commercial Inertial Sensors | |
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Answers to selected problems | |
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Index | |