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Materials Science of Thin Films Deposition and Structure

ISBN-10: 0123756669
ISBN-13: 9780123756664
Edition: 3rd 2014
List price: $55.99
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Description: This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of  More...

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Book details

List price: $55.99
Edition: 3rd
Copyright year: 2014
Publisher: Elsevier Science & Technology
Publication date: 10/27/2013
Binding: Hardcover
Pages: 864
Language: English

This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field.Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition brought the book up-to-date with regard to these advances. The third edition will be fully updated to reflect new developments in thin film science, and will be revised by Daniel Gall, noted thin films researcher and professor at RPI.*Best-selling, most authoritative textbook on thin films*Contains extensive tables, figures and recent references related to thin film science and technology*Treats both chemical and physical vapor deposition of thin films*Includes fully updated figures, many new examples and end-of-chapter problems*Online instructor support includes solutions manual and PowerPoint slides

Dr. Milton Ohring, author of two previously acclaimed Academic Press books,The Materials Science of Thin Films (l992) and Engineering Materials Science (1995), has taught courses on reliability and failure in electronics at Bell Laboratories (AT&T and Lucent Technologies). From this perspective and the well-written tutorial style of the book, the reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices; acquire skills in the mathematical handling of reliability data; and better appreciate future technology trends and the reliability issues they raise.

Dr. Milton Ohring, author of two previously acclaimed Academic Press books,The Materials Science of Thin Films (l992) and Engineering Materials Science (1995), has taught courses on reliability and failure in electronics at Bell Laboratories (AT&T and Lucent Technologies). From this perspective and the well-written tutorial style of the book, the reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices; acquire skills in the mathematical handling of reliability data; and better appreciate future technology trends and the reliability issues they raise.Professor Daniel Gall holds an associate professor position in the Materials Science and Engineering Department at the Rensselaer Polytechnic Institute. He received his Diploma from the University of Basel, Switzerland, in 1994, and his Ph.D. from the University of Illinois at Urbana-Champaign in 2000. Prof. Gall has been a Visiting Scientist at the Frederick Seitz Materials Research Laboratory, Illinois, has served as Assistant Editor and Editorial Board Member for Thin Solid Films, and as Associate Editor for the Journal of Vacuum Science and Technology A. He is the chair-elect of the AVS Advanced Surface Engineering Division and serves as session, symposium, and program chair and as proceedings editor for the International Conference for Metallurgical Coatings and Thin Films and the AVS International Symposium.Prof. Gall's research focuses on the development of an atomistic understanding for thin film growth, with particular interest in transition-metal nitride coatings, ion-surface interactions, and glancing angle deposition. He has pioneered a multiple length-scale approach to explain texture evolution in hard-coatings, has shown how low-energy ion-irradiation can be employed to control surface diffusion processes and resulting microstructures, and has developed a variety of uniquely shaped nanostructure architectures by exploiting atomic shadowing effects during physical vapor deposition. His research on novel transition-metal nitrides was identified as one of "the 100 most important scientific discoveries during the past two and a half decades, supported by the US Department of Energy's Office of Science". He also won the 2006 Alfred H. Geisler Memorial Award for "Outstanding Contributions in Education and Thin Film Growth Research," the Faculty Early Career Development (CAREER) Award from the National Science Foundation, the 2007 Outstanding Research Award from the Rensselaer School of Engineering, the 2008 Early Career Award for "Excellence in Educat

A Historical Perspective
A Review of Materials Science
Introduction
Structure
Defects in Solids
Bonds and Bands in Materials
Thermodynamics of Materials
Kinetics
Nucleation
An Introduction to Mechanical Behavior
Conclusion
Vacuum Science and Technology
Introduction
Kinetic Theory of Gases
Gas Transport and Pumping
Vacuum Pumps
Vacuum Systems
Conclusion
Thin-Film Evaporation Processes
Introduction
The Physics and Chemistry of Evaporation
Film Thickness Uniformity and Purity
Evaporation Hardware
Evaporation Processes and Applications
Conclusion
Discharges, Plasmas, and Ion-Surface Interactions
Introduction
Plasmas, Discharges, and Arcs
Fundamentals of Plasma Physics
Reactions in Plasmas
Physics of Sputtering
Ion Bombardment Modification of Growing Films
Conclusion
Plasma and Ion Beam Processing of Thin Films
Introduction
DC, AC, and Reactive Sputtering Processes
Magnetron Sputtering
Plasma Etching
Hybrid and Modified PVD Processes
Conclusion
Chemical Vapor Deposition
Introduction
Reaction Types
Thermodynamics of CVD
Gas Transport
Film Growth Kinetics
Thermal CVD Processes
Plasma-Enhanced CVD Processes
Some CVD Materials Issues
Safety
Conclusion
Substrate Surfaces and Thin-Film Nucleation
Introduction
An Atomic View of Substrate Surfaces
Thermodynamic Aspects of Nucleation
Kinetic Processes in Nucleation and Growth
Experimental Studies of Nucleation and Growth
Conclusion
Epitaxy
Introduction
Manifestations of Epitaxy
Lattice Misfit and Defects in Epitaxial Films
Epitaxy of Compound Semiconductors
High-Temperature Methods for Depositing Epitaxial Semiconductor Films
Low-Temperature Methods for Depositing Epitaxial Semiconductor Films
Mechanisms and Characterization of Epitaxial Film Growth
Conclusion
Film Structure
Introduction
Structural Morphology of Deposited Films and Coatings
Computational Simulations of Film Structure
Grain Growth, Texture, and Microstructure Control in Thin Films
Constrained Film Structures
Amorphous Thin Films
Conclusion
Characterization of Thin Films and Surfaces
Introduction
Film Thickness
Structural Characterization of Films and Surfaces
Chemical Characterization of Surfaces and Films
Conclusion
Interdiffusion, Reactions, and Transformations in Thin Films
Introduction
Fundamentals of Diffusion
Interdiffusion in Thin Metal Films
Compound Formation and Phase Transformations in Thin Films
Metal-Semiconductor Reactions
Mass Transport in Thin Films under Large Driving Forces
Conclusion
Mechanical Properties of Thin Films
Introduction
Mechanical Testing and Strength of Thin Films
Analysis of Internal Stress
Techniques for Measuring Internal Stress in Films
Internal Stresses in Thin Films and Their Causes
Mechanical Relaxation Effects in Stressed Films
Adhesion
Conclusion

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