MEMS/MOEM Packaging Concepts, Designs, Materials and Processes

Name: MEMS/MOEM Packaging Concepts, Designs, Materials and Processes
Price: 12.5 USD
Availability: InStock
ISBN: 9780071455565

ISBN-10: 0071455566

ISBN-13: 9780071455565

Edition: 2006

Authors: Ken Gilleo

List price: $197.00

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Description:

While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS,…

Book details

List price: $197.00
Copyright year: 2006
Publisher: McGraw-Hill Education
Publication date: 8/1/2005
Binding: Hardcover
Pages: 240
Size: 6.20" wide x 9.30" long x 0.88" tall
Weight: 1.078
Language: English



Preface



Engineering Fundamentals of MEMS and MOEMS Electronic Packaging



The Package as the Vital Bridge



Packaging Challenges



Multiple Functions



Package Types



Reliability and Qualification



Summary



Principles, Materials, and Fabrication of MEMS and MOEMS Devices



Definitions and Classifications



Basic Principles



Sensing



MEMS Sensor Principles



Motion Actuation



MEMS "Engines"



CAD Structure Library; Building Blocks



MEMS Devices



Optical-MEMS; MOEMS



Intelligent MEMS



MEMS Applications



MOEMS Devices -- MEMS Plus Light



Summary



MEMS and MOEMS Packaging Challenges and Strategies



Product-Specific Character of MEMS Packaging



MEMS General Packaging Requirements



Hermeticity: Levels, Evaluation Methods, and Requirements: Perceived vs. Actual



Cost versus Performance Tradeoffs



Emergence of Low-Cost Near-Hermetic Packaging



Manufacturing Process Comparisons



The Packaging MOEMS (Optical-MEMS) -- Additional Requirements



Packages for Materials Handling



NHP Beyond MEMS



MEMS Packaging Processes



Release Step



Singulation: Sawing and Protection



Capping Approaches



Die Attach



Wire Bonding



Flip Chip Methods



Tape Automated Bonding (TAB)



Selective Underfill and Encapsulation



Lid Sealing



Antistiction Processes



In-Process Handling



Applying In-Package Additives



Equipment



Testing



Reliability



Selecting the Right MEMS/MOEMS Package and Materials



Conclusions and Summary



MEMS Packaging Materials



The Process Determines the Materials



Joining Materials



Assembly Issues and Material Solutions



In-Package Additives



Conclusions



From MEMS and MOEMS to Nano Technology



Definitions are Important



Combining Nano and MEMS



Packaging Nano



Summary, Conclusions and the Future Bibliography Index