Area Array Package Design Techniques in High Density Electronics

Name: Area Array Package Design Techniques in High Density Electronics
Price: 53.4 USD
Availability: InStock
ISBN: 9780071428279

ISBN-10: 0071428275

ISBN-13: 9780071428279

Edition: 2004

Authors: Ken Gilleo

List price: $136.00

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Description:

Written by a team of noted professionals and academics in the field, this engineering reference covers new techniques in electronic packaging, including flip chip, BGA, and MEMs. High-density packaging and cleaning options are also covered.

Book details

List price: $136.00
Copyright year: 2004
Publisher: McGraw-Hill Professional Publishing
Publication date: 10/24/2003
Binding: Hardcover
Pages: 204
Size: 7.25" wide x 9.25" long x 0.75" tall
Weight: 1.298
Language: English

Preface
Introduction to Electronic Packaging
Trends/Drivers in the Electronics Manufacturing Industry
Area Array Packaging
Stacked/3D Packages
Compliant IC Packaging
Flip Chip Technology
Options in High-Density Part Cleaning
MEMS Packaging and Assembly Challenges
Ceramic Ball and Column Grid Array Overview
Index
Table of Contents provided by Publisher. All Rights Reserved.