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Flip Chip Technologies

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ISBN-10: 0070366098

ISBN-13: 9780070366091

Edition: 1996

Authors: John H. Lau

List price: $89.00
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Flip Chip has come to describe a group of related technologies that are used for connecting a chip to a substrate without the use of wires. This is a comprehensive reference that covers the design, engineering, and manufacturing of these packages.
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Book details

List price: $89.00
Copyright year: 1996
Publisher: McGraw-Hill Professional Publishing
Binding: Hardcover
Pages: 560
Size: 6.50" wide x 9.50" long x 1.00" tall
Weight: 1.892
Language: English

John Lau graduated with a first class honours in womenswear design at London College of Fashion and has a masters in enterprise. John has worked in various roles within the fashion industry and has experience as a fashion stylist and writer for the international magazines Loaded and the Chinese edition of Vogue. He has helped new brands develop their creative and business direction both in the UK, Hong Kong and China, and continues to have an active role in fashion as a consultant for retail, branding, production and distribution.John is currently a Senior Lecturer in International Fashion Business at Manchester Metropolitan University, teaching on the Fashion Buying and Clothing Design and…    

Introduction
Fluxes Flip Solder Jointing
Solder Bump FCT
Solder Bump FCT with Very Large Dies
Micro Solder Bump FCT on Silicon Technologies
Conductive Adhesive Polymer Materials
Anistropic Conductive Flip Chip-on-Glass Technology
FC Assembly with Compliant Bumps
FC Assembly on Rigid and Flexible Polymer Substrates Using TAB
A Compliant TAB Micro Ball Grid Array Technology
Wirebonding FCT for Multichip Modules
FC Mounting Using Stud Bumps and Adhesives for Encapsulation
Wire Interconnect Technology
Known Good Dies Assurance Technologies
Known Good Die Testing of FCT