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Study of Snagcu Alloy Reliability

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ISBN-10: 3639133277

ISBN-13: 9783639133271

Edition: 2009

Authors: Krishna Tunga

List price: $88.00
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Description:

This work aims to understand the reliability of SnAgCu solder interconnects used in PBGA packages using microstructure evolution, laser moire interferometry and finite-element modeling. A particle coarsening based microstructure evolution of the solder joint material during thermal excursions was studied for extended periods of time lasting for several months. The microstructure evolution and particle coarsening was quantified, and acceleration factors were determined between benign field-use conditions and ATC conditions for PBGA packages with different form factors and for two different lead-free solder alloys. A new technique using laser moire interferometry was developed to assess the…    
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Book details

List price: $88.00
Copyright year: 2009
Publisher: .AV Akademikerverlag GmbH & Co. KG
Binding: Paperback
Pages: 188
Size: 6.00" wide x 9.00" long x 0.43" tall
Weight: 0.638
Language: English

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